Si APD S10341 series Low bias operation, for 800 nm band, small package Features Applications Miniature and thin package: 1.8 × 3.1 × 1.0t mm Optical rangefinder Stable operation at low bias Laser radar High-speed response FSO (free space optics) High sensitivity Low noise General ratings Parameter Active area size*1 Effective active area Package Symbol A - S10341-05 φ0.5 S10341-02 φ0.2 0.03 Unit mm mm2 0.19 Plastic - Unit °C °C μA *1: Active area in which a typical gain can be obtained Absolute maximum ratings Parameter Operating temperature Storage temperature Symbol Topr Tstg Value -20 to +60 -40 to +80 Reverse current Forward current Irmax Ifmax 200 10 mA Electrical and optical characteristics (Ta=25 °C) Parameter Spectral response range Peak sensitivity wavelength Photo sensitivity Quantum efficiency Breakdown voltage Temperature coefficient of VBR Dark current Symbol λ λp S QE VBR ID Cut-off frequency fc Terminal capacitance Excess noise figure Gain Ct x M Condition M=100 λ=800 nm, M=1 λ=800 nm, M=1 ID=100 μA M=100 M=100, RL=50 Ω λ=800 nm, -3 dB M=100, f=1 MHz M=100 λ=800 nm S10341-02 Min. Typ. Max. 400 to 1000 800 0.5 75 150 200 0.65 50 500 S10341-05 Min. Typ. Max. 400 to 1000 800 0.5 75 150 200 0.65 100 1000 Unit nm nm A/W % V V/°C pA - 1000 - - 900 - MHz - 1 0.3 100 - - 2 0.3 100 - pF - www.hamamatsu.com 1 Si APD S10341 series Spectral response "# "$% &' λ$( % -$+ ' ) , -$% % & + ( ()* +," $" ! Quantum efficiency vs. wavelength ) * ( + & % ' # " KAPDB0020EC KAPDB0021EB Dark current vs. reverse voltage Gain vs. reverse voltage ˚ ) λ*! +% -. -. , -. $ -. ! ! & -. $ & ! ' (% KAPDB0192EA KAPDB0017ED 2 Si APD S10341 series Terminal capacitance vs. reverse voltage Excess noise factor vs. gain # =$" %&' () *+, ! !"# $%& " '()& " () -" *# λ"+# , *- -$ * λ". , " " ! KAPDB0193EB KAPDB0022EB Recommended solder reflow condition " · After unpacking, store this device in an environment at a temperature of 30 °C and a humidity below 60%, and perform reflow soldering on this device within 24 hours. · Thermal stress applied to the device during reflow soldering differs depending on the PC boards and reflow oven being used. · When setting the reflow conditions, make sure that the reflow soldering process does not degrade device reliability. & %" #$ '( #$ % % % % KAPDB0194EA 3 Si APD S10341 series Dimensional outline (unit: mm, tolerance unless otherwise noted: ±0.2 mm) 3 0 0 3 2 . / 1 * 3 * 0 0 ! * !$ ! 5 % !$ % & ' (≤ ) % * $ * "+, -, .% ! / & + %+, $ , # 4&% ! KAPDA0130EA = 2 29 2 22 = & !3 2 ,= 2 9@ $ ,2 2 ,2 2 2 2 5= 2 9& = ,2 , = 2 2& ,= % = 2 &, 92 = ,2 2& ,= 2 ,, , & ==1 A.B/A ,22& ,= 2 ==1 A.C/A , ,= ,2 22& = 2 &2 =2 2& ,2 2,2 2 2, = 2 = 2 2, 2 &2 ,2 2 = 22& ,2 , 9 & 9& = 2 & 9& 2 2 2 ,2 ,2 ,2 ,&$ 2 2,2$ 29 2 2 ,2 ,2 9 2 ,2 2 ,2 !"# # $#% & '()#*))* +, , - .* / )(#'('#(( 01- .* / )(#'('#) *' - 2, 2 - ("3 0 4 5 1 "6 3 52$ 2 + 3**37#36 3 , - . / 63*#!( #36"3 01- . / 63*#!( # ! * 82&- 89- 2:92$22 3 #*!! 22$ 2 82& , - .'6/ * )!#(7)#3 01- .'6/ * )!#!")#* 02- 02 4;- 6 4 2, 2 & 6 **! & 1 02 , - ((#. / "6 )( 7 33 01- ((#. / "6 )( 7 3 $ - ;- ! 2 2 3 4 < & 82 & 2= 22 ;7 5< $ , - .''/ 737#!6'*** 01- .''/ 737#(!)777 2 >2 ,- 2 5- ?$ ! ># 7 ' , - .'"/ *#)36#3( #33 01- .'"/ *#)36#3( #3 &- 4;- 2 " !33!3 2 . / & , - .(6/ 3!#6()#* #7(( 01- .(6/ 3!#6()#* #7' 4 Cat. No. KAPD1030E01 May 2011 DN