MX887D Power Hall-Effect Switch INTEGRATED CIRCUITS DIVISION Features Description Power Operation (15 W typical at 25°C) Omnipolar (switches with N or S pole) 2.5V to 5.5V Operation Simple Digital Open-Drain Output Ultra Low Offset Canceling Amplifiers Provide Sensitive, Accurate, Stable Switching Points and Immunity to Mechanical Stress • Solid State Reliability • Operating Temperature Range: -40°C to +85°C • RoHS Compliant TSOT23 3-Lead Package The MX887D integrated Hall-Effect switch targets the requirements of low-power portable devices with battery operating voltages from 2.5V to 5.5V. On-chip power management circuitry reduces the effective average current to just 5A at VSUPPLY = 3VDC . • • • • • The switch output will turn “on” when either a north or south magnetic pole is applied. The absence of a magnetic field will set the switch into the high-impedance “off” state. Emulating the behavior of a traditional reed switch, together with the advantages of high integration and solid state reliability, makes the MX887D an ideal replacement in low-power portable device applications. Applications • • • • • Handheld Portable Devices White Goods Automotive - Body Systems Security Systems High Reliability Reed Switch Replacement Pb Ordering Information e3 Part Description MX887DHTTR TSOT23 3L Tape & Reel (3000/Reel) Figure 1. Functional Block Diagram VSUPPLY 1 Offset Cancellation Output 2 Output Latch Hall Sensor Switch Power Management Logic 3 DS-MX887D-R01 www.ixysic.com 1 MX887D INTEGRATED CIRCUITS DIVISION 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Magnetic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 3 4 4 2. Circuit Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.ixysic.com 5 5 5 5 5 6 R01 MX887D INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Package Pinout 1.2 Pin Description 3 1 Pin# Name 1 VSUPPLY 2 OUT 3 2 Description 2.5V to 5.5V Open-Drain, N-Channel FET GROUND Ground 1.3 Absolute Maximum Ratings Parameter Symbol Min Max Units Supply Voltage VSUPPLY -0.5 6 VDC Output Voltage VOUT -0.5 6 V Magnetic Flux Density B IOUT - Unlimited G - 5 mA Output Current Junction Temperature TJ - 150 Operating Ambient Temperature TA -40 85 TSTG -40 150 Storage Temperature °C Absolute maximum electrical ratings are at 25°C. operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional 1.4 Electrical Characteristics Over operating voltage and temperature range unless otherwise specified. Parameter Conditions Symbol Minimum Typical Maximum Units Operating VSUPPLY 2.5 - 5.5 VDC VOUT=5.5V, BRPN < B < BRPS ILKG - - 1 A IOUT=1mA, VDD=3.0V VOUT - 100 300 mV Awake Time - - - - 90 s Period - - - - 90 ms Duty Cycle - - - 0.1 - % - - 2 mA - - 8 A - 5 15 A Supply Voltage Range Output Leakage Current Output On Voltage Supply Current Awake (enabled) Asleep (disabled) ISUPPLY Average (Calculated) Notes: R01 1. BOPX = operating point (output turns ON); BRPX = release point (output turns OFF). 2. Typical data is at 25°C and VSUPPLY = 3V. www.ixysic.com 3 MX887D INTEGRATED CIRCUITS DIVISION 1.5 ESD Rating ESD Rating (Human Body Model) 2000V 1.6 Magnetic Characteristics Over operating voltage and temperature range unless otherwise specified. Parameter Conditions Symbol Minimum Typical Maximum Due to North Pole Applied North Pole to Branded Side BOPN -60 - - Due to South Pole Applied South Pole to Branded Side BOPS - - 60 Due to North Pole Applied North Pole to Branded Side BRPN - - -6 Due to South Pole Applied South Pole to Branded Side BRPS 6 - - | BOPX - BRPX | BHYS - 5 - Units Operating Points G Release Points Hysteresis Notes: G G 1. As used here, negative flux densities are defined as less than zero (algebraic convention); -50G<+10G. 2. BOPX = operating point (output turns ON); BRPX = release point (output turns OFF). 3. Typical data is at 25°C and VSUPPLY = 3V. 2 Circuit Description The MX887D Power Hall-Effect Switch consists of a Hall element, small signal amplifier, latch, and N-channel open-drain output. Offset cancellation circuitry rejects errors in signal stages and the influence of mechanical stress on the Hall element. This technique, together with a precision threshold 4 generator and comparator, produces highly accurate magnetic switch points. The Hall element is activated for a small fraction of an operating cycle, then latched in that sample state for the remainder of the period. By using this technique, very low power consumption is achieved. www.ixysic.com R01 MX887D INTEGRATED CIRCUITS DIVISION 3 Manufacturing Information 3.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating MX887D MSL 3 3.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 3.3 Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time MX887D 260°C for 30 seconds 3.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R01 e3 www.ixysic.com 5 MX887D INTEGRATED CIRCUITS DIVISION 3.5 Mechanical Dimensions 3.5.1 MX887DHT TSOT23 3-Lead Package Recommended PCB Land Pattern 0º / 8º 2.80 / 3.00 (0.110 / 0.118) 3 0.10 MIN (0.004 MIN) D E1 E 2.60 / 3.00 (0.102 / 0.118) 1 0.00 / 0.10 (0.000 / 0.004) 1.05 (0.041) 0.10 / 0.25 (0.004 / 0.010) 0.60 REF (0.0236 REF) 0.25 BSC (0.0098 BSC) 5º NOM 7º NOM 0.95 BSC (0.037 BSC) 0.60 (0.024) 0.95 (0.037) GAUGE PLANE 0.70 / 0.80 (0.028 / 0.031) 2.70 (0.106) 2 0.35 / 0.51 (0.014 / 0.020) 0.75 / 0.90 (0.030 / 0.035) 0.37 / 0.47 (0.015 / 0.019) 1.50 / 1.70 (0.059 / 0.067) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 1.90 BSC (0.0748 BSC) Notes: (Unless otherwise specified) 1. Dimension “D” does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.10mm (0.004 inches) per side. 2. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.15mm (0.006 inches) per side. 3. Package top may be smaller than package bottom. Dimensions “D” and “E1” are determined at the outermost extreme of the plastic body excluding mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between top and bottom of the plastic body. 3.5.2 MX887DHTTR Tape & Reel Packaging 178 DIA. (7.01 DIA.) 0.25 ± 0.05 (0.001 ± 0.002) P=4.0 ± 0.1 (0.157 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) ø1.5, +0.1, -0 (ø0.059, +0.004, -0) 3.5 ± 0.05 (0.138 ± 0.002) 1.75 ± 0.1 (0.069 ± 0.004) Top Cover Tape Thickness 0.066 MAX. (0.003 MAX.) BO=3.2 ± 0.1 (0.126 ± 0.004) K0=1.1 ± 0.1 (0.043 ± 0.004) Embossed Carrier Embossment P=4.0 ± 0.1 (0.157 ± 0.004) AO=3.2 ± 0.1 (0.126 ± 0.004) ø1.1 ± 0.1 (0.043 ± 0.004) W=8.0 ± 0.2 (0.315 ± 0.008) Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 For additional information please visit www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-MX887D-R01 ©Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012 6 www.ixysic.com R01