CPC3703

CPC3703
250V N-Channel
Depletion-Mode FET
INTEGRATED CIRCUITS DIVISION
V(BR)DSX /
V(BR)DGX
RDS(on)
(max)
IDSS (min)
Package
250V
4
360mA
SOT-89
Features
•
•
•
•
High Breakdown Voltage: 250V
Low On-Resistance: 4 max. at 25ºC
Low VGS(off) Voltage: -1.6 to -3.9V
Depletion Mode Device Offers Low RDS(on)
at Cold Temperatures
• High Input Impedance
• Small Package Size: SOT-89
Applications
•
•
•
•
•
•
Ignition Modules
Normally-On Switches
Solid State Relays
Converters
Telecommunications
Power Supply
Description
The CPC3703 is an N-channel, depletion mode, field
effect transistor (FET) that utilizes IXYS Integrated
Circuits Division’s proprietary third-generation vertical
DMOS process. The third-generation process realizes
world class, high voltage MOSFET performance
in an economical silicon gate process. Our vertical
DMOS process yields a robust device, with high
input impedance, for use in high-power applications.
The CPC3703 is a highly reliable device that has
been used extensively in our Solid State Relays for
industrial and telecommunications applications.
This device excels in power applications that require
low drain-source resistance, particularly in cold
environments such as automotive ignition modules.
The CPC3703 offers a low, 4 maximum, on-state
resistance at 25ºC.
The CPC3703 has a minimum breakdown voltage of
250V, and is available in an SOT-89 package. As with
all MOS devices, the FET structure prevents thermal
runaway and thermal-induced secondary breakdown.
Ordering Information
Part #
CPC3703CTR
Package Pinout
Description
N-Channel Depletion Mode FET, SOT-89 Pkg.
Tape and Reel (1000/Reel)
Circuit Symbol
D
D
G
G
D
S
S
(SOT-89)
DS-CPC3703-R07
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1
INTEGRATED CIRCUITS DIVISION
CPC3703
Absolute Maximum Ratings @ 25ºC (Unless Otherwise Noted)
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Pulsed Drain Current
Total Package Dissipation 1
Junction Temperature
Operational Temperature, Ambient
Storage Temperature
1
Ratings
250
±15
600
1.1
125
-55 to +125
-55 to +125
Units
VP
VP
mA
W
ºC
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Mounted on 1"x1"x0.062" FR4 board.
Electrical Characteristics @ 25ºC (Unless Otherwise Noted)
Symbol
V(BR)DSX
VGS(off)
dVGS(off) /dT
IGSS
Drain-to-Source Leakage Current
Conditions
VGS= -5V, ID=100µA
VDS= 5V, ID=1mA
VDS= 5V, ID=1A
VGS=±15V, VDS=0V
VGS= -5V, VDS=250V
VGS= -5V, VDS=200V, TA=125ºC
VGS= 0V, VDS=15V
ID(off)
Saturated Drain-to-Source Current
Static Drain-to-Source On-State Resistance
Change in RDS(on) with Temperature
Forward Transconductance
Input Capacitance
Common Source Output Capacitance
Reverse Transfer Capacitance
IDSS
RDS(on)
dRDS(on) /dT
GFS
CISS
COSS
CRSS
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
td(on)
tr
td(off)
tf
Source-Drain Diode Voltage Drop
Thermal Resistance (Junction to Ambient)
VSD
RJA
VGS= 0V, ID=200mA
ID= 100mA, VDS = 10V
VGS= -5V
VDS= 25V
Max
-3.9
4.5
100
1
1
4
1.1
350
65
35
-
23
8
17
70
35
20
25
80
-
0.6
90
1.8
-
f= 1MHz
VDD= 25V
ID= 150mA
VGS= 0V to -10V
Rgen= 50
VGS= -5V, ISD=150mA
-
Units
V
V
mV/ºC
nA
µA
mA
mA

%/ºC
m
pF
ns
V
ºC/W
VDD
RL
0V
90%
PULSE
GENERATOR
INPUT
10%
OUTPUT
Rgen
t on
t d(on)
VDS
Typ
327
51
27
-
Switching Waveform & Test Circuit
-10V
Min
250
-1.6
360
225

Parameter
Drain-to-Source Breakdown Voltage
Gate-to-Source Off Voltage
Change in VGS(off) with Temperature
Gate Body Leakage Current
t off
tf
t d(off)
tr
D.U.T.
90%
90%
INPUT
OUTPUT
0V
2
10%
10%
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R07
INTEGRATED CIRCUITS DIVISION
CPC3703
PERFORMANCE DATA (@25ºC Unless Otherwise Noted)*
VGS=-1.0
ID (mA)
ID (mA)
VGS=-1.5
VGS=-2.0
350
8
300
7
250
6
200
1
2
3
VDS (V)
4
5
+125ºC
150
+25ºC
-55ºC
50
0
-3.5
6
VGS(off) Vs. Temperature
(VDS=10V, ID=1mA)
5
4
3
100
VGS=-2.5
0
RDS(on) (:)
1000
900
800
700
600
500
400
300
200
100
0
RDS(on) Vs. Temperature
(VGS=0V, ID=200mA)
Instantaneous Transfer Characteristics
(VDS=5V, TA=TJ)
Output Characteristics
-3.0
-2.5
VGS (V)
2
-2.0
1
-1.5
0
50
300
-55ºC
+25ºC
+125ºC
250
-2.5
GFS (m )
0.1
200
ID (A)
:
VGS(off) (V)
150
Transconductance vs. Drain Current
(VDS=10V, TA=TJ)
1
-3.0
100
Temperature (ºC)
Maximum Rated Safe Operating Area
-2.0
-50
0.01
150
100
-3.5
50
0
50
100
150
0.1
Temperature (ºC)
10
VDS (V)
Power Dissipation
vs. Ambient Temperature
Capacitance vs. Drain-Source Voltage
(VGS=-5V)
1.2
1
100
0
1000
0.6
0.4
0.2
450
CISS
375
300
225
COSS
150
CRSS
75
0
0.0
0
20
40
60
80
100
Temperature (ºC)
120
140
0
10
20
VDS (V)
20
30
40
50
60
70
80
90 100
On-Resistance vs. Drain Current
(VGS=0V)
525
0.8
10
ID (mA)
600
1.0
Capacitance (pF)
Power Dissipation (W)
0
0.001
-50
RDS(on) (:)
-4.0
30
40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
ID (A)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R07
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INTEGRATED CIRCUITS DIVISION
CPC3703
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC3703C
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC3703C
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
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R07
INTEGRATED CIRCUITS DIVISION
CPC3703
Mechanical Dimensions
CPC3703C
1.626 / 1.829
(0.064 / 0.072)
1.397 / 1.600
(0.055 / 0.063)
R 0.254
(R 0.010)
PCB Land Pattern
1.90
(0.075)
3.937 / 4.242
(0.155 / 0.167)
45º
2.286 / 2.591
(0.090 / 0.102)
2.45
(0.096)
1.40
(0.055)
Pin 1
0.889 / 1.194
(0.035 / 0.047)
0.356 / 0.483
(0.014 / 0.019)
0.432 / 0.559
(0.017 / 0.022)
50º
0.356 / 0.432
(0.014 / 0.017)
0.864 / 1.016
(0.034 / 0.040)
4.394 / 4.597
(0.173 / 0.181)
1.118 / 1.270
(0.044 / 0.050)
50º
5.00
(0.197)
1.90
(0.074)
0.432 / 0.508
(0.017 / 0.020)
0.60
(0.024)
TYP 3
2.845 / 2.997
(0.112 / 0.118)
1.422 / 1.575
(0.056 / 0.062)
2.921 / 3.073
(0.115 / 0.121)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
CPC3703CTR Tape & Reel
177.8 Dia
(7.00 Dia)
5.50 ± 0.05
(0.217 ± 0.002)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.1
(0.157 ± 0.004)
W=12.00 ± 0.3
(0.472 ± 0.012)
B0=4.60 ± 0.1
(0.181 ± 0.004)
K0=1.80 ± 0.1
(0.071 ± 0.004)
Embossed
Carrier
1.75 ± 0.1
(0.069 ± 0.004)
A0=4.80 ± 0.1
(0.189 ± 0.004)
P=8.00 ± 0.1
(0.315 ± 0.004)
Embossment
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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Specification: DS-CPC3703-R07
©Copyright 2014, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
8/1/2014