MAX488 RELIABILITY REPORT FOR MAX488ESA+ PLASTIC ENCAPSULATED DEVICES February 5, 2010 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Ken Wendel Quality Assurance Director, Reliability Engineering Maxim Integrated Products. All rights reserved. Page 1/5 MAX488 Conclusion The MAX488ESA+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards. Table of Contents I. ........Device Description V. ........Quality Assurance Information II. ........Manufacturing Information VI. .......Reliability Evaluation III. .......Packaging Information IV. .......Die Information .....Attachments I. Device Description A. General The MAX481, MAX483, MAX485, MAX487-MAX491, and MAX1487 are low-power transceivers for RS-485 and RS-422 communication. Each part contains one driver and one receiver. The MAX483, MAX487, MAX488, and MAX489 feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, thus allowing error-free data transmission up to 250kbps. The driver slew rates of the MAX481, MAX485, MAX490, MAX491, and MAX1487 are not limited, allowing them to transmit up to 2.5Mbps. These transceivers draw between 120µA and 500µA of supply current when unloaded or fully loaded with disabled drivers. Additionally, the MAX481, MAX483, and MAX487 have a low-current shutdown mode in which they consume only 0.1µA. All parts operate from a single 5V supply. Drivers are short-circuit current limited and are protected against excessive power dissipation by thermal shutdown circuitry that places the driver outputs into a high-impedance state. The receiver input has a fail-safe feature that guarantees a logic-high output if the input is open circuit. The MAX487 and MAX1487 feature quarter-unit-load receiver input impedance, allowing up to 128 MAX487/MAX1487 transceivers on the bus. Full-duplex communications are obtained using the MAX488-MAX491, while the MAX481, MAX483, MAX485, MAX487, and MAX1487 are designed for half-duplex applications. Maxim Integrated Products. All rights reserved. Page 2/5 MAX488 II. Manufacturing Information A. Description/Function: Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers B. Process: B3 C. Number of Device Transistors: D. Fabrication Location: Oregon E. Assembly Location: Malaysia, Philippines, Thailand F. Date of Initial Production: Pre 1997 III. Packaging Information A. Package Type: 8-pin SOIC (N) B. Lead Frame: Copper C. Lead Finish: 100% matte Tin D. Die Attach: Conductive E. Bondwire: Au (1 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: #05-1901-0036 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard J-STD-020-C Level 1 J. Single Layer Theta Ja: 170°C/W K. Single Layer Theta Jc: 40°C/W L. Multi Layer Theta Ja: 136°C/W M. Multi Layer Theta Jc: 38°C/W IV. Die Information A. Dimensions: 76 X 54 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Al/0.5%Cu with Ti/TiN Barrier D. Backside Metallization: None E. Minimum Metal Width: 3.0 microns (as drawn) F. Minimum Metal Spacing: 3.0 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw Maxim Integrated Products. All rights reserved. Page 3/5 MAX488 V. Quality Assurance Information A. Quality Assurance Contacts: Ken Wendel (Director, Reliability Engineering) Bryan Preeshl (Managing Director of QA) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows: = 1 MTTF = 1.83 (Chi square value for MTTF upper limit) 192 x 4340 x 320 x 2 (where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV) -9 = 3.36 x 10 = 3.36 F.I.T. (60% confidence level @ 25°C) The following failure rate represents data collected from Maxim"s reliability monitor program. Maxim performs quarterly life test monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor. Cumulative monitor data for the B3 Process results in a FIT Rate of 0.51 @ 25C and 8.79 @ 55C (0.8 eV, 60% UCL) B. Moisture Resistance Tests The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter. C. E.S.D. and Latch-Up Testing The RS07-6 die type has been found to have all pins able to withstand a HBM transient pulse of +/-1000 V per Mil-Std 883 Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250 mA. Maxim Integrated Products. All rights reserved. Page 4/5 MAX488 Table 1 Reliability Evaluation Test Results MAX488ESA+ TEST ITEM TEST CONDITION Static Life Test (Note 1) Ta = 135°C Biased Time = 192 hrs. Moisture Testing (Note 2) HAST Ta = 130°C RH = 85% Biased Time = 96hrs. Mechanical Stress (Note 2) Temperature -65°C/150°C Cycle 1000 Cycles Method 1010 FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES DC Parameters & functionality 320 0 DC Parameters & functionality 77 0 DC Parameters & functionality 77 0 Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process data Maxim Integrated Products. All rights reserved. Page 5/5