MX884 High-Side Current Monitor With 10-Bit Serial Digital Output INTEGRATED CIRCUITS DIVISION Features Description • • • • • • • The MX884 targets power management applications where high noise immunity and low cost are primary requirements. Its integrated 10-bit ADC provides high resolution, making it ideal for current monitoring systems. The MX884 enables digital power management, in which a microcontroller can readily monitor the current in a system, and perform other control functions in power systems and motion control products. 3V to 60V Operating Voltage Range Integrated 10-bit ADC 3-Wire Serial Interface Microcontroller Compatible Low Power Minimum External Components TSOT23 RoHS Compliant Package Applications • • • • • Lighting Management Current Shunt Measurement Remote Sensing Battery Monitoring Microprocessor Controlled Power Management Pb The MX884 converts a small voltage developed across an external current-sense resistor into a 10-bit digital output. It features a wide common mode input supply voltage range of 3V to 60V, and easily interfaces to most microcontrollers. The design is simple yet cost-effective, requiring very few external components, which makes it especially suitable for high volume applications. e3 Ordering Information Part Description MX884HTTR TSOT23 6-Lead, Tape & Reel (3,000/Reel) Functional Block Diagram RS LOAD IN I LOAD - + MX884 SDO 12 Bit ADC SCK CS GND DS-MX884-R01 www.ixysic.com 1 MX884 INTEGRATED CIRCUITS DIVISION 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 3 2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.ixysic.com 5 5 5 5 6 R01 MX884 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Package Pinout 1.2 Pin Description 1 6 2 5 3 Pin# Name Description 1 2 SCK GND Serial Clock 3 LOAD Load-Side Connection to the External Sense Resistor 4 IN 5 6 CS SDO Ground 4 Positive Supply Terminal and Power Connection for the External Sense Resistor Chip Select (Active Low) Serial Data Output (Open Drain) 1.3 Absolute Maximum Ratings Parameter IN Supply Voltage LOAD SCK, CS Input Voltage SDO Open Drain Pull-Up Voltage Operating Temperature Range Storage Temperature Range Symbol Min Max Units TA -40 70 70 6 6 +85 V V V V °C TSTG -55 +150 °C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Absolute maximum electrical ratings are at 25°C 1.4 DC Electrical Characteristics VIN=5V, TA=25°C. Parameter Operating Voltage Range (VIN) Supply Current Average A/D Reading Average A/D Reading Output Noise SCK Pulse Period SCK Pulse Width CS Pulse Period CS Falling to First SCK Rising Last SCK Falling to CS Rising SCK Falling to SDO Valid R01 Conditions Minimum Typical Maximum Units ILOAD=0 3 - 60 V - 0.25 - mA 10mV Sense Voltage 100mV Sense Voltage CS=10nF Parallel, RS=10 90 100 110 LSB 992 1000 1008 LSB High or Low SDO Falling SDO Rising - 1.5 - RMS LSB 5 - - s 200 - - ns 100 - - s 200 - - ns 100 - - ns - - 80 ns www.ixysic.com Depends on SDO R, C - 3 MX884 INTEGRATED CIRCUITS DIVISION 2 Functional Description The MX884 converts a small voltage developed across an external sense resistor (Rs) to a 10-bit digital output. Pin IN connects to the 3V to 60V power input. The external current sense resistor connects between pins IN and LOAD. The nominal A/D range is 100 mV V(IN)-V(LOAD) across Rs. The A/D least significant bit typically equals 0.1 mV across RS . Inputs CS and SCK are TTL-level compatible, 5.5V maximum input voltage. Inputs can be driven from CMOS microcontrollers operating at supply voltages of 2.4 to 5.5V. Serial data output pin SDO is configured as open drain, maximum 5.5V external pull-up. SCK is used internally to clock the successive approximation register of the A/D. Figure 1. Serial Timing Diagram Internal S/H CS SCK D9 SDO D8 D7 D6 D5 D4 D3 D2 D1 D0 Figure 2. Typical Application Circuit 0.1Ω Power Supply 10nF +3V 3 4 IN LOAD MX884 6 microcontroller 5 1 Load SDO CS SCK GND 2 Power Return 4 www.ixysic.com R01 MX884 INTEGRATED CIRCUITS DIVISION 3 Manufacturing Information 3.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating MX884HTTR MSL 3 3.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 3.3 Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Pb R01 Device Maximum Temperature x Time MX884HTTR 260°C for 30 seconds e3 www.ixysic.com 5 MX884 INTEGRATED CIRCUITS DIVISION 3.4 Mechanical Dimensions 3.4.1 TSOT23-6 Package Recommended PCB Land Pattern 0º / 8º 2.80 / 3.00 (0.110 / 0.118) 0.10 MIN (0.004 MIN) 6 2.60 / 3.00 (0.102 / 0.118) 0.37 MIN (0.015 MIN) 1.50 / 1.70 (0.059 / 0.067) 2.70 (0.106) 1.05 (0.041) 1 0.35 / 0.51 (0.014 / 0.020) 0.70 / 0.80 (0.028 / 0.031) 0.00 / 0.10 (0.000 / 0.004) 5º NOM 7º NOM 0.95 BSC (0.037 BSC) 0.60 (0.024) 0.95 (0.037) GAUGE PLANE 0.75 / 0.90 (0.030 / 0.035) 0.10 / 0.25 (0.004 / 0.010) 0.60 REF (0.0236 REF) 0.25 BSC (0.0098 BSC) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 1.90 BSC (0.095 BSC) Notes: (Unless otherwise specified) 1. Dimension “D” does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.10mm (0.004 inches) per side. 2. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.15mm (0.006 inches) per side. 3. Package top may be smaller than package bottom. Dimensions “D” and “E1” are determined at the outermost extreme of the plastic body excluding mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between top and bottom of the plastic body. 3.4.2 Tape & Reel Dimensions 178 DIA. (7.01 DIA.) P=4.0 ± 0.1 3.5 ± 0.05 (0.157 ± 0.004) (0.138 ± 0.002) 2.0 ± 0.05 1.75 ± 0.1 (0.079 ± 0.002)(0.069 ± 0.004) ø1.5 ± 0.1 (0.059 ± 0.004) Top Cover Tape Thickness 0.066 MAX. (0.003 MAX.) BO=3.2 ± 0.1 (0.126 ± 0.004) Embossed Carrier K0=1.956 MAX. (0.077 MAX.) P=4.0 ± 0.1 (0.157 ± 0.004) AO=3.2 ± 0.1 (0.126 ± 0.004) Embossment NOTES: 1. 10 sprocket hole pitch cumulative tolerance ±0.2 2. Camber not to exceed 1mm in 100mm 3. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole 4. (S.R. Ohm/Sq.) means surface electric resistivity of the carrier tape. ø1.1 ± 0.1 (0.043 ± 0.004) W=8.0 ± 0.2 (0.315 ± 0.008) Dimensions mm (inches) For additional information please visit www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-MX884-R01 ©Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012 6 www.ixysic.com R01