CPC1706

CPC1706
Single-Pole, Normally Open
4-Pin OptoMOS® DC Power SIP Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
60
4
0.09
Description
Units
VP
ADC

Features
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability,
and compact size to a new family of high power solid
state relays. The CPC1706, a DC-switching, normally
open (1-Form-A) Solid State Relay, is part of that
family.
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Employing optically coupled MOSFET technology,
the CPC1706 provides 2500Vrms of input to output
isolation. The relay output is constructed with efficient
MOSFET switches that use IXYS Integrated Circuits
Division's patented OptoMOS architecture. The input,
a highly efficient infrared LED, controls the optically
coupled output.
Handle Load Currents Up to 4ADC
2500Vrms Input/Output Isolation
Power SIP Package
High Reliability
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Flammability Rating UL 94 V-0
Applications
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Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
IC Equipment
Home Appliances
The combination of low on-resistance and high load
current handling capability makes this relay suitable for
a variety of high performance switching applications.
Approvals
• UL 508 Certified Component: File E69938
• CSA Certified Component: Certificate 1172007
Ordering Information
Part #
CPC1706Y
Description
4-Pin (8-Pin Body) Power SIP Package (25 per tube)
Pin Configuration
Switching Characteristics of
Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
DS-CPC1706-R04
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INTEGRATED CIRCUITS DIVISION
CPC1706
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Min
-40
-40
Max
60
5
50
1
150
1600
2500
+85
+125
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Derate linearly 3.33 mW / ºC
Derate linearly 16.667 mW / ºC
2
Electrical Characteristics @ 25ºC (Unless Otherwise Noted)
Parameter
Output Characteristics
Load Current, Continuous
Peak Load Current
On-Resistance 1
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Input/Output Characteristics
Capacitance Input-to-Output
1
Conditions
Symbol
Min
Typ
Max
Units
IF=5mA, Free air
IF=5mA, t=10ms
IF=5mA, IL=1A
IF=0mA, VL=60VP
IL
ILPK
RON
ILEAK
-
0.07
-
4
9
0.09
1
ADC
A

µA
IF=0mA, VL=50V, f=1MHz
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COUT
-
0.5
0.085
75
5
2
-
IL=1A
IF=5mA
VR=5V
IF
IF
VF
IR
0.4
0.9
-
1.4
1.2
-
5
1.4
10
mA
mA
V
µA
VIO=0V, f=1MHz
CIO
-
2
-
pF
Conditions
Symbol
Min
Typ
Max
Units
-
JC
-
1.5
-
°C/W
IF=5mA, VL=10V
ms
pF
Measurement taken within 1 second of on-time.
Thermal Characteristics
Parameter
Thermal Impedance (junction to case)
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INTEGRATED CIRCUITS DIVISION
CPC1706
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
15
10
15
10
5
5
0
0
5
0
0.075 0.080 0.085 0.090 0.095 0.100 0.105
Turn-Off Time (ms)
Typical IF for Switch Operation
(N=50, IL=1A)
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=1A)
Typical Blocking Voltage Distribution
(N=50)
10
5
20
Device Count (N)
Device Count (N)
20
15
15
10
5
1.2
1.4
1.5
1.6
LED Current (mA)
1.5
1000
1.4
1.3
1.8
IF=50mA
IF=20mA
IF=10mA
IF=5mA
-20
Typical Turn-On
vs. LED Forward Current
(IL=75mA)
600
400
82.0 82.5 83.0 83.5
Blocking Voltage (VP)
84.0
100
95
90
200
0
0
20
40
60
Temperature (ºC)
80
100
85
0
Typical IF for Switch Operation
vs. Temperature
(IL=1A)
650
Turn-On Time (Ps)
1.7
1.6
1.5
1.4
10
20
30
40
LED Forward Current (mA)
50
0
20
40
60
Temperature (ºC)
80
100
130
IF=5mA
550
450
400
350
IF=10mA
300
10
20
30
40
LED Forward Current (mA)
Typical Turn-Off vs. Temperature
(IL=75mA)
110
100
IF=10mA
90
IF=5mA
80
-20
0
20
40
60
Temperature (ºC)
50
120
500
200
-40
0
Typical Turn-On vs. Temperature
(IL=75mA)
250
-20
81.5
Typical Turn-Off
vs. LED Forward Current
(IL=75mA)
105
800
600
1.3
-40
5
81.0
Turn-Off Time (Ps)
1200
Turn-On Time (Ps)
1.6
1.1
-40
10
0.058 0.062 0.066 0.070 0.074 0.078 0.082
On-Resistance (:)
1.8
Typical LED Forward Voltage Drop
vs. Temperature
1.2
15
0
0
1.1
LED Forward Voltage (V)
10
0.290 0.375 0.460 0.545 0.630 0.715 0.800
Turn-On Time (ms)
0
LED Forward Current (mA)
15
1.235 1.240 1.245 1.250 1.255 1.260 1.265
LED Forward Voltage (V)
20
Device Count (N)
20
Device Count (N)
20
Typical Turn-Off Time
(N=50, IF=5mA, IL=75mA)
20
Turn-Off Time (Ps)
Device Count (N)
25
Typical Turn-On Time
(N=50, IF=5mA, IL=75mA)
25
Device Count (N)
30
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
80
100
70
-40
-20
0
20
40
60
Temperature (ºC)
80
100
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R04
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INTEGRATED CIRCUITS DIVISION
CPC1706
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
0.10
DC-Only On-Resistance
vs. Temperature
(IF=5mA, IL=1A)
Typical Load Current
vs. Load Voltage
(IF=5mA)
4.0
Maximum Load Current
vs. Temperature
4.5
0.08
0.07
0.06
4.0
Load Current (A)
0.09
Load Current (A)
On-Resistance (:)
3.5
3.0
2.5
2.0
1.5
1.0
0
20
40
60
Temperature (ºC)
80
100
Blocking Voltage vs. Temperature
70
Leakage Current (nA)
Blocking Voltage (VP)
86
84
82
80
78
76
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.10
0.15
0.20
Load Voltage (V)
0.25
-40
0.30
Typical Leakage vs. Temperature
Measured Across Pins 3 & 4
(VL=60V)
-20
0
20
40
60
Temperature (ºC)
80
100
Output Capacitance vs. Load Voltage
500
60
50
40
30
20
10
0
-40
2.5
1.5
0.05
Output Capacitance (pF)
-20
0.0
0.00
3.0
2.0
0.5
0.05
-40
3.5
450
400
350
300
250
200
150
100
50
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
0
10
20
30
40
Load Voltage (V)
50
60
Energy Rating Curve
Load Current (A)
16
12
8
4
0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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INTEGRATED CIRCUITS DIVISION
CPC1706
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
CPC1706Y
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device
Classification Temperature (Tc)
Dwell Time (tp)
Max Reflow Cycles
CPC1706Y
245ºC
30 seconds
1
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should
not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
CPC1706
MECHANICAL DIMENSIONS
21.082±0.381
(0.830±0.015)
PCB Hole Pattern
3.302±0.051
(0.130±0.002)
10.160±0.127
(0.400±0.005)
1.75
(0.069)
7º TYP
4 Places
Pin 1
1.778
(0.070)
0.762±0.076
(0.030±0.003)
2.540±0.127
(0.100±0.005)
4.572±0.127
(0.180±0.005)
10.160±0.127
(0.400±0.005)
5.080±0.127
(0.200±0.005)
1.651±0.102
(0.065±0.004)
5.080
(0.200)
10.160
(0.400)
1.016±0.127
(0.040±0.005)
Pin 1
1.150 DIA. x4
(0.045 DIA. x4)
2.540
(0.100)
0.381±0.013
(0.015±0.0005)
1.778
(0.070)
7º TYP
4 Places
Note: Pin-to-pin tolerances are non-cumulative.
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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Specification: DS-CPC1706-R04
©Copyright 2016, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
5/4/2016