Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) General Information Factory Plating Finish Package Type Plating Chemistry Plating Line Post Plating Bake Report Date Whisker Test Report # Amkor Technology Philippines – ATP Matte Sn SOIC ST380 Meco 6 150°C for 1 hour : : January 15, 2007 20060623 Prepared by : Sonny M. Copon Reliability Engineer Checked by : Roque Baliwan Section Manager, Rel/FA Approved by : Bernard Baylon Department Manager, Rel/FA Distribution List : Bryan Rigg, Henry Carteciano, Greg Gabriel, Sandra Gonzales, Ruth Jacob, Charlie dela Cruz Jr., Eduardo Mertola, Leonida Dapula, Rodrigo Amor, Avelette Tan – ATP GiSong Lee, KwangBok Yang – WW Corp. PIC Gary Hamming – ATI 1 of 21 Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) DISCLAIMER. The whisker test procedures identified in this report are used for determining the presence of tin whiskers and are performed by Amkor, pursuant to current industryaccepted JEDEC standards. The whisker test procedures used herein are unproven and may produce inconclusive results. Amkor makes no representation, warranty or guarantee of any kind with respect to the field performance, quality or freedom from whisker-related failures, of any package tested by Amkor using these procedures. 2 of 21 Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 1. Purpose 1.1. Whisker Test on SOIC 8lds (C194 Base Metal) ST380 Chemistry. 2. Scope: Mark (9) the scope on the following Process New plating process Modified plating process 9 Material New plating material Modified plating material Alternate source of material Alternate manufacturing site of material 3. Conclusion 3.1. Total # of lots tested : ( 3 ) lot(s) 3.2. Comment : 3.2.1. Whisker length measurement method applied for all the whiskers observed was the Radial measurement method. Eighteen (18) terminations per readpoint were SEM inspected and 2 longest whiskers per lot per readpoint were measured and reported. Identified whiskers vary from one readpoint to another since the test objective was to track the longest whisker growth among the samples. 3.2.2. Post 500cyc, 1000cyc, & 1500cyc exposure at –55°C/+85°C TC conditions showed whisker growth in all 3 lots. Longest whiskers observed post 1500cyc were: − TC without precon: comp#1, term#5 with 31.18µm; − TC with 215°C simulated reflow: comp#5, term#3 with 38.40µm; and − TC with 255°C simulated reflow: comp#6, term#3 with 27.08µm. 3.2.3. No whisker was observed in all 3 lots after 4000hrs exposure both at 30°C/60%RH and 55°C/85%RH TH conditions. 3.2.4. Two (2) terminations with whisker, which were found at the lead tip, have been invalidated after exposure to higher Temperature/Humidity (55°C/85%RH) conditions due to presence of surface corrosion. The invalidation was done per JEDEC Standard JESD201. Other terminations were inspected but no whisker was found. Verification results were detailed at the end of report under Appendix 5.4.3. 3 of 21 Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 4. Package / Material Description 4.1. Package Type Body size Lead Count Lead Pitch Lead to Lead Gap SOIC 391x155 mils 8L 50 mils N/A 4.2. Material Lead frame Base metal alloy C194 Temper (1/2 hard, etc.) Full Hard Stamped/Etched L/F Etched L/F thickness 8 mils Barrier layer type Pure Tin Over Copper Barrier layer thickness N/A 4.3. Process Dates Plating date/time Post bake date/time Simulated reflow date Board assembly date 30°C/60%RH start date 55°C/85%RH start date -55°C/85°C start date Lot #1 05/10/06 / 1115H 05/10/06 / 1135H 06/14/06 N/A 06/14/06 06/14/06 06/14/06 5. Attachments 5.1. 5.2. 5.3. 5.4. Process Summary Workmanship Summary Whisker Test Summary and Photos Appendix 4 of 21 Lot #2 05/17/06 / 1425H 05/17/06 / 1440H 06/14/06 N/A 06/14/06 06/14/06 06/14/06 Lot #3 05/24/06 / 1630H 05/24/06 / 1655H 06/14/06 N/A 06/14/06 06/14/06 06/14/06 Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 5.1. Process Summary Lot# : LOT-1 PROCESS Plating MACHINE/ EQUIPMENT Meco 6 PARAMETERS Belt Speed Descale • Temperature • Concentration – Salt • Concentration – Acid Plating • Current Density • Ampere / cell • Concentration – Acid • Concentration – Tin • Concentration – Pb • Concentration – Bi • Concentration – Additive (Primary) • Concentration – Additive (Secondary) • Bath Temperature Impurities • Carbon • Pb in deposit (for Matte Sn, Sn/Bi) • Cu • Fe • Ni • Sn+4 Post Plating Bake Yamato 8 m/min Descale Solution 35°C 74.70 g/li NA 168.70 ASF 220 amps/cell 272.50 ml/li 78.90 g/li N/A N/A 71.70 ml/li 3.00 ml/li 28°C 0.01225 % wt 3.90 ppm 2.69 ppm 8.77 ppm 14.23 ppm 1.56% Hold Temperature 150°C Dwell Time Total Cycle Time 1 hr 1.5 hr Simulated Reflow Vitronics @ 215°C Peak Temperature Dwell Time > 183°C 219°C 63 seconds Simulated Reflow Vitronics @ 255°C Peak Temperature Dwell Time > 217°C 259°C 74 seconds 5 of 21 MATERIALS Actronal 988 Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) Lot# : LOT-2 PROCESS Plating MACHINE/ EQUIPMENT Meco 6 PARAMETERS Belt Speed Descale • Temperature • Concentration – Salt • Concentration – Acid Plating • Current Density • Ampere / cell • Concentration – Acid • Concentration – Tin • Concentration – Pb • Concentration – Bi • Concentration – Additive (Primary) • Concentration – Additive (Secondary) • Bath Temperature Impurities • Carbon • Pb in deposit (for Matte Sn, Sn/Bi) • Cu • Fe • Ni • Sn+4 Post Plating Bake Yamato 8 m/min Descale Solution 35°C 77.50 g/li NA 168.70 ASF 220 amps/cell 270.50 ml/li 74.00 g/li N/A N/A 79.90 ml/li 3.30 ml/li 28°C 0.01225 % wt 3.73 ppm 6.84 ppm 19.81 ppm 5.65 ppm 1.56% Hold Temperature 150 ºC Dwell Time Total Cycle Time 1 hr 1.5 hr Simulated Reflow Vitronics @ 215°C Peak Temperature Dwell Time > 183°C 219°C 63 seconds Simulated Reflow Vitronics @ 255°C Peak Temperature Dwell Time > 217°C 259°C 74 seconds 6 of 21 MATERIALS Actronal 988 Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) Lot# : LOT-3 PROCESS Plating MACHINE/ EQUIPMENT Meco 6 PARAMETERS Belt Speed Descale • Temperature • Concentration – Salt • Concentration – Acid Plating • Current Density • Ampere / cell • Concentration – Acid • Concentration – Tin • Concentration – Pb • Concentration – Bi • Concentration – Additive (Primary) • Concentration – Additive (Secondary) • Bath Temperature Impurities • Carbon • Pb in deposit (for Matte Sn, Sn/Bi) • Cu • Fe • Ni • Sn+4 Post Plating Bake Yamato 8 m/min Descale Solution 35°C 80.70 g/li NA 168.70 ASF 220 amps/cell 272.50 ml/li 80.40 g/li N/A N/A 78.00 ml/li 3.10 ml/li 28°C 0.01225 % wt 4.91 ppm 6.84 ppm 19.81 ppm 5.65 ppm 2.84% Hold Temperature 150 ºC Dwell Time Total Cycle Time 1 hr 1.5 hr Simulated Reflow Vitronics @ 215°C Peak Temperature Dwell Time > 183°C 219°C 63 seconds Simulated Reflow Vitronics @ 255°C Peak Temperature Dwell Time > 217°C 259°C 74 seconds 7 of 21 MATERIALS Actronal 988 Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 5.2. Plating Workmanship Summary Lot# : LOT-1 Process / SPEC No. 001-0530-2011 001-0522-2571 Test Item Visual Plating thickness 001-0522-2571 Deposit composition Surface of Deposit Grain size range MAX Test Data MIN AVG 0/116 0/5 rdgs N/A 578.60 N/A 512.40 N/A 549.10 PASSED PASSED N/A N/A N/A 2.86 N/A 2.04 N/A 2.41 100% Sn # Failure / S. Size MAX Test Data MIN AVG 001-0322-2595 400 – 700µ” (10 – 17.50µm) 100% Sn N/A 0/116 0/5 rdgs N/A 575.80 N/A 515.80 N/A 548.50 PASSED PASSED N/A N/A N/A 1.95 N/A 1.80 N/A 1.89 100% Sn SPEC # or Criteria # Failure / S. Size MAX Test Data MIN AVG 001-0322-2595 400 – 700µ” (10 – 17.50µm) 100% Sn N/A 0/116 0/5 rdgs N/A 572.40 N/A 508.70 N/A 549.10 PASSED PASSED N/A N/A N/A 1.92 N/A 1.72 N/A 1.82 100% Sn SPEC # or Criteria # Failure / S. Size 001-0322-2595 400 – 700µ” (10 – 17.50µm) 100% Sn N/A SPEC # or Criteria Result Lot# : LOT-2 Process / SPEC No. 001-0530-2011 001-0522-2571 Test Item Visual Plating thickness 001-0522-2571 Deposit composition Surface of Deposit Grain size range Lot# : LOT-3 Process / SPEC No. 001-0530-2011 001-0522-2571 Test Item Visual Plating thickness 001-0522-2571 Deposit composition Surface of Deposit Grain size range 8 of 21 Result Result Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 5.3. Whisker Test Summary 5.3.1. Ambient Temperature/Humidity (30°C/60%RH) Lot No. Lot-1 Lot-2 Lot-3 Component # / Termination # Comp # 3 / Term # 3 . Comp # 4 / Term # 8 . Comp # 2 / Term # 4 . 0 hr none none none Readpoints 1000 hr 2000 hr none none none none none none 3101 hr none none none SEM Photo @ Post 4000 hr Lot-1: No whisker observed Lot-2: No whisker observed SEM Photo @ Post 4000 hr Lot-3: No whisker observed 9 of 21 4000 hr none none none Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 5.3.2. High Temperature/Humidity (55°C/85%RH) Lot No. Lot-1 Lot-2 Lot-3 Component # / Termination # Comp # 3 / Term # 4 . Comp # 4 / Term # 3 . Comp # 2 / Term # 3 . 0 hr none none none Readpoints 1000 hr 2000 hr none none none none none none 3161 hr none none none SEM Photo @ Post 4000 hr Lot-1: No whisker observed Lot-2: No whisker observed SEM Photo @ Post 4000 hr Lot-3: No whisker observed 10 of 21 4000 hr none none none Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 5.3.3. Thermal Cycling (-55/85°C) Lot Component # / No. Termination # Lot-1 Comp # 1 / Term # Comp # 6 / Term # Comp # 6 / Term # Lot-2 Comp # 1 / Term # Comp # 2 / Term # Lot-3 Comp # 5 / Term # Comp # 6 / Term # Comp # 4 / Term # 0 cyc none none none none none none none none 5. 8. 7. 3. 7. 4. 5. 1. Readpoints 500 cyc 1000 cyc 16.79µm 23.20µm 22.41µm 22.46µm 17.16µm 21.23µm 14.30µm 17.65µm 17.15µm 20.98µm 15.05µm 22.60µm - 1500 cyc 31.18µm 26.12µm 23.29µm 20.20µm 24.14µm 28.53µm SEM Photo @ Post 500 cyc SEM Photo @ Post 1000 cyc Longest whisker growth of 22.41µm Longest whisker growth of 23.20µm SEM Photo @ Post 1500 cyc Longest whisker growth of 31.18µm 11 of 21 Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 5.3.4. Ambient Temperature/Humidity (30°C/60%RH) post 215°C simulated reflow Lot No. Lot-1 Lot-2 Lot-3 Component # / Termination # Comp # 4 / Term # 2 . Comp # 2 / Term # 5 . Comp # 3 / Term # 2 . 0 hr none none none Readpoints 1000 hr 2000 hr none none none none none none 3101 hr none none none SEM Photo @ Post 4000 hr Lot-1: No whisker observed Lot-2: No whisker observed SEM Photo @ Post 4000 hr Lot-3: No whisker observed 12 of 21 4000 hr none none none Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 5.3.5. Ambient Temperature/Humidity (30°C/60%RH) post 255°C simulated reflow Lot No. Lot-1 Lot-2 Lot-3 Component # / Termination # Comp # 5 / Term # 8 . Comp # 1 / Term # 7 . Comp # 4 / Term # 1 . 0 hr none none none Readpoints 1000 hr 2000 hr none none none none none none 3101 hr none none none SEM Photo @ Post 4000 hr Lot-1: No whisker observed Lot-2: No whisker observed SEM Photo @ Post 4000 hr Lot-3: No whisker observed 13 of 21 4000 hr none none none Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 5.3.6. High Temperature/Humidity (55°C/85%RH) post 215°C simulated reflow Lot No. Lot-1 Lot-2 Lot-3 Component # / Termination # Comp # 5 / Term # 7 . Comp # 4 / Term # 6 . Comp # 3 / Term # 2 . 0 hr none none none Readpoints 1000 hr 2000 hr none none none none none none 3161 hr none none none SEM Photo @ Post 4000 hr Lot-1: No whisker observed Lot-2: No whisker observed SEM Photo @ Post 4000 hr Lot-3: No whisker observed 14 of 21 4000 hr none none none Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 5.3.7. High Temperature/Humidity (55°C/85%RH) post 255°C simulated reflow Lot No. Lot-1 Lot-2 Lot-3 Component # / Termination # Comp # 3 / Term # 4 . Comp # 6 / Term # 7 . Comp # 1 / Term # 6 . 0 hr none none none Readpoints 1000 hr 2000 hr none none none none none none 3161 hr none none none SEM Photo @ Post 4000 hr Lot-1: No whisker observed Lot-2: No whisker observed SEM Photo @ Post 4000 hr Lot-3: No whisker observed 15 of 21 4000 hr none none none Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 5.3.8. Thermal Cycling (-55/85°C) post 215°C simulated reflow Lot Component # / No. Termination # Lot-1 Comp # 2 / Term # Comp # 3 / Term # Lot-2 Comp # 3 / Term # Comp # 6 / Term # Comp # 6 / Term # Lot-3 Comp # 1 / Term # Comp # 5 / Term # Comp # 5 / Term # 0 cyc none none none none none none none none 2. 2. 3. 5. 1. 1. 2. 3. Readpoints 500 cyc 1000 cyc 29.54µm 29.82µm 24.64µm 32.91µm 22.69µm 23.03µm 23.68µm 30.49µm 19.25µm 25.30µm 19.47µm 34.97µm 1500 cyc 30.11µm 33.56µm 31.52µm 35.11µm 26.37µm 38.40µm SEM Photo @ Post 500 cyc SEM Photo @ Post 1000 cyc Longest whisker growth of 29.54µm Longest whisker growth of 34.97µm SEM Photo @ Post 1500 cyc Longest whisker growth of 38.40µm 16 of 21 Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 5.3.9. Thermal Cycling (-55/85°C) post 255°C simulated reflow Lot Component # / No. Termination # Lot-1 Comp # 1 / Term # Comp # 5 / Term # Comp # 5 / Term # Comp # 6 / Term # Lot-2 Comp # 4 / Term # Comp # 5 / Term # Comp # 3 / Term # Comp # 5 / Term # Lot-3 Comp # 4 / Term # Comp # 6 / Term # Comp # 6 / Term # 0 cyc none none none none none none none none none none none 8. 7. 6. 3. 4. 3. 1. 2. 1. 3. 4. Readpoints 500 cyc 1000 cyc 14.19µm 21.65µm 13.09µm 17.95µm 12.08µm 9.98µm 20.24µm 16.32µm 15.39µm 18.37µm 12.63µm 13.23µm - 1500 cyc 25.31µm 27.08µm 22.90µm 18.49µm 19.26µm 20.14µm SEM Photo @ Post 500 cyc SEM Photo @ Post 1000 cyc Longest whisker growth of 15.39µm Longest whisker growth of 21.65µm SEM Photo @ Post 1500 cyc Longest whisker growth of 27.08µm 17 of 21 Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 5.4. Appendix 5.4.1. Inspection Equipment 5.4.1.1. Optical Microscope Instrument maker : Model number : Magnification : Olympus SZ40 40-60x 5.4.1.2. SEM Instrument maker Model number Magnification Hitachi S3000N 500kx : : : 5.4.2. Reflow Profiles 5.4.2.1. Simulated 215°C Reflow 18 of 21 Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 5.4.2.2. Simulated 255°C Reflow 19 of 21 Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 5.4.3. Verification Results of Terminations with Surface Corrosion 5.4.3.1. Surface Corrosion Definition from JEDEC Standard JESD201 Surface Corrosion: A localized change to a silver-colored Sn surface finish appearing in an optical microscope as non-reflective dark spots ranging in size from about 25 micrometers on the longest dimension to the entire termination. 5.4.3.2. Verification of Surface Corrosion at different High Temperature/Humidity Conditions 5.4.3.2.1. High Temperature/Humidity (55°C/85%RH) Example of Whiskers near the Surface Corroded Areas Whisker near the surface corroded area Whisker growth of 15.29µm 20 of 21 Whisker Test Report # : 20060623 Rev.00 WHISKER TEST REPORT (FINAL REPORT) 5.4.3.2.2. High Temperature/Humidity (55°C/85%RH) post 255°C simulated reflow Example of Whiskers near the Surface Corroded Areas Whisker near the surface corroded area Whisker growth of 19.24µm 21 of 21