TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SRDA05 Series SRDA05 Series 8pF 30A Diode Array RoHS Pb GREEN Description The SRDA05 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect I/O pins against ESD and lightning induced surge events. This robust device can safely absorb up to 30A per IEC61000-4-5 (tp=8/20μs) without performance degradation and a minimum ±30kV ESD per IEC61000-4-2 international standard. Its low loading capacitance makes it ideal for high-speed interface protection. Pinout Features I/O 1 1 8 Ref 2 Ref 1 2 7 I/O 4 • Lightning protection, IEC61000-4-5, 30A (8/20µs) Ref 1 3 6 I/O 3 • EFT, IEC61000-4-4, 50A (5/50ns) I/O 2 4 5 Ref 2 • ESD, IEC61000-4-2, ±30kV contact, ±30kV air • Low clamping voltage • Low leakage current • SOIC-8 surface mount package (JEDEC MS-012) SOIC-8 (Top View) Note: Pinout diagrams above shown as device footprint on circuit board. Functional Block Diagram I/O 1 Ref 1 Applications • Video Line Protection • Tertiary (IC Side) Protection: I/O 2 • Security Cameras - T1/E1/T3/E3 • Storage DVRs - HDSL/SDSL • Network Equipment - Ethernet • Instrumentation, Medical Equipment • RS232, RS485 Application Example I/O 4 Ref 2 I/O 3 R Tip Additional Information R Ring 8 T1/E1/ T 3 / E 3 Transceiver Datasheet Resources SRDA05-4 1 Samples 5 4 T Tip Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. T Ring T1/E1/T3/E3 Interface Protection © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SRDA05 Series Absolute Maximum Ratings Value Units Ppk Peak Pulse Power (8/20µs) Parameter 600 W Ipp Peak Pulse Current (8/20µs) 30 A Operating Temperature Range –40 to 125 °C Top Operating Temperature –40 to 125 °C Storage Temperature Range –55 to 150 °C Storage Temperature –55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) (SOIC - Lead Tips Only) 260 °C TSTOR Parameter Rating Units 170 °C/W SOIC Package CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25°C) Symbol Test Conditions Min Typ Max Units Reverse Stand-Off Voltage Parameter VRWM IT≤1µA - - 5.0 V Reverse Leakage Current IR VR= 5V - - 10 µA Reverse Breakdown Voltage VBR It = 1mA 6 - - V 1 VC IPP= 1A, tp=8/20 µs - 9.2 - V Clamping Voltage, Line-Ground VC IPP= 2A, tp=8/20 µs - 10.0 - V 1 Clamping Voltage, Line-Ground VC IPP= 10A, tp=8/20 µs - 14.5 - V Clamping Voltage, Line-Ground1 VC IPP= 25A, tp=8/20 µs - 21.0 - V Dynamic Resistance, Line-Ground1 RDYN ( VC2-VC1)/(IPP2-IPP1) - 0.8 - Ω ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact Discharge) IEC61000-4-2 (Air Discharge) ±30 ±30 - - kV kV CI/O-I/O Reverse Bias=0V - 4.0 - pF CI/O-GND Reverse Bias=0V - 8.0 - pF Clamping Voltage, Line-Ground 1 Diode Capacitance1 1 Parameter is guaranteed by design and/or device characterization. Normalized Capacitance vs. Bias Voltage Non-Repetitive Peak Pulse Power vs. Pulse Time 10 Peak Pulse Power-Ppk (kW) Normalized Capacitance (pF) Cj(VR)/Cj(VR=0) 2.5 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 1 0.1 0.4 0.2 0.0 0.01 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Bias Voltage (V) © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 3.5 4.0 4.5 5.0 0.1 1 10 Pulse Duration-tp(µS) 100 1000 SP4040 Symbol Thermal Information TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SRDA05 Series Clamping Voltage vs. IPP Power Derating Curve 110 100 % of Rated Power or IPP 25.00 Clamp Voltage (VC) 20.00 15.00 10.00 90 80 70 60 50 40 30 20 5.00 10 0 0.00 1.0 10.0 20.0 30.0 0 25 50 75 100 Ambient Temperature-TA Peak Pulse Current-IPP (A) Pulse Waveform 125 150 (oC) Product Characteristics 110% 100% 90% Percent of IPP 80% 70% 60% 50% 40% 30% 20% Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 10% 0% Lead Plating 1. All dimensions are in millimeters 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Ordering Information Part Number Package Marking Min. Order Qty. SRDA05-4BTG SOIC-8 LF SRDA05 SYYWW 2500 © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SRDA05 Series Part Numbering System Part Marking System SRDA 05 4 B T G TVS Diode Arrays (SPA® Diodes) Voltage G= Green T= Tape & Reel Package B = SOIC-8 Channel 4= 4 Channels SRDA05 F L Marking SYYWW Date code Pin1 Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline Package LF SOIC Pins 8 JEDEC MS-012 Millimetres o Recommended Soldering Pad Outline (Reference Only) Inches Min Max Min Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1.25 1.65 0.050 0.065 B 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.70 5.10 0.185 0.201 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 1.27 BSC e L 0.050 BSC 1.27 0.40 0.050 0.016 Embossed Carrier Tape & Reel Specification — SOIC Package Millimetres User Feeding Direction E Pin 1 Location Max Min Max 1.65 1.85 0.065 0.073 F 5.4 5.6 0.213 0.22 P2 1.95 2.05 0.077 0.081 D 1.5 1.6 0.059 0.063 D1 P0 10P0 1.50 Min 3.9 4.1 40.0 ± 0.20 0.059 Min 0.154 0.161 1.574 ± 0.008 W 11.9 12.1 0.468 0.476 P 7.9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087 t © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 Inches Min 0.30 ± 0.05 0.012 ± 0.002