CPC1926 Single-Pole, Normally Open OptoMOS® Power SIP Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 250 0.7 1.4 Units VP Arms / ADC Description IXYS Integrated Circuits Division and IXYS have combined to bring OptoMOS® technology, reliability, and compact size to a new family of high-power, solid state relays. As part of that family, the CPC1926 is a single-pole, normally open (1-Form-A) solid state relay. Features The CPC1926 employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. The combination of low on-resistance and high load-current handling capabilities makes the relay suitable for a variety of high-performance switching applications. • • • • • • Handle Load Currents Up to 0.7 ADC/Arms 2500Vrms Input/Output Isolation Power SIP Package High Reliability No Moving Parts Low Drive Power Requirements (TTL/CMOS Compatible) • Arc-Free With No Snubbing Circuits • No EMI/RFI Generation • Machine Insertable, Wave Solderable Approvals • UL 508 Certified Component: File E69938 Applications • • • • • Industrial Controls Motor Control Robotics Medical Equipment—Patient/Equipment Isolation Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • IC Equipment • Home Appliances Ordering Information Part # CPC1926Y Description 4-Pin (8-Pin Body) Power SIP Package (25 per tube) Pin Configuration 1 - 2 + 3 4 Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD Pb DS-CPC1926-R06 ton e3 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1926 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input control Current Peak (10ms) Input Power Dissipation 1 Isolation voltage Input to Output Operational Temperature Storage Temperature 1 Ratings 250 5 50 1 150 2500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW Vrms °C °C Derate linearly 3.33 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current, Continuous Peak Load Current On-Resistance1 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance Input/Output 1 Conditions Symbol Min Typ Max Units Free air t < 10ms IL=100mA VL=250VP IL ILPK RON ILEAK - 1.2 - 0.7 ±3 1.4 1 Arms / ADC AP µA VL=50V, f=1MHz ton toff COUT - 2.3 0.022 60 10 10 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.6 0.9 - 3.75 1.2 - 10 1.4 10 mA mA V µA f=1MHz CI/O - 2 - pF IF=10mA, VL=10V ms pF Measurement taken within 1 second of on-time. Thermal Characteristics Parameter Thermal Resistance (junction to case) 2 Conditions Symbol Min Typ Max Units - RJC - 1.5 - °C/W www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1926 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=10mA, TA=25ºC) Typical Turn-On Time (N=50, IF=10mA, IL=5mADC, TA=25ºC) Device Count (N) 25 20 15 10 5 25 25 20 20 15 10 5 0 0 1.260 1.265 1.270 1.275 1.8 2.0 2.2 LED Forward Voltage (V) 2.4 35 30 30 Device Count (N) Device Count (N) 35 25 20 15 10 2.6 2.8 1.19 1.21 1.23 1.25 1.4 IF=50mA IF=20mA 1.2 IF=10mA 1.0 0.8 60 80 100 10 1.27 265 267 277 269 271 273 275 Blocking Voltage (VP) Typical Turn-Off vs. LED Forward Current (IL=100mADC) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 0 120 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA) Typical IF for Switch Operation vs. Temperature (IL=100mADC) Typical Turn-On vs. Temperature (IL=100mADC) Typical Turn-Off vs. Temperature (IL=100mADC) IF=10mA 1.2 0.06 1.0 0.8 0.6 IF=20mA 0.4 -20 0 20 40 60 Temperature (ºC) 80 100 0.05 IF=20mA 0.04 0.03 IF=10mA 0.02 0.01 0.2 0 50 0.07 1.4 Turn-On (ms) LED Current (mA) 0.025 15 Turn-Off (ms) 1.6 Turn-On (ms) LED Forward Voltage Drop (V) 1.8 -40 0.023 20 Typical Turn-On vs.LED Forward Current (IL=100mADC) Typical LED Forward Voltage Drop vs. Temperature 5.50 5.25 5.00 4.75 4.50 4.25 4.00 3.75 3.50 3.25 3.00 0.019 0.021 Turn-Off (ms) 25 On-Resistance (:) 40 0.017 0 1.17 20 0.015 5 0 0 5 Typical Blocking Voltage Distribution (N=50, TA=25ºC) 5 -20 10 Turn-On (ms) Typical On-Resistance Distribution (N=50, IF=10mA, IL=0.7ADC, TA=25ºC) -40 15 0 1.280 Turn-Off (ms) Device Count (N) 30 Device Count (N) 35 Typical Turn-Off Time (N=50, IF=10mA, IL=5mADC, TA=25ºC) 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 80 100 Temperature (ºC) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1926 PERFORMANCE DATA* Typical On-Resistance vs. Temperature (IF=10mA, IL=100mADC) Typical Load Current vs. Load Voltage (IF=10mA, TA=25ºC) 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 1.25 1.00 0.75 0.50 0.25 0.00 -0.25 -0.50 -0.75 -1.00 -1.25 -1.5 300 0.035 295 0.030 290 0.025 Leakage (PA) Blocking Voltage (VP) Blocking Voltage vs. Temperature 285 280 275 270 -1.0 0 -0.5 0.5 1.0 -20 0 20 40 60 Temperature (ºC) 80 100 1.0 0.8 0.6 IF=20mA 0.4 IF=10mA 0.2 -40 -20 0 20 40 60 80 Load Voltage (V) Temperature (ºC) Typical Leakage vs. Temperature Measured across Pins 3 & 4 (VL=250V) Energy Rating Curve Free Air, No Heat Sink 100 120 4.0 3.5 0.020 0.015 0.010 0 -40 1.2 0.0 1.5 0.005 265 260 -40 1.4 Load Current (ADC/Arms) Load Current (A) On-Resistance (:) 3.0 Load Current (A) 3.5 Maximum Load Current vs. Temperature 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 Temperature (ºC) 80 100 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1926 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1926Y MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1926Y 245ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R06 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1926 MECHANICAL DIMENSIONS CPC1926Y 21.082±0.381 (0.830±0.015) PCB Hole Pattern 3.302±0.051 (0.130±0.002) 10.160±0.127 (0.400±0.005) 1.75 (0.069) 7º TYP 4 Places Pin 1 1.778 (0.070) 0.762±0.076 (0.030±0.003) 2.540±0.127 (0.100±0.005) 4.572±0.127 (0.180±0.005) 10.160±0.127 (0.400±0.005) 5.080±0.127 (0.200±0.005) 1.651±0.102 (0.065±0.004) 5.080 (0.200) 10.160 (0.400) 1.016±0.127 (0.040±0.005) Pin 1 1.150 DIA. x4 (0.045 DIA. x4) 2.540 (0.100) 0.381±0.013 (0.015±0.0005) 1.778 (0.070) 7º TYP 4 Places Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1926-R06 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/17/2012