Package Outline Drawing

Plastic Packages for Integrated Circuits
Package Outline Drawing
Q64.10x10F
64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE WITH EXPOSED PAD (EP-TQFP)
Rev 1, 1/10
4
10.00
12.00
5
D 3
3
A
12.00
10.00
B
4
5
4.50±0.1
3
0.50
EXPOSED PAD
4X
0.20 C A-B D
4X
0.20 H A-B D
4.50±0.1
TOP VIEW
BOTTOM VIEW
11/13°
7
WITH LEAD FINISH
0.22 ±0.05
1.20 MAX
0.08 M C A-B D
0.05
/ / 0.10 C
C
0.08
SIDE VIEW
0.09/0.20
SEE DETAIL "A"
0.09/0.16
0° MIN.
0.20 ±0.03
H
BASE METAL
2
1.00 ±0.05
0.05/0.15
(10.00)
0.08
R. MIN.
0.20 MIN.
(0.28) TYP
DETAIL "A"
0.25
GAUGE
PLANE
0.60 ±0.15
0-7°
(1.00)
SCALE: NONE
NOTES:
1. All dimensioning and tolerancing conform to ANSI Y14.5-1982.
2. Datum plane H located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting line.
10.00
(4.50)
3. Datums A-B and D to be determined at centerline between
leads where leads exit plastic body at datum plane H.
4. Dimensions D1 and E1 do not include mold protrusion.
Allowable mold protrusion is 0.254mm on D1 and E1
dimensions.
5. These dimensions to be determined at datum plane H.
(1.50) TYP
(4.50)
TYPICAL RECOMMENDED LAND PATTERN
1
6. Package top dimensions are smaller than bottom dimensions
and top of package will not overhang bottom of package.
7. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm total in excess of the
b dimension at maximum material condition. Dambar cannot
be located on the lower radius or the foot.
8. Controlling dimension: millimeter.
9. This outline conforms to JEDEC publication 95 registration
MS-026, variation ACD.
10. Dimensions in ( ) are for reference only.