LCB716 Single-Pole, Normally Closed OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Load Voltage Load Current On-Resistance (max) Rating 60 500 2 Units VP mArms / mADC Features • 3750Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • No Moving Parts • High Reliability • Arc-Free With No Snubbing Circuits • No EMI/RFI Generation • Small 6-Pin Package • Machine Insertable, Wave Solderable • Tape & Reel, Surface Mount Version Available Description LCB716 is a single-pole, normally closed (1-Form-B) solid state relay that uses optically coupled relay technology to provide an enhanced 3750Vrms isolation barrier between the input and the output of the relay. The efficient MOSFET output switch uses IXYS Integrated Circuits Division's patented OptoMOS architecture. The optically coupled output is controlled by a highly efficient GaAlAs infrared LED. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1175739 • EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 006 Ordering Information Applications • Sensor Circuitry • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (gas, oil, electric and water) • Medical Equipment-Patient/Equipment Isolation • Security • Aerospace • Industrial Controls Part # LCB716 LCB716S LCB716STR Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1000/Reel) Pin Configuration AC/DC Configuration + Control – Control Do Not Use 1 6 2 5 3 4 Load Do Not Use Load DC-Only Configuration + Control – Control Do Not Use 1 6 2 5 3 4 + Load – Load Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 90% 10% toff Pb DS-LCB716-R03 ton e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION LCB716 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Ratings 60 5 50 1 Units VP V mA A 100 800 3750 -40 to +85 -40 to +125 mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current AC/DC Configuration, Continuous DC Configuration, Continuous Peak On-Resistance AC/DC Configuration DC Configuration Off-State Leakage Current Output Capacitance Switching Speeds Turn-On Turn-Off Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 2 Conditions Symbol Max Units - 500 mArms / mADC - 1000 ±1.2 mADC AP 1.63 0.4 280 2 0.5 1 - ILEAK COUT - ton - 0.58 3 toff - 0.76 3 IL=500mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 1.2 - 2 1.4 10 mA mA V A - CI/O - 3 - pF t < 10ms IL=500mA IL=1000mA IF=2mA, VL=60V IF=2mA, VL=50V, f=1MHz IF=5mA, VL=10V IL ILPK RON www.ixysic.com Min Typ - A pF ms R03 INTEGRATED CIRCUITS DIVISION LCB716 PERFORMANCE DATA* (@25ºC Unless Otherwise Noted) 30 Typical LED Forward Voltage Drop (N=50, IF=5mA) Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 20 25 15 10 Device Count (N) Device Count (N) Device Count (N) 25 20 15 10 5 5 0 0 1.220 5 0 0.17 0.18 0.19 0.20 LED Forward Current (mA) 0.15 800 0 20 40 60 80 420 419 0 Typical Turn-Off Time vs. Temperature (IL=100mA) 4.5 IF=5mA 200 20 40 60 Temperature (ºC) 80 100 0.5 0 10 20 30 40 50 Typical On-Resistance vs. Temperature (IF=0mA, IL=100mA) 1.7 IF=2mA 3.0 2.5 2.0 1.5 IF=5mA -40 -20 0 20 40 60 Temperature (ºC) 80 1.6 1.5 1.4 1.3 1.2 0.5 0 1.0 1.8 3.5 1.0 -20 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) LED Forward Current (ma) On-Resistance (:) Turn-Off Time (ms) IF=2mA 80 1.5 50 4.0 300 76 77 78 79 Blocking Voltage (VP) 2.0 0 Typical Turn-On Time vs. Temperature (IL=100mA) 400 5 2.5 421 Temperature (ºC) 500 10 75 Typical Turn-On Time vs. LED Forward Current (IL=100mA) 10 20 30 40 LED Forward Current (mA) 600 15 1.69 417 100 700 Turn-On Time (Ps) 1.57 1.61 1.65 On-Resistance (:) 418 -20 0.83 0 1.53 Turn-Off Time (ms) Turn-On Time (Ps) LED Current (mA) 0.20 100 -40 5 422 0.25 0.10 -40 10 423 0.30 0.71 0.75 0.79 Turn-Off Time (ms) Typical Blocking Voltage (N=50, IF=2mA) 15 1.49 0.35 0.67 20 0.21 Typical IF for Switch Operation vs. Temperature (IL=100mA) 5 0.63 0 0.16 10 0.622 Device Count (N) 10 15 Typical On-Resistance (N=50, IF=0mA, IL=5mA) 20 15 0.40 0.530 0.553 0.576 0.599 Turn-On Time (ms) Typical IF for Switch Operation (N=50, IL=200mA) 20 20 0 0.507 1.225 1.230 1.235 1.240 1.245 LED Forward Voltage Drop (V) Device Count (N) Device Count (N) 25 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 100 1.1 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R03 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LCB716 PERFORMANCE DATA* (@25ºC Unless Otherwise Noted) 0.6 0.5 0.4 0.4 0.3 0.2 Typical Load Voltage vs. Load Current (IF=0mA) 0.2 0.0 -0.2 0.1 -0.4 0.0 -0.6 -1.0 -0.75 -0.5 -0.25 0.0 0.25 0.5 Load Voltage (V) -20 0 20 40 60 Temperature (ºC) Leakage Current (nA) 350 80 100 Typical Leakage vs.Temperature Measured Across Pins 4&6 (IF=5mA, VL=60V) 1.0 90 88 86 84 82 80 -40 -20 0 20 40 60 Temperature (ºC) 80 100 1.5 300 1.3 250 200 150 100 1.1 0.9 0.7 0.5 50 0 -40 0.75 92 1-Form-B Relay Energy Rating Curve Load Current (A) -40 Typical Blocking Voltage vs. Temperature (IF=5mA) 94 Blocking Voltage (VP) 0.6 Load Current (A) Load Current (A) Maximum Load Current vs. Temperature (IF=0mA) -20 0 20 40 60 Temperature (ºC) 80 100 0.3 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION LCB716 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LCB716 / LCB716S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LCB716 / LCB716S 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R03 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LCB716 Mechanical Dimensions LCB716 8.382 ± 0.381 (0.330 ± 0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54 ± 0.127 (0.100 ± 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) Pin 1 7.620 ± 0.254 (0.300 ± 0.010) 1.651 ± 0.254 (0.065 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.254 ± 0.0127 (0.010 ± 0.0005) 6.350 ± 0.127 (0.250 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457 ± 0.076 (0.018 ± 0.003) LCB716S 8.382 ± 0.381 (0.330 ± 0.015) 9.524 ± 0.508 (0.375 ± 0.020) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) PCB Land Pattern 2.54 ± 0.127 (0.100 ± 0.005) 2.54 (0.10) 6.350 ± 0.127 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 1.651 ± 0.254 (0.065 ± 0.010) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 ± 0.051 (0.130 ± 0.002) 4.445 ± 0.254 (0.175 ± 0.010) Dimensions mm (inches) 1.651 ± 0.254 (0.065 ± 0.010) 6 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION LCB716 LCB716STR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) P = 12.00 (0.472) User Direction of Feed Embossed Carrier Embossment A0 = 10.10 (0.398) Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-LCB716-R03 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012