XAA170

XAA170
Dual Single-Pole, Normally Open
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Input Control Current
Rating
350
100
50
5
Units
VP
mArms / mADC

mA
Description
The XAA170 is a dual, normally open (1-Form-A)
solid state relay comprising two independent, optically
coupled relays in a single 8-pin package. Using
optically coupled MOSFET technology, it provides
3750Vrms of input to output isolation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
Features
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 8-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Version Available
By incorporating two independent single-pole relays
into a single 8-pin package, the XAA170 saves board
space by providing a more compact design solution
than two discrete single-pole relays in a variety of
applications.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Compliant
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Ordering Information
Part #
Description
XAA170
XAA170P
XAA170PTR
XAA170S
XAA170STR
8-Pin DIP (50/Tube)
8-Pin Flatpack (50/Tube)
8-Pin Flatpack T&R (1000/Reel)
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount T&R (1000/Reel)
Pin Configuration
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
1
8
2
7
3
6
4
5
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Switching Characteristics of
Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
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DS-XAA170-R05
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1
INTEGRATED CIRCUITS DIVISION
XAA170
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Ratings
350
5
50
1
150
800
Units
VP
V
mA
A
mW
mW
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
3750
-40 to +85
-40 to +125
Vrms
°C
°C
1
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
2
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current, Continuous
Peak Load Current
On-Resistance
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance Input to Output
2
Conditions
Symbol
Min
Typ
Max
Units
t=10ms
IL=100mA
VL=350VP
IL
ILPK
RON
ILEAK
-
33
-
100
350
50
1
mArms / mADC
mAP

VL=50V, f=1MHz
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COUT
-
25
5
5
-
IL = 100mA
-
IF
-
0.4
0.7
5
-
mA
mA
IF = 5mA
VR = 5V
VF
IR
0.9
-
1.2
-
1.4
10
V
A
-
-
-
3
-
pF
IF = 5mA, VL = 10V
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µA
ms
pF
R05
INTEGRATED CIRCUITS DIVISION
XAA170
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
35
25
25
20
15
10
5
0
20
15
10
5
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
0.67
Typical IF for Switch Operation
(N=50, IL=100mADC)
Device Count (N)
15
10
5
0
0.83 0.91 0.99 1.06
Turn-On Time (ms)
0.50
0.56 0.62 0.69 0.75
LED Current (mA)
10
5
0.11
20
15
10
5
0.14
0.17 0.19 0.22 0.25
Turn-Off Time (ms)
0.28
Typical On-Resistance Distribution
(N=50, IL=100mADC)
25
20
15
10
5
0
0
0.44
15
1.14
Typical IF for Switch Dropout
(N=50, IL=100mADC)
25
20
0.75
Device Count (N)
25
20
0
0
1.17
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mADC)
25
Device Count (N)
Device Count (N)
Device Count (N)
30
Device Count (N)
Typical Turn-On Time
(N=50, IF=5mA, IL=100mADC)
0.81
0.44
0.50
0.56
0.62
0.69
0.75
29.09 29.86 30.63 31.40 32.16 32.93 33.70
0.81
On-Resistance (:)
LED Current (mA)
Typical Blocking Voltage Distribution
(N=50)
Device Count (N)
25
20
15
10
5
0
424.0 429.3 434.5 439.7 444.9 450.1 455.4
Blocking Voltage (VP)
Typical Turn-On Time
vs. LED Forward Current
(IL=100mADC)
1.6
1.4
IF=50mA
IF=30mA
IF=20mA
IF=10mA
IF=5mA
1.2
1.0
0.8
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Turn-Off Time (ms)
1.8
Turn-On Time (ms)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
0
5
10
15
20
25
30
35
40
LED Forward Current (mA)
45
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mADC)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R05
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3
INTEGRATED CIRCUITS DIVISION
XAA170
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
1.8
1.4
1.2
1.0
IF=10mA
0.8
IF=20mA
0.6
0.4
0.2
0
-40
-20
0
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
100 120
20
40
60
80
Temperature (OC)
3
2
1
20
40
60
80
100
40
60
10
120
100
80
60
40
20
0
-20
-40
-60
-80
-100
-120
4
3
2
0
20
20
-40
120
1
0
0
30
80
100 120
-40
-20
0
20
40
60
80
100 120
Temperature (OC)
Temperature (OC)
Maximum Load Current
vs. Temperature
Typical Blocking Voltage
vs. Temperature
450
0.014
Blocking Voltage (VP)
455
140
120
100
IF=10mA
IF=5mA
IF=2mA
40
445
440
435
430
20
425
0
-40
420
-20
0
20
40
60
80
20
40
60
80
Temperature (OC)
100
120
Typical Load Current
vs. Load Voltage
(IF=5mA)
-4
-3
-2
-1
0
1
2
3
4
0.012
0.010
0.008
0.006
0.004
0.002
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
100 120
Typical Leakage vs. Temperature
Measured Across Pins 4&6
160
60
0
Load Voltage (V)
0.016
80
-20
Load Current (mA)
LED Current (mA)
LED Current (mA)
0
Typical IF for Switch Dropout
vs. Temperature
(IL=100mADC)
6
4
-20
40
0
-20
5
-40
50
Temperature (ºC)
5
Load Current (mA)
60
-40
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
6
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=100mADC)
70
Leakage (PA)
Turn-On Time (ms)
Turn-Off Time (ms)
IF=5mA
1.6
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=120mADC)
On-Resistance (:)
Typical Turn-On Time
vs. Temperature
(IL=100mADC)
0
-40
-20
0
20
40
60
80
100
Temperature (OC)
Load Current (A)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R05
INTEGRATED CIRCUITS DIVISION
XAA170
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
XAA170 / XAA170S / XAA170P
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
XAA170 / XAA170S
250ºC for 30 seconds
XAA170P
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
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5
INTEGRATED CIRCUITS DIVISION
XAA170
Mechanical Dimensions
XAA170
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
0.457 ± 0.076
(0.018 ± 0.003)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
7.620 ± 0.127
(0.300 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
XAA170S
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
PCB Land Pattern
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
XAA170P
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
9.398 ± 0.127
(0.370 ± 0.005)
Pin 1
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
2.286 MAX.
(0.090 MAX.)
2.54
(0.10)
0.635 ± 0.127
(0.025 ± 0.005)
0.203 ± 0.013
(0.008 ± 0.0005)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
2.159 ± 0.025
(0.085 ± 0.001)
0.457 ± 0.076
(0.018 ± 0.003)
0.864 ± 0.120
(0.034 ± 0.004)
6
PCB Land Pattern
Dimensions
mm
(inches)
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R05
INTEGRATED CIRCUITS DIVISION
XAA170
XAA170STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W=16.00
(0.63)
Bo=10.30
(0.406)
K0 =4.90
(0.193)
Ao=10.30
(0.406)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
XAA170PTR Tape & Reel
2.00
(0.079)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossment
W = 16.00
(0.63)
7.50
(0.295)
Bo = 10.30
(0.406)
K0 = 2.70
(0.106)
K1 = 2.00
(0.079)
Embossed Carrier
4.00
(0.157)
Ao = 10.30
(0.406)
P = 12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
7
Specification: DS-XAA170-R05
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012