TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP4065 SP4065 Series 3.3V 20A Diode Array RoHS Pb GREEN Description The SP4065 integrates low capacitance diodes with an additional zener diode to protect each I/O pin against ESD and high surge events. This robust device can safely absorb up to 20A per IEC61000-4-5 (tp=8/20μs) without performance degradation and a minimum ±30kV ESD per IEC61000-4-2 International Standard. Their low loading capacitance also makes them ideal for protecting highspeed signal pins. Pinout Features I/O 1 I/O 8 I/O 2 I/O 7 I/O 3 I/O 6 I/O 4 I/O 5 GND NC I/O 6 I/O 7 • L ow capacitance of 4.4pF (TYP) per I/O • E FT, IEC61000-4-4, 40A (5/50ns) • L ow leakage current of 1µA (MAX) at 3.3V • L ightning, IEC61000-4-5, 20A (8/20µs) • AEC-Q101 qualified Applications Functional Block Diagram I/O 8 • E SD, IEC61000-4-2, ±30kV contact, ±30kV air I/O 5 • LCD/PD TVs • Notebooks • Desktops • 1Gb Ethernet • Game Consoles • Network Hardware • Set Top Boxes Application Example LVDS Interface I/O 1 I/O 2 GND I/O 3 I/O 4 LVDS Controller CLK+ CLKA0+ A0- Outside World A1+ A1A2+ A2- Signal Shield GND SP4065-08ATG Life Support Note: Shield GND Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/26/14 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP4065 Thermal Information Absolute Maximum Ratings Symbol Parameter Value Parameter Units Rating Units -55 to 150 °C IPP Peak Current (tp=8/20μs) 20.0 A Storage Temperature Range PPK Peak Pulse Power (tp=8/20µs) 300 W Maximum Junction Temperature 150 °C TOP Operating Temperature -40 to 125 ºC Maximum Lead Temperature (Soldering 20-40s) 260 °C TSTOR Storage Temperature -55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Test Conditions Min Typ Max Units 3.3 V 1.0 µA Snap Back Voltage VSB ISB=50mA Reverse Leakage Current ILEAK VR=3.3V, I/O to GND 0.5 IPP=1A, tp=8/20µs, Fwd 5.5 V IPP=5A, tp=8/20µs, Fwd 7.0 V IPP=10A, tp=8/20µs, Fwd 9.0 V IPP=20A, tp=8/20µs, Fwd 13.5 V (VC2 - VC1) / (IPP2 - IPP1) 0.4 Ω Clamp Voltage1 VC Dynamic Resistance RDYN ESD Withstand Voltage1 VESD Diode Capacitance 1 Diode Capacitance 1 2.8 V IEC61000-4-2 (Contact) ±30 kV IEC61000-4-2 (Air) ±30 kV CI/O-GND Reverse Bias=0V 4.4 CI/O-I/O Reverse Bias=0V 2.2 5.0 pF pF Note: 1. Parameter is guaranteed by design and/or device characterization. Clamping Voltage vs. IPP Capacitance vs. Bias 14.0 5.0 12.0 Capacitance (pF) Clamp Voltage (VC) 4.0 10.0 8.0 6.0 3.0 2.0 4.0 1.0 2.0 0.0 0.0 1.0 3.0 5.0 7.0 9.0 11.0 13.0 15.0 Peak Pulse Current-IPP (A) 17.0 19.0 21.0 0 0.5 1 1.5 2 2.5 3 Bias Voltage (V) © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/26/14 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP4065 Product Characteristics Pulse Waveform 110% Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substrate material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 100% 90% Percent of IPP 80% 70% 60% 50% 40% 30% Notes : 20% 1. All dimensions are in millimeters 10% 2. Dimensions include solder plating. 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Time (μs) 5. Package surface matte finish VDI 11-13. Soldering Parameters Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) - Temperature (tL) 217°C tP TP Pb – Free assembly Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Part Numbering System SP 4065 - 08 A T G G= Green TVS Diode Arrays (SPA® Diodes) T= Tape & Reel Package A = MSOP10 Series Number of Channels Ordering Information Part Marking System Part Number Package Marking Min. Order Qty. SP4065-08ATG MSOP-10 AAH8 4000 LF Product Series AA= SP4065 YYWWD AA*8 YYWW = Date code Number of Channels Assembly Site © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/26/14 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP4065 Package Dimensions — MSOP-10 E 0.50 [0.0197] 1.04 [0.0409] 4.24 [0.1669] E1 5.28 [0.2079] 3.20 [0.1260] 10 2.00 [0.0787] D 0.32 [0.0126] Solder Pad Layout 1 2 A C B e A1 Package MSOP Pins 10 JEDEC MO-187 Millimeters Inches DIM Min Max Min Max A - 1.10 - 0.043 A1 0.00 0.15 0.000 0.006 B 0.17 0.27 0.007 0.011 c 0.08 0.23 0.003 0.009 D 2.90 3.10 0.114 0.122 E 4.67 5.10 0.184 0.200 E1 2.90 3.10 0.114 0.122 L Embossed Carrier Tape & Reel Specification — MSOP-10 Millimetres Min Inches Max Min Max E 1.65 1.85 0.065 0.073 F 5.40 5.60 0.213 0.220 D 1.50 1.60 0.059 0.063 1.50 Min D1 P0 10P0 W 3.90 0.059 Min 4.10 40.0+/- 0.20 11.90 12.10 0.154 0.161 1.574+/-0.008 0.469 0.476 P 7.90 8.10 0.311 0.319 A0 5.20 5.40 0.205 0.213 B0 3.20 3.40 0.126 0.134 K0 1.20 1.40 0.047 0.055 t 0.30 +/- 0.05 0.012+/- 0.002 Pin 1 Location User Feeding Direction © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/26/14