MAXIM INTEGRATED PRODUCTS

MAX14526
RELIABILITY REPORT
FOR
MAX14526EEWP+/ MAX14526BEEWP+/
MAX14526DEEWP+
WAFER LEVEL PRODUCTS
June 6, 2011
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Richard Aburano
Quality Assurance
Manager, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX14526
Conclusion
The MAX14526EEWP+/ MAX14526BEEWP+/MAX14526DEEWP+ successfully meets the quality and reliability standards required of
all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet
Maxim's quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX14526E/MAX14526BE/MAX14526DE are designed to simplify interface requirements on portable devices by multiplexing common inputs
(USB, UART, Microphone, Stereo Audio and Composite Video) on a single micro/mini USB connector. The USB input supports Hi-Speed USB and the
audio/video inputs feature negative rail signal operation allowing simple DC coupled accessories. These devices allow a single micro/mini USB port to
support all the common interfaces on Cellular phones and portable media players over the same external lines.
The MAX14526E/MAX14526BE/MAX14526DE feature an I2C serial interface allowing microprocessor control for accessory detection, low-power
shutdown mode, enable interrupts, enable MIC bias, and enable click-and-pop reduction for headphones/speakers.
The MAX14526E/MAX14526BE/MAX14526DE operate from an independent +2.8V to +5.5V power supply (BAT) or the USB VBUS power supply (VB).
The USB power supply input (VB) features an overvoltage protected LDO capable of handling up to +28V. USB charge detect is disabled by default for
the MAX14526E/MAX14526DE and enabled by default for the MAX14526BE. The MAX14526E/MAX14526BE/MAX14526DE are available in a 20bump (2.5mm x 2mm) WLP package and are specified over the -40°C to +85°C extended temperature range.
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MAX14526
II. Manufacturing Information
A. Description/Function:
USB Multiplexer Interface Circuits
B. Process:
S45
C. Number of Device Transistors:
18270
D. Fabrication Location:
California, Texas or Japan
E. Assembly Location:
Japan
F. Date of Initial Production:
January 24, 2009
III. Packaging Information
A. Package Type:
20-bump WLP 4x5 arrray
B. Lead Frame:
N/A
C. Lead Finish:
N/A
D. Die Attach:
N/A
E. Bondwire:
N/A (N/A mil dia.)
F. Mold Material:
None
G. Assembly Diagram:
#05-9000-3410
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
°C/W
K. Single Layer Theta Jc:
°C/W
L. Multi Layer Theta Ja:
47°C/W
M. Multi Layer Theta Jc:
°C/W
IV. Die Information
A. Dimensions:
104 X 84 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
F. Minimum Metal Spacing:
Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
G. Bondpad Dimensions:
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX14526
V. Quality Assurance Information
A. Quality Assurance Contacts:
Richard Aburano (Manager, Reliability Engineering)
Don Lipps (Manager, Reliability Engineering)
Bryan Preeshl (Vice President of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
= 22.9 x 10
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 48 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 22.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim's reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the S45 Process results in a FIT Rate of 0.49 @ 25C and 8.49 @ 55C (0.8 eV, 60% UCL)
B. E.S.D. and Latch-Up Testing (lot TRTYAA046F, D/C 0929)
The AJ67-1 die type has been found to have all pins able to withstand a HBM transient pulse of +/- 2500V per
JEDEC JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/- 250mA and overvoltage
per JEDEC JESD78.
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MAX14526
Table 1
Reliability Evaluation Test Results
MAX14526xEEWP+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
COMMENTS
DC Parameters
& functionality
48
0
TRTZEA007C, D/C 0909
Note 1: Life Test Data may represent plastic DIP qualification lots.
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