MG12300D-BN3MM Series 300A Dual IGBT - Digi-Key

Power Module
1200V IGBT Family
MG12300D-BN3MM Series 300A Dual IGBT
RoHS ®
Features
• H
igh short circuit
capability, self limiting
short circuit current
• IGBT CHIP(1200V NPT
technology)
• V
CE(sat) with positive
temperature coefficient
• F
ast switching and short
tail current
• F
ree wheeling diodes
with fast and soft reverse
recovery
• Low switching losses
Applications
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E71639
• Motor drives
• SMPS and UPS
• Inverter
• Welder
• Converter
• Induction Heating
Module Characteristics (TC = 25°C, unless otherwise specified)
Symbol
Parameters
Test Conditions
Min
Typ
Max. Junction Temperature
TJ max)
Max
Unit
150
°C
TJ op
Operating Temperature
-40
125
°C
Tstg
Storage Temperature
-40
125
°C
Visol
Insulation Test Voltage
AC, t=1min
CTI
Comparative Tracking Index
Module case exposed to 0.1% ammonium
chloride solution per UL and IEC standards
3000
V
350
V
Torque
Module-to-Sink
Recommended (M6)
3
5
N·m
Torque
Module Electrodes
Recommended (M6)
2.5
5
N·m
Weight
320
g
Unit
Absolute Maximum Ratings (TC = 25°C, unless otherwise specified)
Symbol
Parameters
Test Conditions
Values
VCES
Collector - Emitter Voltage
TJ=25°C
1200
V
VGES
Gate - Emitter Voltage
±20
V
IC
DC Collector Current
TC=25°C
450
A
TC=75°C
300
A
ICM
Repetitive Peak Collector Current
Ptot
Power Dissipation Per IGBT
IGBT
tp=1ms
600
A
1450
W
Diode
VRRM
Repetitive Reverse Voltage
IF(AV)
Average Forward Current
IFRM
Repetitive Peak Forward Current
It
2
TJ=25°C
1200
V
TC=25°C
450
A
TC=75°C
300
A
tp=1ms
600
A
TJ =125°C, t=10ms, VR=0V
14500
A 2s
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
MG12300D-BN3MM
1
©2014 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:09/18/14
Power Module
1200V IGBT Family
Electrical and Thermal Specifications (TC = 25°C, unless otherwise specified)
Symbol
Parameters
Test Conditions
Min
Typ
Max
Unit
Gate - Emitter Threshold Voltage
VCE=VGE, IC=12mA
4.5
5.5
6.5
V
Collector - Emitter
Saturation Voltage
IC=300A, VGE=15V, TJ=25°C
3.2
V
IC=300A, VGE=15V, TJ=125°C
3.85
V
IGBT
VGE(th)
VCE(sat)
ICES
Collector Leakage Current
IGES
Gate Leakage Current
RGint
Intergrated Gate Resistor
Qge
Gate Charge
Cies
Input Capacitance
Cres
Reverse Transfer Capacitance
td(on)
Turn - on Delay Time
tr
Rise Time
td(off)
Turn - off Delay Time
VCE=1200V, VGE=0V, TJ=25°C
2
mA
VCE=1200V, VGE=0V, TJ=125°C
10
mA
400
μA
VCE=0V,VGE=±15V, TJ=125°C
VCE=600V, IC=300A , VGE=±15V
VCE=25V, VGE=0V, f =1MHz
VCC=600V
IC=300A
RG =3.3 Ω
tf
Fall Time
Eon
Turn - on Energy
Eoff
Turn - off Energy
ISC
Short Circuit Current
VGE=±15V
Inductive Load
-400
1.3
Ω
3.2
μC
22
nF
1.0
nF
TJ =25°C
110
ns
TJ =125°C
120
ns
TJ =25°C
70
ns
TJ =125°C
80
ns
TJ =25°C
550
ns
TJ =125°C
600
ns
TJ =25°C
50
ns
TJ =125°C
60
ns
TJ =25°C
18
mJ
TJ =125°C
29
mJ
TJ =25°C
14
mJ
TJ =125°C
22
mJ
1200
A
tpsc≤10μS , VGE=15V
TJ=125°C,VCC=900V
Junction-to-Case Thermal
Resistance (Per IGBT)
RthJC
0.085
K/W
Diode
IF=300A , VGE=0V, TJ =25°C
2.0
V
IF=300A , VGE=0V, TJ =125°C
2.05
V
Max. Reverse Recovery Current
IF=300A , VR=-600V
300
A
Reverse Recovery Time
diF/dt=6000A/μs
350
ns
Erec
Reverse Recovery Energy
TJ=125°C
15.2
mJ
RthJCD
Junction-to-Case Thermal
Resistance (Per Diode)
Forward Voltage
VF
IRRM
trr
MG12300D-BN3MM
0.15
2
K/W
©2014 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:09/18/14
Power Module
1200V IGBT Family
Figure 1: Typical Output Characteristics
Figure 2: Typical Output Characteristics
600
600
VGE =15V
500
400
400
TVj =25°C
IC (A)
IC (A)
500
300
200
100
0
0
2
1
0
3
4
VCE˄V˅
5
6
Figure 3: T
ypical Transfer characteristics
120
100
400
Eon Eoff (mJ)
TVj =125°C
300
TVj =25°C
200
100
0
80
70
5
6
7
9
8
VGE˄V˅
10
11
6
Eon
40
Eoff
0
2.5
5
10
7.5
RG˄Ω˅
12.5
15
Figure 6: R
everse Biased Safe Operating Area
700
VCE=600V
RG=3.3Ω
VGE=±15V
TVj =125°C
600
500
50
400
IC (A)
Eon
40
30
Eoff
300
RG=3.3Ω
VGE=±15V
TVj =125°C
200
20
100
10
MG12300D-BN3MM
5
60
0
12
60
0
0
80
20
Figure 5: Switching Energy vs. Collector Current
90
4
2 0 3
VCE˄V˅
VCE=600V
IC=300A
VGE=±15V
TVj =125°C
VCE =20V
500
1
Figure 4: Switching Energy vs. Gate Resistor
600
IC (A)
TVj =125°C
200
TVj =125°C
10
Eon Eoff (mJ)
300
100
200
300
400
IC˄A˅
500
0
600
3
0
200
400
600 800 1000 1200 1400
VCE˄V˅
©2014 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:09/18/14
Power Module
1200V IGBT Family
Figure 7: Diode Forward Characteristics
Figure 8: S
witching Energy vs. Gate Resistort
600
20
480
16
IF (A)
Erec (mJ)
TVj =25°C
360
TVj =125°C
12
8
240
4
120
0
0
0
2
VF˄V˅
1
3
4
2.5
5
7.5
10
12.5
15
Figure 10: T
ransient Thermal Impedance
24
20
0
RG˄Ω˅
Figure 9: Switching Energy vs. Forward Current
1
RG=3.3Ω
VCE=600V
TVj =125°C
Diode
ZthJC (K/W)
16
Erec (mJ)
IF=300A
VCE=600V
TVj =125°C
12
8
0.1
IGBT
0.01
4
0
0
MG12300D-BN3MM
50
100
150 200
IF (A)
250
0.001
0.001
0.01
0.1
1
10
Rectangular Pulse Duration (seconds)
300
4
©2014 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:09/18/14
Power Module
1200V IGBT Family
Dimensions-Package D
Circuit Diagram and Pin Assignment
Packing Options
Part Number
Marking
Weight
Packing Mode
M.O.Q
MG12300D-BN3MM
MG12300D-BN3MM
320g
Bulk Pack
60
Part Marking System
Part Numbering System
MG12300D-BN3MM
PRODUCT TYPE
M: Power Module
ASSEMBLY SITE
MODULE TYPE
G: IGBT
VOLTAGE RATING
12: 1200V
WAFER TYPE
CURRENT RATING
PACKAGE TYPE
300: 300A
MG12300D-BN3MM
CIRCUIT TYPE
B: 2x(IGBT+FWD)
D: Package D
5
©2014 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:09/18/14