TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD05 Series SD05 Series 450W Discrete Unidirectional TVS Diode RoHS Pb GREEN Description The SD05 TVS diode is designed to replace multilayer varistors (MLVs) in electronic equipment for low speed and DC applications. It will protect any sensitive equipment from damage due to electrostatic discharge (ESD) and other transient events. The SD05 can safely absorb repetitive ESD strikes at ±30kV (contact discharge, IEC 61000-4-2) without performance degradation and safely dissipate 30A of 8/20μs induced surge current (IEC61000-4-5) with very low clamping voltages. Pinout and Functional Block Diagram 1 Features • ESD, IEC61000-4-2, ±30kV contact, ±30kV air • Low clamping voltage • EFT, IEC61000-4-4, 40A (5/50ns) • Small SOD323 package fits 0805 footprints • Low leakage current • Lightning, IEC61000-4-5, 30A (tP=8/20μs) Applications 2 • Switches / Buttons • Medical Equipment • Test Equipment / Instrumentation • Notebooks / Desktops / Servers • Point-of-Sale Terminals • Computer Peripherals Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. Additional Information Datasheet Resources Samples © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD05 Series Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 30 A Ppk Peak Pulse Power (tp=8/20μs) 450 W TOP Operating Temperature –40 to 125 °C TSTOR Storage Temperature –55 to 150 °C Notes: CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Rating Units –55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min VR IR=1mA 6 Reverse Standoff Voltage VRWM IR≤1μA 5.0 V Leakage Current ILEAK VR=5V 1.0 μA Reverse Voltage Drop Clamp Voltage1 VC Dynamic Resistance RDYN ESD Withstand Voltage1 VESD Diode Capacitance1 Typ Max Units V IPP=1A, tp=8/20µs, Fwd 8.0 V IPP=2A, tp=8/20µs, Fwd 8.5 V IPP=10A, tP=8/20μs, Fwd 11.8 V IPP=24A, tP=8/20μs, Fwd 16.8 V (VC2 - VC1) / (IPP2 - IPP1) 0.5 Ω IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV CD Reverse Bias=0V, f=1MHz 350 pF Note: Parameter is guaranteed by design and/or device characterization. 1 Capacitance vs. Reverse Bias Non-Repetitive Peak Pulse Power vs. Pulse Time 300.0 pk (kW) 10 200.0 Peak Pulse Power - P Capacitance (pF) 250.0 150.0 100.0 50.0 0.0 1 0.1 0.01 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Bias Voltage (V) © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 3.5 4.0 4.5 5.0 0.1 1 10 100 Pulse Duration - t p (µs) 1000 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD05 Series Pulse Waveform 110 110% 100 100% 90 90% 80 80% 70 Percent of IPP % of Rated Power I PP Power Derating Curve 60 50 40 30 50% 40% 30% 20 20% 10 0 70% 60% 10% 0 25 50 75 100 125 150 0% Ambient Temperature - T A (oC) 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD05 Series Part Marking System Part Numbering System SD05 – 01 F T G G= Green g TVS Diode Arrays (SPA® Diodes) Series Number of Channels T= Tape & Reel Package F: SOD323 Ordering Information Part Number Package Marking Min. Order Qty. SD05-01FTG SOD323 g 3000 Package Dimensions -SOD323 SOD323 E A2 A1 Symbol Millimeters Min D b A L1 L 0.2 L Max 0.039 A1 0.00 0.10 0.000 0.004 A2 0.80 0.90 0.031 0.035 b 0.25 0.35 0.010 0.014 c 0.08 0.15 0.003 0.006 D 1.20 1.40 0.047 0.055 E 1.60 1.80 0.063 0.071 E1 2.50 2.70 0.098 0.106 0.475 REF L c Min 1.00 A E1 Inches Max 0.019 REF L1 0.25 0.40 0.010 0.016 Ø 0º 8º 0º 8º Embossed Carrier Tape & Reel Specification — SOD323 2.00 4.00 ø1.50 ø178 6 R7 5. R2 12.3 0 1.75 8. 3000 2500 2000 500 54.4 5.6 .5 1000 R2 R6 A 8.00 A 3.50 1500 B 12.3 4.00 B 9.5 0.254 1.25 2.90 1.46 Cover Tape A-A B-B © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13