CPC1125N

CPC1125N
Single-Pole, Normally Closed
4-Pin SOP OptoMOS®Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to Operate
Rating
400
100
35
2
Units
VP
mArms / mADC

mA
Description
CPC1125N is a miniature single-pole, normally closed
(1-Form-B) solid state relay. It uses IXYS Integrated
Circuits Division’s patented, optically coupled,
OptoMOS architecture to provide 1500Vrms of
input/output isolation in a small 4-Pin SOP package.
CPC1125N uses IXYS Integrated Circuits Division’s
state of the art double-molded vertical construction
packaging to produce one of the world’s smallest
relays. It is ideal for replacing larger, less-reliable reed
and electromechanical relays.
Features
• 1500Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 4-Pin SOP Package
• Machine Insertable, Wave Solderable
• Tape & Reel Version Available
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1172007
• Certified to:
IEC60950-1: 2005
EN60950-1: 2006
TUV Certificate: B 09 07 49410 006
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket
Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Ordering Information
Part #
CPC1125N
CPC1125NTR
Description
4-Pin SOP (100/tube)
4-Pin SOP (2000/reel)
Pin Configuration
+ Control
– Control
1
4
Load
3
2
Load
Switching Characteristics of
Normally Closed Devices
Form-B
IF
ILOAD
90%
10%
toff
DS-CPC1125N-R03
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ton
1
INTEGRATED CIRCUITS DIVISION
CPC1125N
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Total Power Dissipation 1
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Ratings
400
5
50
1
150
400
1500
-40 to +85
-40 to +125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Derate linearly 3.33 mw / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous 1
Peak
On-Resistance 2
Switching Speeds
Turn-On
Turn-Off
Off-State Leakage Current
Output Capacitance
Input Characteristics
Input Control Current to Activate 3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
1
2
3
2
Conditions
Symbol
Min
Typ
Max
Units
IF=0mA
t =10ms
IL=100mA
IL
ILPK
RON
-
26
100
±350
35
mArms / mADC
mAP

IF=5mA, VL=10V
ton
toff
VL=400V, IF=2mA
IF=2mA, VL= 50V, f=1MHz
ILEAK
COUT
-
0.31
0.30
6
2
2
5
-
IL=100mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.1
0.9
-
1.2
-
2
1.4
10
mA
mA
V
µA
1
-
pF
CI/O
Load current derates linearly from 100mA @ 25oC to 60mA @ 85oC.
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60°C) a LED drive current of 4mA is recommended.
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ms
µA
pF
R03
INTEGRATED CIRCUITS DIVISION
CPC1125N
PERFORMANCE DATA*
15
10
5
15
10
5
Device Count (N)
10
5
0
0.26
0.14
0.16
0.18
0.20
LED Current (mA)
0.20
25
15
10
5
50
24
25
25
26
27
On-Resistance (:)
28
10
800
600
400
0
10
2000
1.3
1.2
IF=10mA
IF=5mA
IF=2mA
-20
420 430 440 450 460
Blocking Voltage (VP)
314
312
310
0
1600
1200
10
IF=5mA
800
400
20
30
LED Current (mA)
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
40
50
Typical Turn-On Time
vs. Temperature
(IL=60mA)
450
400
350
300
250
IF=5mA
200
IF=2mA
150
0
470
Typical Turn-On Time
vs. LED Forward Current
(IL=60mA, TA=25ºC)
500
0
1.0
-40
410
316
50
Turn-On Time (Ps)
1.4
1.1
40
IF=2mA
Turn-Off Time (Ps)
1.5
20
30
LED Current (mA)
Typical Turn-Off Time
vs. Temperature
(IL=60mA)
Typical LED Forward Voltage Drop
vs. Temperature
IF=50mA
IF=20mA
5
306
0
1.6
10
308
200
0
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55
Forward Voltage (V)
15
318
Turn-On Time (Ps)
Turn-Off Time (Ps)
20
0.38
20
400
1000
30
0.26 0.29 0.32 0.35
Turn-Off Time (ms)
Typical Blocking Voltage Distribution
(N=50, IF=2mA, TA=25ºC)
28
Typical Turn-Off Time
vs. LED Forward Current
(IL=60mA, TA=25ºC)
1200
40
0.23
0
0.22
Typical LED Forward Voltage
vs. Forward Current
(TA=25ºC)
10
0.36
0
0.12
LED Forward Voltage (V)
0.28 0.30 0.32 0.34
Turn-On Time (ms)
Typical On-Resistance Distribution
(N=50, IF=0mA, IL=100mA, TA=25ºC)
20
15
15
0
0.24
1.275
20
20
5
Device Count (N)
1.255 1.260 1.265 1.270
LED Forward Voltage (V)
Form-B IF for Switch Operation
(N=50, IL=120mA, TA=25ºC)
25
Device Count (N)
25
20
0
1.250
Typical Turn-Off Time
(N=50, IF=5mA, IL=60mA, TA=25ºC)
30
Device Count (N)
20
0
Forward Current (mA)
Typical Turn-On Time
(N=50, IF=5mA, IL=60mA, TA=25ºC)
25
Device Count (N)
Device Count (N)
25
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R03
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INTEGRATED CIRCUITS DIVISION
CPC1125N
PERFORMANCE DATA*
0.8
45
On-Resistance (:)
0.6
0.5
0.4
0.3
0.2
0.1
35
30
25
-20
0
20
40
60
Temperature (ºC)
80
100
110
Blocking Voltage (VP)
90
80
70
60
-20
0
20
40
60
Temperature (ºC)
80
-20
0
20
40
60
Temperature (ºC)
Output Capacitence (pF)
70
80
100
455
450
445
-20
0
20
40
60
Temperature (ºC)
1.0
60
50
40
30
20
10
0
1
-2
-1
0
1
Load Voltage (V)
2
3
Leakage Current vs. Temperature
Measured Across Pins 3 & 4
(IF=2mA, VL=400V)
4
3
2
1
0
-40
Output Capacitance vs. Load Voltage
(IF=2mA, f=1MHz, TA=25ºC)
0.1
-3
5
460
Load Current (A)
-40
0
-50
100
440
50
50
Typical Blocking Voltage
vs. Temperature
(IF=5mA)
465
100
100
-150
-40
Maximum Load Current
vs. Temperature
(IF=0mA)
Typical Load Current vs. Load Voltage
(IF=0mA, TA=25ºC)
-100
20
-40
Load Current (mA)
40
150
Leakage Current (PA)
LED Current (mA)
0.7
Typical On-Resistance vs. Temperature
(IF=0mA, IL=60mA)
Load Current (mA)
Typical IF for Switch Operation
(IL=60mA)
10
100
Load Voltage (V)
1000
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
(TA=25ºC)
0.8
0.6
0.4
0.2
0.0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R03
INTEGRATED CIRCUITS DIVISION
CPC1125N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1125N
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1125N
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
R03
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INTEGRATED CIRCUITS DIVISION
CPC1125N
MECHANICAL DIMENSIONS
CPC1125N
4.089 ± 0.203
(0.161 ± 0.008)
Recommended PCB Land Pattern
0.200 ± 0.025
(0.008 ± 0.001)
0.60
(0.0217)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.076
(0.150 ± 0.003)
0.432 ± 0.127
(0.017 ± 0.005)
5.60
(0.2205)
1.02 ± 0.025
(0.040 ± 0.001)
Pin 1
2.54 Typ
(0.100 Typ)
1.30
(0.0512)
2.184 Max
(0.086 Max)
2.54
(0.10)
Lead to package standoff:
0.0637 ± 0.0383
(0.0025 ± 0.0015)
0.762 ± 0.102
(0.030 ± 0.004)
Dimensions
mm
(inches)
0.381 TYP.
(0.015 TYP.)
CPC1125NTR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=12.00
(0.472)
B0=4.70
(0.185)
K0=2.70
(0.106)
K1=2.30
(0.091)
P=8.00
(0.315)
A0=6.50
(0.256)
User Direction of Feed
Dimensions
mm
(inches)
Embossed
Carrier
Embossment
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1125N-R03
©Copyright 2014, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
3/26/2014
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