CPC2025N Dual Single-Pole, Normally Open 8-Pin SOIC OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Forward Current (to Activate) Rating 400 120 30 2 Units VP mArms / mADC mA Features • • • • • • • • Description The CPC2025N is a miniature device with two independent normally open (1-Form-A) solid state relays in an 8-pin SOIC package that employs optically coupled MOSFET technology to provide 1500Vrms of input/output isolation. Optically coupled outputs that use the patented OptoMOS architecture are controlled by a highly efficient GaAIAs infrared LED. 1500Vrms Input/Output Isolation TTL/CMOS Compatible Input Arc-Free With No Snubbing Circuits No EMI/RFI Generation Immune to Radiated EM Fields SMD Pick & Place, Wave Solderable Tape & Reel Version Available Small 8-Pin SOIC Package The CPC2025N uses IXYS Integrated Circuits Division’s state of the art, double-molded vertical construction packaging to produce one of the world’s smallest relays. It offers substantial board space savings over the competitor’s larger 8-Pin SOIC relay. Applications Approvals • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Security • Passive Infrared Detectors (PIR) • Data Signaling • Sensor Circuitry • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Medical Equipment—Patient/Equipment Isolation • Aerospace • Industrial Controls • UL Certified Component: File E76270 • CSA Certified Component: Certificate 1172007 • EN/IEC 60950-1 Certified Component: TUV Certificate B 10 05 49410 006 Ordering Information Part # CPC2025N CPC2025NTR Description 8-Pin SOIC (50/tube) 8-Pin SOIC (2000/reel) Pin Configuration 1 8 + Control Load 7 2 – Control Load 3 6 + Control Load 4 5 – Control Load Switching Characteristics of Normally Open (Form A) Devices Form-A IF 90% 10% ILOAD Pb DS-CPC2025N-R02 ton e3 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC2025N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage (Peak) Reverse Input Voltage LED Forward Current Peak (10ms) Input Power Dissipation Total Power Dissipation 1 Isolation Voltage, Input to Output (60 Seconds) ESD Rating, Human Body Model Operational Temperature Storage Temperature 1 Ratings 400 5 50 1 70 600 Units VP V mA A mW mW 1500 Vrms 8 -40 to +85 -40 to +125 kV °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Derate linearly 5mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics LED Forward Current To Activate 3 To Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units t=10ms IL=120mA VL=400VP IL ILPK RON ILEAK - 20 - 120 ±350 30 1 mArms / mADC mAP µA ton toff COUT - 0.76 0.36 9 2 1 - 0.3 0.9 - 0.6 0.55 1.2 - 2 1.4 10 IF=5mA, VL=10V VL=50V, f=1MHz IL=120mA IF=5mA VR=5V IF VF IR CI/O 1 Load current derates linearly from 120mA @ 25oC to 60mA @ 85oC, and must be derated if both poles are operating simultaneously. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60°C) a LED forward current of 4mA is recomended. www.ixysic.com - ms pF mA V µA pF R02 INTEGRATED CIRCUITS DIVISION CPC2025N PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * 35 Typical LED Forward Voltage Drop (N=50, IF=5mA) Typical Turn-On Time (N=50, IF=5mA, IL=60mA) 20 25 20 15 10 Device Count (N) Device Count (N) Device Count (N) 30 25 15 10 5 5 0 0 1.21 1.22 1.23 1.24 0.60 0.65 LED Forward Voltage Drop (V) 15 0.70 0.75 0.80 0.85 Turn-On Time (ms) Device Count (N) Device Count (N) Device Count (N) 20 15 10 3.5 20 10 2.0 1.5 1.0 IF=10mA IF=5mA IF=2mA 10 20 30 40 LED Forward Current (mA) 0.35 0.34 0.33 0.32 0 50 Typical Turn-On Time vs. Temperature (IL=60mA) 10 20 30 40 LED Forward Current (mA) 2.0 1.5 IF=5mA 1.0 50 Typical Turn-Off Time vs. Temperature (IL=60mA) 0.6 IF=2mA 0.5 0.4 IF=5mA 0.3 IF=2mA 0.2 0 0.5 -20 Typical Turn-Off Time vs. LED Forward Current (IL=60mA) 0.1 1.0 -40 431 0.30 0 Turn-Off Time (ms) 1.2 419 422 425 428 Blocking Voltage (VP) 0.31 0 Turn-On Time (ms) 1.3 5 0.36 2.5 1.4 10 0.37 2.5 Typical LED Forward Voltage Drop vs. Temperature IF=50mA IF=20mA 15 416 0.5 1.6 20 20.5 Turn-Off Time (ms) 30 0 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 LED Forward Voltage (V) LED Forward Voltage Drop (V) 18.5 19.0 19.5 20.0 On-Resistance (:) 3.0 Turn-On Time (ms) LED Forward Current (mA) 18.0 Typical Turn-On Time vs. LED Forward Current (IL=60mA) LED Forward Voltage vs. LED Forward Current 40 0.40 0 17.5 0.9 50 0.36 0.37 0.38 0.39 Turn-Off Time (ms) 25 0 0 0.35 Typical Blocking Voltage Distribution (N=50) 5 1.1 5 0.34 30 5 1.5 10 Typical On-Resistance Distribution (N=50, IF=2mA, IL=120mA) 10 0.4 0.5 0.6 0.7 0.8 LED Forward Current (mA) 15 0.90 25 0.3 20 0 1.25 Typical LED Forward Current to Activate (N=50, IL=120mA) Typical Turn-Off Time (N=50, IF=5mA, IL=60mA) 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R02 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC2025N PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * LED Forward Current to Activate vs. Temperature (IL=60mA) 32 0.80 0.70 0.65 0.60 0.55 0.50 28 26 24 22 18 -20 0 20 40 60 Temperature (ºC) 80 Maximum Load Current vs. Temperature (IF=4mA) 140 -20 Blocking Voltage (VP) 100 80 60 40 20 0 0 20 40 60 Temperature (ºC) 80 -20 0 20 40 60 Temperature (ºC) 100 430 420 410 -1 0 1 2 3 Typical Leakage vs. Temperature Measured Across Pins 5&6, 7&8 (VL=400V) 0.020 0.015 0.010 0.005 400 0 -40 -20 0 20 40 60 Temperature (ºC) Load Current (A) 20 10 0 10 100 Load Voltage (V) 80 -40 100 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 30 1 -2 0.025 440 40 0.1 -3 0.030 450 Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 50 Output Capacitance (pF) 80 -50 Load Voltage (V) 390 -40 0 100 Typical Blocking Voltage vs. Temperature (IF=0mA) 460 120 50 -150 -40 100 Leakage (PA) -40 100 -100 20 0.45 0.40 Load Current (mA) Load Current (mA) 0.75 Typical Load Current vs. Load Voltage (IF=2mA) 150 30 On-Resistance (:) LED Forward Current (mA) 0.85 Typical On-Resistance vs. Temperature (IF=20mA, IL=60mA) 1000 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10μs 100μs 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC2025N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC2025N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC2025N 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R02 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC2025N MECHANICAL DIMENSIONS CPC2025N 1.016 ± 0.025 (0.040 ± 0.001) 9.347 ± 0.203 (0.368 ± 0.008) Pin 1 2.184 MAX (0.086 MAX) PCB Land Pattern 5.60 (0.22) 1.30 (0.051) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.051 (0.150 ± 0.002) 2.540 TYP (0.100 TYP) 0.203 ± 0.025 (0.008 ± 0.001) 0.432 ± 0.127 (0.017 ± 0.005) 2.54 (0.100) 0.55 (0.022) Lead to Package Standoff MIN 0.0254 (0.001) (MAX 0.102 (0.004) 0.838 ± 0.102 (0.033 ± 0.004) Dimensions mm (inches) 0.381 ± 0.051 (0.015 ± 0.002) CPC2025NTR Tape & Reel 1.75 ± 0.10 330.2 DIA. (13.00 DIA.) 4.00 ± 0.10 8.00 ± 0.10 2.00 ± 0.10 Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 1.20 7.50 ± 0.10 Ø1.50 +0.1, -0 6.50 9.65 ± 0.10 16.00 ± 0.30 Embossed Carrier 3.50 6.55 ± 0.10 Ø1.50 MIN Embossment 2.35 ± 0.10 NOTES: 1. All dimensions in millimeters 2. 10 sprocket hole pitch cumulative tolerance ± 0.20. 3. Carrier camber is within 1mm in 250mm. 4. Tape material : Black Conductive Polystyrene Alloy. 2.85 ± 0.10 5. All dimensions meet EIA-481-C requirements. 6. Thickness : 0.30 ± 0.05mm. 7. Component load per 13” reel : 2000 pcs. For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC2025N-R02 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/17/2012