MAX3673 Reliability Report

MAX3673ETN+
RELIABILITY REPORT
FOR
MAX3673ETN+
(MAX3673)
PLASTIC ENCAPSULATED DEVICES
March 31, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX3673ETN+
Conclusion
The MAX3673ETN+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX3671/ MAX3763 are low-jitter frequency synthesizers that accepts two reference clock inputs and generates nine phase-aligned outputs.
The device features 40kHz jitter transfer bandwidth, 0.3psRMS (12kHz to 20MHz) integrated phase jitter, and best-in-class power-supply noise
rejection (PSNR), making it ideal for jitter cleanup, frequency translation, and clock distribution in Gigabit Ethernet applications. The MAX3671 /
MAX3673 operate from a single +3.3V supply and typically consumes 400mW. The IC is available in an 8mm x 8mm, 56-pin TQFN package, and
operates from -40°C to +85°C.
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MAX3673ETN+
II. Manufacturing Information
A. Description/Function:
Low-Jitter Frequency Synthesizer with Selectable Input Reference
B. Process:
MB3
C. Number of Device Transistors:
D. Fabrication Location:
California
E. Assembly Location:
UTL Thailand
F. Date of Initial Production:
February 2, 2009
III. Packaging Information
A. Package Type:
56-pin TQFN 8x8
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive Epoxy
E. Bondwire:
Au (1.0 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 3
J. Single Layer Theta Ja:
35°C/W
K. Single Layer Theta Jc:
0.6°C/W
L. Multi Layer Theta Ja:
21°C/W
M. Multi Layer Theta Jc:
0.6°C/W
IV. Die Information
A. Dimensions:
111 X 111 mils
B. Passivation:
BCB
C. Interconnect:
2 x Aluminum/Cu (Cu = 0.5%), top layer 100% Cu
D. Backside Metallization:
None
E. Minimum Metal Width:
0.35 um
F. Minimum Metal Spacing:
0.35 um
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Saw
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MAX3673ETN+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are pending. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
169007 x 1555 x 2
(Chi square value for MTTF upper limit)
(where 1555 = Temperature Acceleration factor assuming an activation energy of 0.7eV
and 169007 = Device Hrs at Stress, 135°C)
-9
= 2.3 x 10
= 2.3 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000
hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/.
Current monitor data for the MB3HT Process results in a FIT Rate of 0.7 @ 25C and 11.5 @ 55C (0.7 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The HT59 die type has been found to have all pins able to withstand a HBM transient pulse of +/-1000 V per JEDEC
JESD22-A114-D. Latch-Up testing has shown that this device withstands a current of +/-250 mA, 1.5x VCCMax Overvoltage per
JESD78.
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MAX3673ETN+
Table 1
Reliability Evaluation Test Results
MAX3673ETN+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
466
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = mixed hrs
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
-65°C/150°C
Temperature
1000 Cycles
Cycle
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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