CPC1002N

CPC1002N
60V Normally-Open Single-Pole
4-Pin SOP OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to operate
Rating
60
700
0.55
2
Description
Units
VP
mADC

mA
Features
• Designed for use in Security Systems Complying
with EN50130-4
• Only 2mA of LED Current Required to Operate
• Small 4-Pin SOP Package
• 100% Solid State
• High Reliability
• Arc-Free With No Snubbing Circuits
• 1500Vrms Input/Output Isolation
• No EMI/RFI Generation
• Immune to Radiated EM Fields
• Wave Solderable
• Tape & Reel Version Available
Applications
• Security
• Passive Infrared Detectors (PIR)
• Data Signalling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
The CPC1002N is a miniature, normally-open
(1-Form-A) DC solid state relay in a 4-pin SOP
package that employs optically coupled MOSFET
technology to provide 1500Vrms of input to output
isolation. The super-efficient MOSFET switches and
photovoltaic die use IXYS Integrated Circuits Division’s
patented OptoMOS architecture. The optically coupled
output is controlled by the input's highly efficient
infrared LED.
The CPC1002N uses IXYS Integrated Circuits
Division’s state of the art double-molded vertical
construction packaging to produce one of the world’s
smallest relays. The CPC1002N offers board space
savings of at least 20% over the competitor’s larger
4-pin SOP relay.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
Certificate B 13 12 82667 003
Ordering Information
Part #
CPC1002N
CPC1002NTR
Description
4-Pin SOP (100/tube)
4-Pin SOP (2000/reel)
Pin Configuration
+ Control
– Control
1
4
3
2
DC +
DC -
Switching Characteristics
of Normally-Open Devices
Form-A
IF
90%
10%
ILOAD
ton
DS-CPC1002N-R06
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1
INTEGRATED CIRCUITS DIVISION
CPC1002N
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Total Power Dissipation 1
Isolation Voltage Input to Output
Operational Temperature
Storage Temperature
1
Ratings
60
5
50
1
70
400
1500
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
Derate linearly 3.33 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current, Continuous 1
Peak Load Current
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate 3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
1
2
3
2
Conditions
Symbol
Min
Typ
Max
Units
IF=2mA
t=10ms
IL=100mA
VL=60VP
IL
ILPK
RON
ILEAK
-
0.35
-
700
1
0.55
1
mADC
AP

IF=0mA, VL=50V, f=1MHz
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COUT
-
1.3
0.41
25
5
2
-
IL=100mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.3
0.9
-
0.55
1.2
-
2
1.4
10
mA
mA
V
A
VIO=0V, f=1MHz
CIO
-
1
-
pF
IF=3mA, VL=10V
25oC
A
ms
pF
@80oC.
Load current derates linearly from 700mA @
to 420mA
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 3mA is recommended.
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INTEGRATED CIRCUITS DIVISION
CPC1002N
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
25
Device Count (N)
Device Count (N)
30
25
20
15
10
5
20
15
10
5
1.17
1.19
1.21
1.23
1.25
1.0
1.1
1.2
1.3
1.4
Turn-On Time (ms)
LED Forward Voltage Drop (V)
Typical IF for Switch Operation
(N=50, IL=100mA)
35
20
15
10
15
10
0
0
0.45
0.50
0.55 0.60 0.65 0.70
LED Current (mA)
0.39
0.40 0.41 0.42
Turn-Off Time (ms
0.43
0.44
Typical On-Resistance Distribution
(N=50, IL=100mA)
30
20
5
5
35
25
5
10
0.38
Device Count (N)
25
15
1.6
30
Device Count (N)
Device Count (N)
1.5
Typical IF for Switch Dropout
(N=50, IL=100mA)
35
30
20
0
0
0
Typical Turn-Off Time
(N=50, IF=3mA, IL=100mA)
25
Device Count (N)
35
Typical Turn-On Time
(N=50, IF=3mA, IL=100mA)
25
20
15
10
5
0
0.45
0.75
0.50
0.55 0.60 0.65 0.70
LED Current (mA)
0.32
0.75
0.33
0.34
0.35
0.36
0.37
0.38
On-Resistance (:)
Typical Blocking Voltage Distribution
(N=50)
35
Device Count (N)
30
25
20
15
10
5
0
68
IF=50mA
IF=20mA
IF=10mA
1.5
1.4
1.3
1.2
1.1
1.0
-40
IF=5mA
IF=2mA
IF=1mA
-20
0
20
40
60
Temperature (ºC)
80
100
70
71
72
73
Blocking Voltage (VP)
74
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
10
9
8
7
6
5
4
3
2
1
0
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
0.7
0.6
Turn-Off Time (ms)
1.6
Turn-On Time (ms)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
69
0.5
0.4
0.3
0.2
0.1
0
0
5
10
15
20
25
30
35
40
LED Forward Current (mA)
45
50
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R06
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INTEGRATED CIRCUITS DIVISION
CPC1002N
-40
1.50
-20
0
20
40
60
80
1.2
On-Resistance (:)
0
20
40
60
80
Temperature (ºC)
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
Typical IF for Switch Dropout
vs. Temperature
(IL=100mA)
1.50
0.50
-40
-20
0
20
40
60
80
100
0.2
-40
0.75
0
20
40
60
Temperature (ºC)
80
Typical Load Current vs. Load Voltage
(IF=2mA)
0.50
-20
0
20
40
60
80
300
200
100
0
100
0
0.05
0.10
0.15
0.20
0.25
Temperature (ºC)
Temperature (ºC)
Load Voltage (V)
Typical Maximum Load Current
vs. Temperature
Typical Blocking Voltage
vs. Temperature
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(VL=60V)
0.014
72
0.012
600
500
IF=5mA
400
IF=2mA
300
200
100
0
Leakage (PA)
0.016
74
Blocking Voltage (VP)
76
800
700
70
68
66
0
20
40
60
80
100
Temperature (ºC)
0.010
0.008
0.006
0.002
-40
120
0.30
0.004
64
62
-20
100
400
900
-40
-20
500
1.00
0
-40
0
0.4
600
0.25
0.25
IF=5mA
0.6
100
1.25
0.75
IF=2mA
0.8
0
-20
Temperature (ºC)
1.00
Typical On-Resistance vs. Temperature
(IL=100mA)
1.0
-40
LED Current (mA)
LED Current (mA)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
100
1.25
Load Current (mA)
Typical Turn-Off Time vs. Temperature
(IF=3mA, IL=100mA)
Load Current (mA)
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0
Typical Turn-On Time vs. Temperature
(IF=3mA, IL=100mA)
Turn-Off Time (ms)
Turn-On Time (ms)
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
-20
0
20
40
60
Temperature (ºC)
80
100
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Load Current (A)
Energy Rating Curve
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
10Ps 100Ps 1ms 10ms 100ms
1s
10s
100s
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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INTEGRATED CIRCUITS DIVISION
CPC1002N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1002N
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
Maximum Reflow Cycles
CPC1002N
260ºC for 30 seconds
3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
CPC1002N
MECHANICAL DIMENSIONS
CPC1002N
4.089 ± 0.203
(0.161 ± 0.008)
Recommended PCB Land Pattern
0.200 ± 0.025
(0.008 ± 0.001)
0.60
(0.0217)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.076
(0.150 ± 0.003)
0.432 ± 0.127
(0.017 ± 0.005)
5.60
(0.2205)
1.02 ± 0.025
(0.040 ± 0.001)
Pin 1
2.54 Typ
(0.100 Typ)
1.30
(0.0512)
2.184 Max
(0.086 Max)
2.54
(0.10)
Pin to package standoff:
0.0637 ± 0.0383
(0.0025 ± 0.0015)
0.762 ± 0.102
(0.030 ± 0.004)
Dimensions
mm
(inches)
0.381 TYP.
(0.015 TYP.)
CPC1002NTR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=12.00
(0.472)
B0=4.70
(0.185)
K0=2.70
(0.106)
K1=2.30
(0.091)
P=8.00
(0.315)
A0=6.50
(0.256)
User Direction of Feed
Dimensions
mm
(inches)
Embossed
Carrier
Embossment
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1002N-R06
©Copyright 2014, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
9/24/2014