PAA110

PAA110
Dual Single-Pole, Normally Open
OptoMOS® Relays
INTEGRATED CIRCUITS DIVISION
Parameters
Load Voltage
Load Current
On-Resistance (max)
Ratings
400
150
22
Units
VP
mArms / mADC

Features
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• High Reliability
• Arc-Free With No Snubbing Circuits
• VDE Compatible
• FCC Compatible
• No EMI/RFI Generation
• Small 8-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount and Tape Reel Version Available.
Description
PAA110 is a 400V, 150mA, 22 dual normally open
(1-Form-A) optically isolated Solid State Relay. Its
efficient MOSFET switches and photovoltaic die use
IXYS Integrated Circuits Division’s patented OptoMOS
architecture to provide 3750Vrms of input to output
isolation. The optically coupled output is controlled by
a highly efficient GaAIAs infrared LED
This performance leader provides high peak load
voltage handling capability and improved peak load
current handling.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Applications
Ordering Information
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket
Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Part #
PAA110
PAA110P
PAA110PTR
PAA110S
PAA110STR
Description
8-Pin DIP (50/Tube)
8-Pin Flatpack (50/Tube)
8-Pin Flatpack (1000/Reel)
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount (1000/Reel)
Pin Configuration
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
AC/DC Configuration
1
8
2
7
3
6
4
5
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Switching Characteristics
of Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
Pb
DS-PAA110-R05
toff
e3
www.ixysic.com
1
INTEGRATED CIRCUITS DIVISION
PAA110
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 6.67 mW / ºC
Ratings
400
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Conditions
Symbol
Min
Typ
Max
Units
t=10ms
IL=150mA
VL=400VP
IL
ILPK
RON
ILEAK
-
15
-
150
±400
22
1
mArms / mADC
mAP

A
VL=50V, f=1MHz
ton
toff
COUT
-
25
1
0.25
-
IL=150mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.4
0.9
-
0.7
1.2
-
5
1.4
10
mA
mA
V
A
-
CI/O
-
3
-
pF
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current *
Continuous, AC/DC Configuration
Peak
On-Resistance, AC/DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
IF=5mA, VL=10V
ms
pF
*NOTE: If both poles operate simultaneously, then load current must be derated in order not to exceed the package power dissipation value.
2
www.ixysic.com
R05
INTEGRATED CIRCUITS DIVISION
PAA110
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
25
25
20
15
10
5
20
15
10
5
1.17
25
1.19
1.21
1.23
1.25
0.15
0.21
0.27
0.33
0.39
Typical IF for Switch Operation
(N=50, IL=150mADC)
Typical IF for Switch Dropout
(N=50)
Device Count (N)
5
5
0.05
25
10
10
0.07
0.09
0.11
0.13
0.15
Turn-Off Time (ms)
Turn-On Time (ms)
15
15
0.45
LED Forward Voltage Drop (V)
20
20
0
0
0
Device Count (N)
25
Device Count (N)
Device Count (N)
Device Count (N)
30
Typical Turn-Off Time
(N=50, IF=5mA, IL=150mADC)
Typical Turn-On Time
(N=50, IF=5mA, IL=150mADC)
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=150mADC)
35
30
20
Device Count (N)
35
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
15
10
5
25
20
15
10
5
0
0
0.75
1.05
1.35
1.65
1.95
0
0.75
2.25
1.05
1.35
1.65
1.95
2.25
13.1
13.7
LED Current (mA)
LED Current (mA)
14.3
14.9
15.5
16.1
On-Resistance (:)
Typical Blocking Voltage Distribution
(N=50)
35
Device Count (N)
30
25
20
15
10
5
0
441.5 450.5
459.5
468.5
477.5
486.5
Blocking Voltage (VP)
Typical Turn-On Time
vs. LED Forward Current
(IL=150mADC)
0.40
1.8
1.4
IF=50mA
IF=30mA
IF=20mA
IF=10mA
IF=5mA
1.2
1.0
Turn-Off Time (ms)
1.6
0.30
0.25
0.20
0.15
0.10
-40
-20
0
20
40
60
Temperature (ºC)
80
100
120
0.10
0.08
0.06
0.04
0.02
0.05
0
0
0.8
Typical Turn-Off Time
vs. LED Forward Current
(IL=150mADC)
0.12
0.35
Turn-On Time (ms)
LED Forward Voltage Drop(V)
Typical LED Forward Voltage Drop
vs. Temperature
0
5
10
15
20
25
30
35
40
LED Forward Current (mA)
45
50
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R05
www.ixysic.com
3
INTEGRATED CIRCUITS DIVISION
PAA110
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical Turn-On Time
vs. Temperature
(IL=150mADC)
0.14
IF=5mA
IF=10mA
IF=20mA
0.75
0.50
0.10
0.08
0.06
0.04
0.02
-40
3.0
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
Temperature (ºC)
Typical IF for Switch Operation
vs. Temperature
(IL=150mADC)
Typical IF for Switch Dropout
vs. Temperature
(IL=150mADC)
3.0
1.0
1.5
1.0
0.5
0
0
-40
-20
0
20
40
60
80
100
5
150
2.0
0.5
10
-40
Load Current (mA)
LED Current (mA)
1.5
15
100
2.5
2.0
20
-40
-20
0
20
40
60
80
-150
-2.5 -2.0 -1.5 -1.0 -0.5
100
20
40
60
80
100
Leakage (PA)
Blocking Voltage (VP)
0.030
0
470
465
460
455
-40
Temperature (ºC)
0.025
0.020
0.015
0.010
0.005
450
120
0.5 1.0 1.5 2.0 2.5
Typical Leakage vs. Temperature
Measured across Pins 5&6 or 7&8
475
0
0
Load Voltage (V)
250
50
100
0
0.035
IF=20mA
IF=10mA
IF=5mA
80
-50
480
100
60
50
Typical Blocking Voltage
vs. Temperature
Maximum Load Current
vs. Temperature
150
40
100
Temperature (ºC)
200
20
Typical Load Current vs. Load Voltage
(IF=5mA)
300
-20
0
-100
Temperature (ºC)
-40
-20
Temperature (ºC)
Temperature (ºC)
2.5
Typical On-Resistance vs. Temperature
(IF=5mA, IL=150mADC)
0
0
0
LED Current (mA)
On-Resistance (:)
1.00
0.25
Load Current (mA)
25
0.12
1.25
Turn-Off Time (ms)
Turn-On Time (ms)
1.50
Typical Turn-Off Time
vs. Temperature
(IL=150mADC)
-20
0
20
40
60
80
100
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Energy Rating Curve
1.2
Load Current (A)
1.0
0.8
0.6
0.4
0.2
0
10Ps 100Ps 1ms 10ms 100ms
1s
10s
100s
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
www.ixysic.com
R05
INTEGRATED CIRCUITS DIVISION
PAA110
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
PAA110 / PAA110S / PAA110P
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
PAA110 / PAA110S
250ºC for 30 seconds
PAA110P
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
R05
e3
www.ixysic.com
5
INTEGRATED CIRCUITS DIVISION
PAA110
Mechanical Dimensions
PAA110
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
0.457 ± 0.076
(0.018 ± 0.003)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
7.620 ± 0.127
(0.300 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
PAA110S
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
PCB Land Pattern
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
PAA110P
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
9.398 ± 0.127
(0.370 ± 0.005)
Pin 1
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
2.286 MAX.
(0.090 MAX.)
2.54
(0.10)
0.635 ± 0.127
(0.025 ± 0.005)
0.203 ± 0.013
(0.008 ± 0.0005)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
2.159 ± 0.025
(0.085 ± 0.001)
0.457 ± 0.076
(0.018 ± 0.003)
0.864 ± 0.120
(0.034 ± 0.004)
6
PCB Land Pattern
Dimensions
mm
(inches)
www.ixysic.com
R05
INTEGRATED CIRCUITS DIVISION
PAA110
PAA110PTR Tape & Reel
2.00
(0.079)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossment
W = 16.00
(0.63)
7.50
(0.295)
Bo = 10.30
(0.406)
K0 = 2.70
(0.106)
K1 = 2.00
(0.079)
Embossed Carrier
4.00
(0.157)
Ao = 10.30
(0.406)
P = 12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
PAA110STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
K0 =4.90
(0.193)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
7
Specification: DS-PAA110-R05
© Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012