CPC3982

CPC3982
INTEGRATED CIRCUITS DIVISION
PRELIMINARY
V(BR)DSX /
V(BR)DGX
RDS(on)
(max)
IDSS (min)
Package
800V
380
20mA
SOT-23
Features
• High Breakdown Voltage: 800V
• Low VGS(off) Voltage: -1.4V to -3.1V
• Depletion Mode Device Offers Low RDS(on)
at Cold Temperatures
• High Input Impedance
• Small Package Size: SOT-23
Description
The CPC3982 is an N-channel, depletion mode, field
effect transistor (FET) that utilizes IXYS Integrated
Circuits Division’s proprietary third-generation vertical
DMOS process. The third-generation process realizes
world class, high voltage MOSFET performance
in an economical silicon gate process. Our vertical
DMOS process yields a robust device, with high
input impedance, for use in high-power applications.
The CPC3982 is a highly reliable device that has
been used extensively in our Solid State Relays for
industrial and telecommunications applications.
This device excels in power applications that require
low drain-source resistance, particularly in cold
environments such as automotive ignition modules.
Applications
•
•
•
•
•
•
•
N-Channel Depletion-Mode
Vertical DMOS FET
Constant Current Regulator
Ignition Modules
Normally-On Switches
Solid State Relays
Converters
Telecommunications
Power Supply
The CPC3982 has a minimum breakdown voltage of
800V, and is available in an SOT-23 package. As with
all MOS devices, the FET structure prevents thermal
runaway and thermal-induced secondary breakdown.
Ordering Information
Part #
CPC3982TTR
Package Pinout
Description
N-Channel Depletion Mode FET, SOT-23 Pkg.
Tape and Reel (3000/Reel)
Circuit Symbol
D
D
3
G
1
G
2
S
S
(SOT-23)
DS-CPC3982-R00D
PRELIMINARY
1
INTEGRATED CIRCUITS DIVISION
CPC3982
PRELIMINARY
Absolute Maximum Ratings @ 25ºC (Unless Otherwise Noted)
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Pulsed Drain Current
Total Package Dissipation 1
Junction Temperature
Operational Temperature
Storage Temperature
1
Ratings
800
±15
150
0.4
125
-55 to +110
-55 to +125
Units
V
V
mA
W
ºC
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Mounted on 1"x1" 2 oz. Copper FR4 board.
Electrical Characteristics @ 25ºC (Unless Otherwise Noted)
Source-Drain Diode Voltage Drop
Thermal Resistance, Junction to Ambient
2
Symbol
BVDSX
VGS(off)
dVGS(off) /dT
IGSS
ID(off)
IDSS
RDS(on)
dRDS(on) /dT
GFS
CISS
COSS
CRSS
VSD
JA
Conditions
VGS= -5.5V, ID=100µA
VDS= 15V, ID=1A
VDS= 15V, ID=1A
VGS=±15V, VDS=0V
VGS= -5.5V, VDS=800V
VGS= 0V, VDS=15V
VGS= 0V, ID=20mA, VDS=10V
ID= 10mA, VDS = 10V
VGS= -3.5V
Min
800
-1.4
20
15
VDS= 25V
-
f= 1MHz
VGS= -5V, ISD=5mA
-
-
PRELIMINARY
Typ
20
2.2
13
Max
-3.1
4.5
100
1
380
2.5
-
Units
V
V
mV/ºC
nA
µA
mA

%/ºC
m
-
pF
0.6
250
1
-
V
ºC/W

Parameter
Drain-to-Source Breakdown Voltage
Gate-to-Source Off Voltage
Change in VGS(off) with Temperature
Gate Body Leakage Current
Drain-to-Source Leakage Current
Saturated Drain-to-Source Current
Static Drain-to-Source On-State Resistance
Change in RDS(on) with Temperature
Forward Transconductance
Input Capacitance
Common Source Output Capacitance
Reverse Transfer Capacitance
R00D
INTEGRATED CIRCUITS DIVISION
CPC3982
PRELIMINARY
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
60
Output Characteristics
30
50
25
40
20
VGS= 0V
VGS= -1V
gm (mS)
ID (mA)
20
Transconductance vs. Drain Current
(VDS=10V)
15
10
5
ID (mA)
25
Input Admittance
(VDS=10V)
30
15
VGS= -1.2V
20
10
10
5
0
0
VGS= -1.4V
VGS= -1.6V
0
-2.5
-2.0
-1.5
VGS (V)
-0.5
0
5
10
ID (mA)
On-Resistance vs. Drain Current
(VGS=0V)
360
100
15
0
20
2
4
6
VDS (V)
8
10
12
Capacitance vs. Drain-Source Voltage
(VGS= -3.5V)
340
Capacitance (pF)
On-Resistance (:)
-1.0
320
300
280
CISS
10
COSS
260
CRSS
240
1
0
5
10
15
ID (mA)
20
25
30
0
5
10
15
VDS (V)
20
25
30
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R00D
PRELIMINARY
3
INTEGRATED CIRCUITS DIVISION
CPC3982
PRELIMINARY
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC3982T
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC3982T
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
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PRELIMINARY
R00D
INTEGRATED CIRCUITS DIVISION
CPC3982
PRELIMINARY
Mechanical Dimensions
CPC3982T
0º / 5º
Recommended PCB Land Pattern
2.92±0.12
(0.115 / 0.005)
3
2.30±0.20
(0.090±0.008)
0.48 typ
(0.019 typ)
1.30±0.10
(0.051±0.004)
1
0.15±0.01
(0.006±0.0004)
0.25 typ
(0.010 typ)
0.94±0.06
(0.037±0.002)
0.05±0.05
(0.002±0.002)
0.95
(0.037)
2
0.44±0.06
(0.018±0.002)
0.99±0.10
(0.039±0.004)
2.20
(0.087)
0.95
(0.037)
0.65
(0.026)
GAUGE PLANE
Dimensions
mm
Notes: (Unless otherwise specified)
(inches)
1. All dimensions are in mm (inches).
2. Reference JEDEC outline: TO-236AB.
3. Package outline dimensions inclusive of metal burrs.
4. Package outline exclusive of mold flash. Mold flash shall not exceed 0.127 (0.005).
5. Package outline exclusive of lead finish plating.
0.95 typ
(0.037 typ)
1.90 typ
(0.075 typ)
CPC3982TTR Tape & Reel
4.00±0.10
(0.157±0.004)
2.00±0.05
(0.079±0.002)
1.75±0.10
(0.069±0.004)
177.8 DIA.
(7.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
2.77±0.10
(0.109±0.004)
A
‡1.55±0.05
(‡0.061±0.002)
8.00±0.10
(0.315±0.004)
A
2.20 ref
(0.087 ref)
4.00±0.10
(0.157±0.004)
1.22±0.10
(0.048±0.004)
Embossed Carrier
0.61 ref
(0.024 ref)
Dimensions
mm
(inches)
1.09 ref
(0.043 ref)
Section A-A
Embossment
3.15±0.10
(0.124±0.004)
‡1.00 +0.10 -0.00
(‡0.039 +0.004 - 0.000)
NOTES:
1. All dimensions are shown in mm (inches).
2. Cumulative tolerance of 10 sprocket holes is ±0.02 (0.008).
3. Material: conductive polycarbonate.
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
5
Specification: DS-CPC3982-R00D
©Copyright 2015, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
4/10/2015