PLA194

PLA194
Single-Pole, Normally Open
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameters
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
600
Units
VP
130
35
mArms / mADC

Description
The PLA194 is a single-pole, normally open
(1-Form-A) solid state relay that uses optically
coupled relay technology to provide an enhanced
5000Vrms isolation barrier between the input and the
output of the relay.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
Features
• 5000Vrms Input/Output Isolation
• Low Drive Power Requirements
(TTL/CMOS Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 6-Pin Package
• Machine Insertable, Wave Solderable
Approvals
• UL-Recognized Component: File Number E76270
• CSA Certified Component: Certificate 1117539
• Certified to EN/IEC 60950-1:
TUV Certificate B 10 05 49410 006
Ordering Information
Applications
•
•
•
•
•
•
•
•
•
•
Sensor Circuitry
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment: Patient/Equipment Isolation
Aerospace
Industrial Controls
Part #
PLA194
PLA194S
PLA194STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
- Control
NC
1
6
2
5
3
4
Load
Do Not Use
Load
DC-Only Configuration
+ Control
- Control
NC
1
6
2
5
3
4
+ Load
- Load
Switching Characteristics of
Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
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INTEGRATED CIRCUITS DIVISION
PLA194
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Package Dissipation 2
ESD Rating, Human Body Model
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 6.67 mW / ºC
Min
8
5000
-40
-40
Max
600
5
50
1
150
800
85
125
Units
VP
V
mA
A
mW
mW
kV
Vrms
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current 1
Continuous, AC/DC Configuration
Continuous, DC-Only Configuration
Peak
On-Resistance 2
AC/DC Configuration
DC-Only Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate 3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
Conditions
Min
Typ
Max
Units
-
-
130
200
±400
mArms / mADC
mADC
mAP
26
-
35
18
1

ILEAK
-
VL=50V, f=1MHz
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-
0.85
0.46
5
3
2
-
IL=130mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.1
0.9
-
0.44
1.2
-
2
1.4
10
mA
mA
V
A
-
CI/O
-
3
-
pF
t=10ms
IL=130mA
IL=200mA
VL=600VP
IF=5mA, VL=10V
Symbol
IL
ILPK
RON
1
Load current derates linearly from 130mA @ 25ºC to 65mA @ 85ºC.
2
Measurement taken within 1 second of on-time.
3
For applications requiring high temperature operation (greater than 60ºC), a LED drive current of 3mA is recommended.
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A
ms
pF
R02
INTEGRATED CIRCUITS DIVISION
PLA194
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
35
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
Typical Turn-On Time
(N=50, IF=5mA, IL=130mA)
20
25
20
15
10
Device Count (N)
Device Count (N)
Device Count (N)
30
25
15
10
5
5
0
1.255
Typical IF for Switch Operation
(N=50, IL=130mA)
25
15
10
5
0.35
0.40 0.45 0.50
LED Current (mA)
0.55
Typical Blocking Voltage Distribution
(N=50)
15
10
5
1.6
1.2
1.0
-40
1.4
3
2
1
0
-20
0
20
40
60
Temperature (ºC)
80
100
10
0.8
0.6
0.4
20
30
LED Current (mA)
40
0
20
40
60
LED Forward Voltage (V)
80
100
715
Typical Turn-Off Time
vs. LED Forward Current
(IL=70mA)
0.51
0.49
0.47
0
10
800
2.5
IF=2mA
2.0
1.5
IF=5mA
1.0
20
30
LED Current (mA)
40
50
Typical Turn-Off Time
vs. Temperature
(IL=70mA)
900
IF=5mA
700
600
IF=2mA
500
400
300
0.5
-20
690 695 700 705 710
Blocking Voltage (VP)
0.53
50
Typical Turn-On Time
vs. Temperature
(IL=70mA)
3.0
1.0
685
0.45
0
Typical IF for Switch Operation
vs. Temperature
(IL=70mA)
1.2
0.2
-40
4
Turn-Off Time (Ps)
1.1
IF=5mA
IF=2mA
5
0.55
Turn-Off Time (ms)
Turn-On Time (ms)
1.3
Turn-On Time (ms)
LED VF (V)
1.4
10
680
Typical Turn-On Time
vs. LED Forward Current
(IL=70mA)
5
1.5
15
0
Typical LED Forward Voltage Drop
vs. Temperature
Forward Current (mA)
20
25.50 25.75 26.00 26.25 26.50 26.75 27.00
On Resistance (:)
0.60
IF=50mA
IF=20mA
IF=10mA
5
Typical On-Resistance Distribution
(N=50, IF=2mA, IL=130mA)
0
0.30
10
0.34 0.37 0.40 0.43 0.46 0.49 0.52 0.55
Turn-Off Time (ms)
20
0
15
0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00
Turn-On Time (ms)
Device Count (N)
Device Count (N)
20
Device Count (N)
1.235 1.240 1.245 1.250
LED Forward Voltage (V)
20
0
0
1.230
Typical Turn-Off Time
(N=50, IF=5mA, IL=130mA)
-40
-20
0
20
40
60
Temperature (ºC)
80
100
200
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R02
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INTEGRATED CIRCUITS DIVISION
PLA194
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
25
20
140
220
130
200
Load Current (mA)
Load Current (mA)
On-Resistance (:)
35
30
120
110
100
90
80
-20
0
20
40
60
Temperature (ºC)
80
120
80
-40
100
0.05
0.00
-0.05
-0.10
-0.15
-20
0
20
40
60
Temperature (ºC)
80
100
750
725
700
675
650
625
600
-2
-1
0
1
Load Voltage (V)
Output Capacitance (pF)
80
2
3
4
-40
-20
0
20
40
60
Temperature (ºC)
Output Capacitance vs. Load Voltage
(IF=0mA, f=1MHz)
80
100
-20
0
20
40
60
Temperature (ºC)
80
100
Typical Leakage vs. Temperature
(VL=600V)
80
60
40
20
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
1.0
70
Load Current (A)
-3
-40
100
Typical Blocking Voltage
vs. Temperature
Blocking Voltage (VP)
0.10
Load Current (A)
140
60
Typical Load Current vs. Load Voltage
(IF=2mA)
-4
160
Leakage Current (nA)
0.15
180
100
70
15
-40
Maximum Load Current vs. Temperature
DC-Only Configuration
(IF=2mA)
Maximum Load Current vs. Temperature
AC/DC Configuration
(IF=2mA)
Typical On-Resistance vs. Temperature
(IF=2mA, IL=70mA)
60
50
40
30
20
0.8
0.6
0.4
0.2
10
0
1
10
100
Load Voltage (V)
1000
0.0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
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R02
INTEGRATED CIRCUITS DIVISION
PLA194
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
PLA194 / PLA194S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
PLA194 / PLA194S
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
PLA194
Mechanical Dimensions
PLA194
8.382 ± 0.381
(0.330 ± 0.015)
PCB Hole Pattern
7.239 TYP
(0.285 TYP)
2.54 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
Pin 1
7.620 ± 0.254
(0.300 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
0.254 ± 0.0127
(0.010 ± 0.0005)
6.350 ± 0.127
(0.250 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
4.064 TYP
(0.160 TYP)
Dimensions
mm
(inches)
0.457 ± 0.076
(0.018 ± 0.003)
PLA194S
8.382 ± 0.381
(0.330 ± 0.015)
9.524 ± 0.508
(0.375 ± 0.020)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
PCB Land Pattern
2.54 ± 0.127
(0.100 ± 0.005)
2.54
(0.10)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
Dimensions
mm
(inches)
1.651 ± 0.254
(0.065 ± 0.010)
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R02
INTEGRATED CIRCUITS DIVISION
PLA194
PLA194STR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
K0 = 4.90
(0.19)
K1 = 3.80
(0.15)
P = 12.00
(0.472)
User Direction of Feed
Embossed
Carrier
Embossment
A0 = 10.10
(0.398)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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Specification: DS-PLA194-R02
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012