PAA127

PAA127
Dual Single-Pole, Normally Open
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
280
200
10
Units
VP
mArms / mADC

Features
•
•
•
•
•
•
•
•
•
500s Maximum Switching Times
High Performance 280VP Blocking Voltage
High Reliability
3750Vrms Input/Output Isolation
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
FCC Compatible
VDE Compatible
Low Drive Power Requirements (TTL/CMOS
Compatible)
• Small 8-pin Package
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Versions Available
Description
PAA127 is a dual high performance 280V, 200mA,
10, normally open (1-Form-A) Solid State Relay that
has two independently controlled, optically coupled
MOSFET switches in an 8-pin package. It employs
optically coupled MOSFET technology to provide
3750Vrms of input to output isolation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
This dual single-pole OptoMOS relay provides a more
compact design solution than discrete single-pole
relays in a variety of applications, and saves board
space by incorporating both switches in a single 8-Pin
package.
Approvals
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Test Equipment
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• UL Recognized Component: File # E76270
• CSA Certified Component: Certificate # 1175739
• Certified to:
IEC 60950-1: 2005
EN 60950-1: 2006
TUV Certificate # B 12 11 82667 002
Ordering Information
Part #
PAA127
PAA127S
PAA127STR
PAA127P
PAA127PTR
Description
8-Pin DIP (50/Tube)
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount (1,000/Reel)
8-Pin Flatpack (50/Tube)
8-Pin Flatpack (1,000/Reel)
Switching Characteristics
of Normally Open Devices
Form-A
IF
Pin Configuration
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
Pb
DS-PAA127-R03
90%
AC/DC Configuration
1
8
2
7
3
6
4
5
10%
ILOAD
ton
Load - Switch #1
toff
Load - Switch #1
Load - Switch #2
Load - Switch #2
e3
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1
INTEGRATED CIRCUITS DIVISION
PAA127
Absolute Maximum Ratings @ 25ºC
Parameter
Ratings
Blocking Voltage
280
Reverse Input Voltage
5
Input Control Current
50
Peak (10ms)
1
1
Input Power Dissipation
150
800
Total Power Dissipation 2
Isolation Voltage, Input to Output
3750
Operational Temperature
-40 to +85
Storage Temperature
-40 to +125
1
2
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous 1
Peak
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate 3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
3
2
Conditions
Symbol
Min
Typ
Max
Units
t =10ms
IF=3mA, IL=200mA
IF=0mA, VL=280VP
IL
ILPK
RON
ILEAK
-
7.3
1
200
±400
10
25
mArms / mADC
mAP

IF=0mA, VL=50V, f=1MHz
ton
toff
COUT
-
0.42
0.12
16
0.5
0.5
-
IL=200mA
IF=5mA
VR=5V
IF
VF
IR
0.3
0.9
-
0.5
0.49
1.2
-
3
1.4
10
mA
mA
V
A
-
CI/O
-
3
-
pF
IF=5mA, VL=10V
nA
ms
pF
If both poles operate, the load current must be derated in order not to exceed the package power dissipation value.
Measurement taken within one (1) second of on-time.
For high-temperature applications (>60ºC) use a LED current of at least 5mA.
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R03
INTEGRATED CIRCUITS DIVISION
PAA127
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
40
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
25
30
25
20
15
10
25
20
Device Count (N)
Device Count (N)
Device Count (N)
35
30
15
10
5
20
15
10
5
5
0
0
0
325
1.225
Typical IF for Switch Operation
(N=50, IL=200mA)
15
10
5
0.35
450
475
100
0.40 0.45 0.50 0.55 0.60
LED Forward Current (mA)
10
5
120
125
130
135
15
10
5
7.2
7.3
7.4
7.5
On-Resistance (:)
7.6
332
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
334
336
338
340
Blocking Voltage (VP)
342
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
0.165
1.4
1.3
1.2
Turn-Off Time (ms)
3.5
Turn-On Time (ms)
1.5
115
0
7.1
0.65
IF=50mA
IF=20mA
IF=10mA
IF=5mA
110
Typical Blocking Voltage Distribution
(N=50, IF=0mA)
20
15
4.0
1.6
105
Turn-Off Time (Ps)
20
Typical LED Forward Voltage Drop
vs. Temperature
3.0
2.5
2.0
1.5
1.0
0.160
0.155
0.150
0.145
0.5
0.0
1.1
-40
-20
0
20
40
60
Temperature (ºC)
80
Typical IF for Switch Operation
vs. Temperature
(IL=200mA)
0.65
0.140
0
100
650
10
20
30
LED Current (mA)
40
0
50
Typical Turn-On Time vs. Temperature
(IF=5mA, IL=100mA)
250
10
20
30
LED Current (mA)
40
50
Typical Turn-Off Time vs. Temperature
(IF=5mA, IL=100mA)
600
Turn-On Time (Ps)
0.60
0.55
0.50
0.45
Turn-Off Time (Ps)
LED Forward Voltage (V)
375 400 425
Turn-On Time (Ps)
0
0
LED Current (mA)
350
Typical On-Resistance Distribution
(N=50, IF=3mA, IL=200mA)
25
Device Count (N)
20
Device Count (N)
1.205 1.210 1.215 1.220
LED Forward Voltage (V)
Device Count (N)
1.200
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA)
550
500
450
400
200
150
100
350
300
0.40
-40
-20
0
20
40
60
Temperature (ºC)
80
100
50
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R03
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3
INTEGRATED CIRCUITS DIVISION
PAA127
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical On-Resistance vs. Temperature
(IF=3mA, IL=200mA)
Load Current (mA)
7.5
7.0
6.5
6.0
5.5
-40
0
20
40
60
Temperature (ºC)
80
100
200
Leakage Current (nA)
345
340
335
330
325
320
315
-1.0
-0.5
0.0
0.5
0
20
40
60
Temperature (ºC)
160
140
120
80
1.5
1.0
20
15
10
5
-40
-20
80
-40
100
90
0
20
40
60
Temperature (ºC)
80
100
Output Capacitance vs. Load Voltage
(IF=0mA)
80
70
60
50
40
30
20
10
0
0
-20
180
100
Leakage Current vs. Temperature
Measured Across Pins 5&6 & 7&8
(IF=0mA, VL=280V)
25
350
-40
220
Load Voltage (V)
Typical Blocking Voltage
vs. Temperature
(IF=0mA)
355
Blocking Voltage (VP)
-20
250
200
150
100
50
0
-50
-100
-150
-200
-250
-1.5
Output Capacitance (pF)
On-Resistance (:)
8.5
Load Current (mA)
9.0
8.0
Maximum Load Current vs. Temperature
AC/DC Configuration
(IF=3mA)
Typical Load Current vs. Load Voltage
(IF=3mA)
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
0
50
100
150
200
Load Voltage (V)
250
300
Energy Rating Curve
1.2
Load Current (A)
1.0
0.8
0.6
0.4
0.2
0.0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R03
INTEGRATED CIRCUITS DIVISION
PAA127
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test
all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product
performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the
requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
PAA127 / PAA127S / PAA127P
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must
be observed.
Device
Maximum Temperature x Time
PAA127 / PAA127S
250ºC for 30 seconds
PAA127P
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove
flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical
waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used
after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that
employ ultrasonic energy should not be used.
Pb
R03
e3
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5
INTEGRATED CIRCUITS DIVISION
PAA127
MECHANICAL DIMENSIONS
PAA127
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
0.457 ± 0.076
(0.018 ± 0.003)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
7.620 ± 0.127
(0.300 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
PAA127S
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
PCB Land Pattern
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
PAA127P
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
9.398 ± 0.127
(0.370 ± 0.005)
Pin 1
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
2.286 MAX.
(0.090 MAX.)
2.54
(0.10)
0.635 ± 0.127
(0.025 ± 0.005)
0.203 ± 0.013
(0.008 ± 0.0005)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
2.159 ± 0.025
(0.085 ± 0.001)
0.457 ± 0.076
(0.018 ± 0.003)
0.864 ± 0.120
(0.034 ± 0.004)
6
PCB Land Pattern
Dimensions
mm
(inches)
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R03
INTEGRATED CIRCUITS DIVISION
PAA127
PAA127STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W=16.00
(0.63)
Bo=10.30
(0.406)
K0 =4.90
(0.193)
Ao=10.30
(0.406)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
PAA127PTR Tape & Reel
2.00
(0.079)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossment
W = 16.00
(0.63)
7.50
(0.295)
Bo = 10.30
(0.406)
K0 = 2.70
(0.106)
K1 = 2.00
(0.079)
Embossed Carrier
4.00
(0.157)
Ao = 10.30
(0.406)
P = 12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
7
Specification: DS-PAA127-R03
©Copyright 2013, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
6/20/2013