MAX9668ETP+ RELIABILITY REPORT FOR MAX9668ETP+ PLASTIC ENCAPSULATED DEVICES February 5, 2009 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Ken Wendel Quality Assurance Director, Reliability Engineering Maxim Integrated Products. All rights reserved. Page 1/5 MAX9668ETP+ Conclusion The MAX9668ETP+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards. Table of Contents I. ........Device Description V. ........Quality Assurance Information II. ........Manufacturing Information VI. .......Reliability Evaluation III. .......Packaging Information IV. .......Die Information .....Attachments I. Device Description A. General The MAX9668 outputs eight voltage references for gamma correction in TFT LCDs and one voltage reference for VCOM. Each gamma reference voltage has its own 10-bit digital-to-analog converter (DAC) and buffer to ensure a stable voltage. The VCOM reference voltage has its own 10-bit DAC and an amplifier to ensure a stable voltage when critical levels and patterns are displayed. The MAX9668 features integrated multiple-time programmable (MTP) memory to store gamma and VCOM values on the chip, eliminating the need for external EEPROM. The MAX9668 supports up to 100 write operations to the on-chip nonvolatile memory. The gamma outputs can drive 250mA peak transient current and settle within 1μs. The VCOM output can provide 400mA peak transient current and also settles within 1µs. The analog supply voltage range extends from 9V to 20V, and the digital supply voltage range extends from 2.7V to 3.6V. 2 Gamma values and the VCOM value are programmed into registers through the I C interface. Maxim Integrated Products. All rights reserved. Page 2/5 MAX9668ETP+ II. Manufacturing Information A. Description/Function: 10-Bit Programmable Gamma Reference System with MTP for TFT LCDs B. Process: S45S C. Number of Device Transistors: 4548 D. Fabrication Location: Texas E. Assembly Location: UTL Thailand F. Date of Initial Production: January 19, 2009 III. Packaging Information A. Package Type: 20-pin TQFN 5x5 B. Lead Frame: Copper C. Lead Finish: 100% matte Tin D. Die Attach: Conductive Epoxy E. Bondwire: Au (1.0 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: # H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard J-STD-020-C Level 1 J. Single Layer Theta Ja: 47°C/W K. Single Layer Theta Jc: 1.7°C/W L. Multi Layer Theta Ja: 29°C/W M. Multi Layer Theta Jc: 1.7°C/W IV. Die Information A. Dimensions: 99 X 101 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide C. Interconnect: Aluminum/Si (Si = 1%) D. Backside Metallization: None E. Minimum Metal Width: Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn) F. Minimum Metal Spacing: Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw Maxim Integrated Products. All rights reserved. Page 3/5 MAX9668ETP+ V. Quality Assurance Information A. Quality Assurance Contacts: Ken Wendel (Director, Reliability Engineering) Bryan Preeshl (Managing Director of QA) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows: = 1 MTTF = 1.83 91784 x 4340 x 2 (Chi square value for MTTF upper limit) (where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV And 54780 are number of device hours, 77*192 + 77*1000) -9 = 2.8 x 10 = 2.8 F.I.T. (60% confidence level @ 25°C) The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/. Current monitor data for the S45 Process results in a FIT Rate of 0.9 @ 25C and 13.84 @ 55C (0.8 eV, 60% UCL) B. Moisture Resistance Tests The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter. C. E.S.D. and Latch-Up Testing The DV19-1 die type has been found to have all pins able to withstand a transient pulse of HBM ESD: +/-2500 V per JEDEC JESD22-A114. HBM CDM: +/-750 V per JEDEC JESD22-C101 HBM MM: +/-250 V per JEDEC JESD22-A115 Latch-Up testing has shown that this device withstands a current of +/-100 mA, 1.5x VCCMax Overvoltage per JESD78. Maxim Integrated Products. All rights reserved. Page 4/5 MAX9668ETP+ Table 1 Reliability Evaluation Test Results MAX9668ETP+ TEST ITEM TEST CONDITION Static Life Test (Note 1) Ta = 135°C Biased FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES DC Parameters & functionality 154 0 DC Parameters & functionality 77 0 DC Parameters & functionality 77 0 Time = 1000 hrs. mixed Moisture Testing (Note 2) 85/85 Ta = 85°C RH = 85% Biased Time = 1000hrs. Mechanical Stress (Note 2) Temperature -65°C/150°C Cycle 1000 Cycles Method 1010 Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process data Maxim Integrated Products. All rights reserved. Page 5/5