LM567, LM567C www.ti.com SNOSBQ4D – MAY 1999 – REVISED MARCH 2013 LM567/LM567C Tone Decoder Check for Samples: LM567, LM567C FEATURES APPLICATIONS • • • • • • • • 1 2 • • • • • • 20 to 1 Frequency Range with an External Resistor Logic Compatible Output with 100 mA Current Sinking Capability Bandwidth Adjustable from 0 to 14% High Rejection of Out of Band Signals and Noise Immunity to False Signals Highly Stable Center Frequency Center Frequency Adjustable from 0.01 Hz to 500 kHz Touch Tone Decoding Precision Oscillator Frequency Monitoring and Control Wide Band FSK Demodulation Ultrasonic Controls Carrier Current Remote Controls Communications Paging Decoders DESCRIPTION The LM567 and LM567C are general purpose tone decoders designed to provide a saturated transistor switch to ground when an input signal is present within the passband. The circuit consists of an I and Q detector driven by a voltage controlled oscillator which determines the center frequency of the decoder. External components are used to independently set center frequency, bandwidth and output delay. CONNECTION DIAGRAM Figure 1. Metal Can Package Top View See Package Number LMC0008C OBSOLETE Figure 2. PDIP and SOIC Packages Top View See Package Number D0008A See Package Number P0008E 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM567, LM567C SNOSBQ4D – MAY 1999 – REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) (3) Supply Voltage Pin Power Dissipation 9V (4) 1100 mW V8 15V V3 −10V V3 V4 + 0.5V −65°C to +150°C Storage Temperature Range Operating Temperature Range −55°C to +125°C LM567H LM567CH, LM567CM, LM567CN 0°C to +70°C Soldering Information PDIP Package Soldering (10 sec.) 260°C SOIC Package Vapor Phase (60 sec.) 215°C Infrared (15 sec.) 220°C See http://www.ti.com for other methods of soldering surface mount devices. (1) (2) (3) (4) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication of device performance. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Refer to RETS567X drawing for specifications of military LM567H version. The maximum junction temperature of the LM567 and LM567C is 150°C. For operating at elevated temperatures, devices in the TO-5 package must be derated based on a thermal resistance of 150°C/W, junction to ambient or 45°C/W, junction to case. For the DIP the device must be derated based on a thermal resistance of 110°C/W, junction to ambient. For the SOIC package, the device must be derated based on a thermal resistance of 160°C/W, junction to ambient. ELECTRICAL CHARACTERISTICS AC Test Circuit, TA = 25°C, V+ = 5V Parameters Conditions Power Supply Voltage Range Power Supply Current Quiescent RL = 20k Power Supply Current Activated RL = 20k Input Resistance LM567 IL = 100 mA, fi = fo Largest No Output Input Voltage IC = 100 mA, fi = fo Max Min Typ Max 4.75 5.0 9.0 4.75 5.0 9.0 V 6 8 7 10 mA 11 13 12 15 mA Bn = 140 kHz Largest Detection Bandwidth 12 Largest Detection Bandwidth Skew Largest Detection Bandwidth Variation with Temperature Largest Detection Bandwidth Variation with Supply Voltage Highest Center Frequency 2 20 20 10 Largest Simultaneous Outband Signal to Inband Signal Ratio Minimum Input Signal to Wideband Noise Ratio Units Typ 18 Smallest Detectable Input Voltage LM567C/LM567CM Min 15 25 15 20 10 25 mVrms mVrms 6 6 dB −6 −6 dB 14 16 1 2 ±1 100 kΩ 15 10 ±0.1 4.75–6.75V 20 500 Submit Documentation Feedback 14 18 % of fo 2 3 % of fo ±0.1 ±2 ±1 100 500 %/°C ±5 %V kHz Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM567 LM567C LM567, LM567C www.ti.com SNOSBQ4D – MAY 1999 – REVISED MARCH 2013 ELECTRICAL CHARACTERISTICS (continued) AC Test Circuit, TA = 25°C, V+ = 5V Parameters Center Frequency Stability (4.75–5.75V) Conditions 0 < TA < 70 −55 < TA < +125 Center Frequency Shift with Supply Voltage 4.75V–6.75V 4.75V–9V Fastest ON-OFF Cycling Rate LM567 Min Typ LM567C/LM567CM Max 35 ± 60 35 ± 140 0.5 Min Typ 35 ± 60 35 ± 140 1.0 2.0 fo/20 0.4 Units Max ppm/°C ppm/°C 2.0 2.0 %/V %/V fo/20 Output Leakage Current V8 = 15V 0.01 25 0.01 25 µA Output Saturation Voltage ei = 25 mV, I8 = 30 mA ei = 25 mV, I8 = 100 mA 0.2 0.6 0.4 1.0 0.2 0.6 0.4 1.0 V Output Fall Time 30 30 ns Output Rise Time 150 150 ns Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM567 LM567C 3 LM567, LM567C SNOSBQ4D – MAY 1999 – REVISED MARCH 2013 www.ti.com SCHEMATIC DIAGRAM 4 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM567 LM567C LM567, LM567C www.ti.com SNOSBQ4D – MAY 1999 – REVISED MARCH 2013 TYPICAL PERFORMANCE CHARACTERISTICS Typical Frequency Drift Typical Bandwidth Variation Figure 3. Figure 4. Typical Frequency Drift Typical Frequency Drift Figure 5. Figure 6. Bandwidth vs Input SignalAmplitude Largest Detection Bandwidth Figure 7. Figure 8. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM567 LM567C 5 LM567, LM567C SNOSBQ4D – MAY 1999 – REVISED MARCH 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) 6 Detection Bandwidth as a Function of C2 and C3 Typical Supply Current vs Supply Voltage Figure 9. Figure 10. Greatest Number of Cycles Before Output Typical Output Voltage vs Temperature Figure 11. Figure 12. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM567 LM567C LM567, LM567C www.ti.com SNOSBQ4D – MAY 1999 – REVISED MARCH 2013 TYPICAL APPLICATIONS Component values (typ) R1 6.8 to 15k R2 4.7k R3 20k C1 0.10 mfd C2 1.0 mfd 6V C3 2.2 mfd 6V C4 250 mfd 6V Figure 13. Touch-Tone Decoder Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM567 LM567C 7 LM567, LM567C SNOSBQ4D – MAY 1999 – REVISED MARCH 2013 www.ti.com Connect Pin 3 to 2.8V to Invert Output Figure 14. Oscillator with Quadrature Output Figure 15. Oscillator with Double Frequency Output Figure 16. Precision Oscillator Drive 100 mA Loads 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM567 LM567C LM567, LM567C www.ti.com SNOSBQ4D – MAY 1999 – REVISED MARCH 2013 AC TEST CIRCUIT fi = 100 kHz + 5V *Note: Adjust for fo = 100 kHz. APPLICATIONS INFORMATION The center frequency of the tone decoder is equal to the free running frequency of the VCO. This is given by The bandwidth of the filter may be found from the approximation where • • Vi = Input voltage (volts rms), Vi ≤ 200mV C2 = Capacitance at Pin 2(μF) Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM567 LM567C 9 LM567, LM567C SNOSBQ4D – MAY 1999 – REVISED MARCH 2013 www.ti.com LM567C MDC MWC ToNE DECODER Figure 17. Die Layout (C - Step) Table 1. Die/Wafer Characteristics Fabrication Attributes General Die Information Physical Die Identification LM567C Bond Pad Opening Size (min) 91µm x 91µm Die Step C Bond Pad Metalization 0.5% COPPER_BAL. ALUMINUM Passivation VOM NITRIDE Physical Attributes Wafer Diameter 150mm Back Side Metal BARE BACK Dise Size (Drawn) 1600µm x 1626µm 63.0mils x 64.0mils Back Side Connection Floating Thickness 406µm Nominal Min Pitch 198µm Nominal Special Assembly Requirements: Note: Actual die size is rounded to the nearest micron. Die Bond Pad Coordinate Locations (C - Step) (Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used SIGNAL NAME PAD# NUMBER X/Y COORDINATES PAD SIZE X Y X OUTPUT FILTER 1 -673 686 91 x 91 LOOP FILTER 2 -673 -419 91 x 91 INPUT 3 -673 -686 91 x 91 V+ 4 -356 -686 91 x 91 TIMING RES 5 673 -122 91 x 91 TIMING CAP 6 673 76 91 x 91 GND 7 178 686 117 x 91 OUTPUT 8 -318 679 117 x 104 10 Submit Documentation Feedback Y Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM567 LM567C LM567, LM567C www.ti.com SNOSBQ4D – MAY 1999 – REVISED MARCH 2013 REVISION HISTORY Changes from Revision C (March 2013) to Revision D • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM567 LM567C 11 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM567CM ACTIVE SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM 567CM LM567CM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM 567CM LM567CMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM 567CM LM567CN ACTIVE PDIP P 8 40 TBD Call TI Call TI 0 to 70 LM 567CN LM567CN/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM 0 to 70 LM 567CN NE567V ACTIVE PDIP P 8 40 TBD Call TI Call TI 0 to 70 LM 567CN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LM567CMX/NOPB Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 5.4 2.0 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM567CMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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