iPEM 16 Mb ASYNC SRAM AS8SLC512K32PECA 16Mb, 512Kx32 CMOS 3.3V, High Speed Static RAM Integrated Plastic Encapsulated Microcircuit FEATURES DESCRIPTION Integrated Real-Time Memory Array Solution No latency or refresh fycles Parallel Read/Write Interface User Configurable via multiple enables Random Access Memory Array Fast Access Times: 12, 15, 20, and 25ns TTL Compatible I/O Fully Static, No Clocks Surface Mount Package 68 Lead PLCC, No. 99 JEDEC M0-47AE Small Footprint, 0.990 Sq. In. Multiple Ground Pins for Maximum Noise Immunity Single 3.3V (±10%) Supply Operation The AS8SLC512K32 is a high speed, 3.3V, 16Mb SRAM. The device is available with access times of 12, 15, 20 and 25ns creating a zero wait state/latency, real-time memory solution. The high speed, 3.3V supply voltage and control lines,make the device ideal for all your real-time computer memory requirements. The device can be configured as a 512K x 32 and used to create a single chip external data /program memory array solution or via use of the individual chip enable lines, be reconfigured as a 1M x 16 or 2M x 8. The device provides a 50+% space savings when compared to four 512K x 8, 36 pin SOJs. In addition the AS8SLC512K32 has only a 24pF load on the Addr. lines vs. ~40pF for four plastic SOJs. DQ15 A14 A15 A16 W\ G\ NC NC Vcc NC E0\ E1\ E2\ E3\ A17 A18 DQ17 10 60 DQ14 DQ18 11 59 DQ13 DQ19 12 58 DQ12 Vss 13 57 Vss DQ20 14 56 DQ11 DQ21 15 55 DQ10 DQ22 16 54 DQ09 DQ23 17 53 DQ08 Vcc 18 52 Vcc DQ24 19 51 DQ07 DQ25 20 50 DQ06 DQ26 21 49 DQ05 DQ27 22 48 DQ04 33 34 35 36 37 38 39 40 41 42 43 A1 A0 Vcc A13 A12 A11 A10 A09 A08 A07 DQ00 DQ01 32 44 A2 26 31 DQ30 A3 DQ02 30 45 A4 25 29 DQ29 A5 DQ03 28 Vss 46 27 47 24 A6 23 DQ31 Vss DQ28 AS8SLC512K32PECA Rev. 0.2 03/11 PIN NAMES A0 - A18 E0\ - E3\ W\ G\ DQ0 - DQ31 Vcc Vss NC 61 62 63 64 65 66 67 68 1 2 3 4 5 6 7 8 9 DQ16 PIN CONFIGURATIONS AND BLOCK DIAGRAM (PECA Package) A0-A18 Address Inputs Chip Enables Write Enables Output Enable Common Data Input/Output Power (+5V ± 10%) Ground No Connection BYTE CONTROL TABLE Chip Byte Enable Control E0\ DQ0-7 E1\ DQ8-15 E2\ DQ16-23 E3\ DQ24-31 19 G\ W\ E0\ E1\ 512K x 32 Memory Array DQ0-DQ7 E2\ DQ8-DQ15 E3\ DQ16-DQ23 DQ24-DQ31 Micross Components reserves the right to change products or specifications without notice. 1 iPEM 16 Mb ASYNC SRAM AS8SLC512K32PECA ABSOLUTE MAXIMUM RATINGS* Voltage on any pin relative to Vss Operating Temperature tA (Ambient) Industrial Enhanced Military Storage Temperature, Plastic Power Dissipation Output Current Junction Temperature, TJ -0.5V to 4.6V -40oC to +85oC -40oC to +105oC -55oC to +125oC -55oC to +125oC 5.0 Watts 20 mA 175oC *Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions greater than those in di cated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. RECOMMENDED DC OPERATING CONDITIONS Sym Min Typ Parameter VCC 3.0 3.3 Supply Voltage VSS Supply Voltage 0.0 0.0 Max 3.6 Units V 0.0 V Input High Voltage VIH 2.2 --- Vcc+0.3V V Input Low Voltage VIL -0.3 --- 0.8 V AC TEST CONDITIONS Input Pulse Levels Input Rise and Fall Times Input and Output Timing Levels Output Load Vss to 3.0V 5ns 1.5V Figure 1, 2 Note: For tEHQZ, tGHQZ and tWLQZ, CL=5pF 3.3V R L = 50 : VL = 1.5V Q =R = 50 : Q 30pf 5pf 333 : Figure 1 Figure 2 DC ELECTRICAL CHARACTERISTICS Sym Parameter Conditions Min Max 20/25 200 Units ns mA Operating Power Supply Current ICC1 W#=VIL, II/O=0mA, Min Cycle 12/15 220 Standby (TTL) Power Supply Current ICC2 E#VIH, VINVIL or VINVIH, f=0MHz 80 80 mA 15 15 mA Full Standby Power Supply Current CMOS ICC3 E#VCC-0.2V VINVCC-0.2V or VIN0.2V Input Leakage Current ILI VIN=0V to VCC ±5 μA Output Leakage Current ILO VI/O=0V to VCC ±5 μA Ouput High Voltage VOH IOH=-4.0mA Output Low Voltage VOL IOL=8.0mA TRUTH TABLE G# E# W# Mode Output H X Standby HIGH Z H L H Output Deselect ICC1 L L H Read HIGH Z DOUT X L L Write DIN ICC1 AS8SLC512K32PECA Rev. 0.2 03/11 CAPACITANCE (f=1.0MHz, VIN=VCC or VSS) Parameter Sym Address Lines CI Data Lines CD/Q Write & Output Enable Line W#, G# Chip Enable Line E0#, E3# Power ICC2 X 2.4 ICC3 ICC1 V 0.45 V Max 24 7 24 7 Unit pF pF pF pF Micross Components reserves the right to change products or specifications without notice. 2 iPEM 16 Mb ASYNC SRAM AS8SLC512K32PECA AC CHARACTERISTICS READ CYCLE Symbol JEDEC Alt. tAVAV tRC Parameter Read Cycle Time Address Access Time tAVQV tAA Chip Enable Access tELQV tACS Chip Enable to Output in Low Z tELQX tCLZ Chip Disable to Output in High Z tEHQZ tCHZ Output Hold from Address Change tAVQX tOH Output Enable to Output Valid tGLQV tOE Output Enable to Output in Low Z tGLQX tOLZ Output Enable to Output in High Z tGHQZ tOHZ 12ns Min Max 12 15ns Min Max 15 12 15 12 2 6 7 6 0 20 2 2 9 7 6 9 7 25 ns 9 ns ns ns 9 ns 9 ns 0 9 ns ns 2 0 Units 25 2 2 0 25ns Min Max 25 20 15 2 2 20ns Min Max 20 ns READ CYCLE 1 - W\ HIGH, G\, E\ LOW tAVAV A ADDRESS 1 ADDRESS 2 tAVQV tAVQX Q DATA 1 DATA 2 READ CYCLE 2 - W\ HIGH tAVAV A tAVQV E# tELQV tEHQZ tELQX G# tGLQV t GHQZ tGLQX Q AS8SLC512K32PECA Rev. 0.2 03/11 Micross Components reserves the right to change products or specifications without notice. 3 iPEM 16 Mb ASYNC SRAM AS8SLC512K32PECA AC CHARACTERISTICS WRITE CYCLE Symbol JEDEC Alt. tAVAV tWC Parameter Write Cycle Time 12ns Min Max 12 15ns Min Max 15 20ns Min Max 20 25ns Min Max 25 Units ns tELWH tCW 8 10 11 12 ns tELEH tCW 8 10 11 12 ns tAVWL tAS 0 0 0 0 ns tAVEL tAS 0 0 0 0 ns tAVWH tAW 8 10 11 12 ns tAVEH tAW 8 10 11 12 ns tWLWH tWP 8 10 11 12 ns tELEH tWP 10 12 13 14 tWHAZ tWR 0 0 0 0 tEHAZ tWR 0 0 0 0 tWHDX tDH 0 0 0 0 tEHDZ tDH 0 0 0 0 Write to Output in High Z tWLQZ tWHZ 0 Data to Write Time tDVWH tDW 6 7 8 9 n tDVEH tDW 6 7 8 9 Output Active from End of Write tWHQX tWLZ 2 2 2 2 Chip Enable to End of Write Address Setup Time Address Valid to End of Write Write Pulse Width Write Recovery Time Data Hold Time 6 0 7 0 8 0 ns ns 9 ns ns WRITE CYCLE 1 - W\ CONTROLLED tAVAV A E\ tELWH tWHAX tAVWH tWLWH W\ tAVWL tDVWH D DATA VALID tWHQX tWLQZ HIGH Z Q AS8SLC512K32PECA Rev. 0.2 03/11 tWHDX Micross Components reserves the right to change products or specifications without notice. 4 iPEM 16 Mb ASYNC SRAM AS8SLC512K32PECA WRITE CYCLE 2 - E\ CONTROLLED tAVAV A tAVEL tELEH E\ tAVEH tEHAX tWLEH W\ tDVEH D tEHDX DATA VALID HIGH Z Q PACKAGE DRAWING Package No. 99 68 Lead PLCC JEDEC MO-47AE 0.995 Max 0.956 Max 0.180 Max 0.995 0.956 Max Max 0.040 Max AS8SLC512K32PECA Rev. 0.2 03/11 0.020 0.015 0.930 0.890 0.050 BSC 0.115 Max Micross Components reserves the right to change products or specifications without notice. 5 iPEM 16 Mb ASYNC SRAM AS8SLC512K32PECA NC G\ W\ A16 A15 A14 DQ15 E0\ NC Vcc NC NC G\ W\ A16 A15 A14 DQ15 E0\ NC Vcc NC NC G\ W\ A16 A15 A14 DQ15 3 2 1 68 67 66 65 64 63 62 61 A19 A20 Vcc E1\ E1\ 4 E0\ E2\ E2\ E2\ 5 E1\ E3\ E3\ E3\ 6 4Mb-SRAM, 128K x 32: 5.0V = AS8S128K32PEC A17 A17 NC 7 16Mb-SRAM, 512K x 32: 5.0V = AS8S512K32PEC 3.3V = AS8SLC512K32PEC A18 A18 NC DQ16 DQ16 DQ16 8 64Mb-SRAM, 2M x 32: 3.3V = AS8SLC2M32PEC 9 FAMILY PIN MATRIX DQ17 DQ17 DQ17 10 60 DQ14 DQ14 DQ14 DQ18 DQ18 DQ18 11 59 DQ13 DQ13 DQ13 DQ19 DQ19 DQ19 12 58 DQ12 DQ12 DQ12 Vss Vss Vss 13 57 Vss Vss Vss DQ20 DQ20 DQ20 14 56 DQ11 DQ11 DQ11 DQ21 DQ21 DQ21 15 55 DQ10 DQ10 DQ10 DQ22 DQ22 DQ22 16 54 DQ09 DQ09 DQ09 DQ23 DQ23 DQ23 17 53 DQ08 DQ08 DQ08 Vcc Vcc Vcc 18 52 Vcc Vcc Vcc DQ24 DQ24 DQ24 19 51 DQ07 DQ07 DQ07 DQ25 DQ25 DQ25 20 50 DQ06 DQ06 DQ06 DQ26 DQ26 DQ26 21 49 DQ05 DQ05 DQ05 DQ27 DQ27 DQ27 22 48 DQ04 DQ04 DQ04 Vss Vss Vss 23 47 Vss Vss Vss DQ28 DQ28 DQ28 24 46 DQ03 DQ03 DQ03 DQ29 DQ29 DQ29 25 45 DQ02 DQ02 DQ02 DQ30 DQ30 DQ30 26 44 DQ01 DQ01 DQ01 AS8SLC512K32PECA Rev. 0.2 03/11 40 41 42 43 A09 A08 A07 DQ00 A09 A08 A07 DQ00 A09 A08 A07 DQ00 39 A10 A10 36 A13 A13 A13 A10 35 Vcc Vcc Vcc 38 34 A0 A0 A0 A11 33 A1 A1 A1 A11 32 A2 A2 A2 A11 31 A3 A3 A3 37 30 A4 A4 A4 A12 29 A5 A5 A5 A12 28 A6 A6 A6 A12 27 DQ31 DQ31 DQ31 AUSTIN SEMICONDUCTOR 68 - LD. PLCC [JEDEC MO-47AE] Micross Components reserves the right to change products or specifications without notice. 6 iPEM 16 Mb ASYNC SRAM AS8SLC512K32PECA ORDERINGINFORMATION PartNumber AS8SLC512K32PECͲES AS8SLC512K32PECͲ12/IT AS8SLC512K32PECͲ15/IT AS8SLC512K32PECͲ20/IT AS8SLC512K32PECͲ25/IT AS8SLC512K32PECͲ12/ET AS8SLC512K32PECͲ15/ET AS8SLC512K32PECͲ20/ET AS8SLC512K32PECͲ25/ET AS8SLC512K32PECͲ12/XT AS8SLC512K32PECͲ15/XT AS8SLC512K32PECͲ20/XT AS8SLC512K32PECͲ25/XT AS8SLC512K32PECAͲ12/IT AS8SLC512K32PECAͲ15/IT AS8SLC512K32PECAͲ20/IT AS8SLC512K32PECAͲ25/IT AS8SLC512K32PECAͲ12/ET AS8SLC512K32PECAͲ15/ET AS8SLC512K32PECAͲ20/ET AS8SLC512K32PECAͲ25/ET AS8SLC512K32PECAͲ12/XT AS8SLC512K32PECAͲ15/XT AS8SLC512K32PECAͲ20/XT AS8SLC512K32PECAͲ25/XT AccessSpeed NA 12ns 15ns 20ns 25ns 12ns 15ns 20ns 25ns 12ns 15ns 20ns 25ns 12ns 15ns 20ns 25ns 12ns 15ns 20ns 25ns 12ns 15ns 20ns 25ns DeviceGrade EngineeringSample Industrial Industrial Industrial Industrial Enhanced Enhanced Enhanced Enhanced Military Military Military Military Industrial Industrial Industrial Industrial Enhanced Enhanced Enhanced Enhanced Military Military Military Military Availability Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Production Production Production Production Production Production Production Production Production Production Production Production OB SOL ETE AS8SLC512K32PECA Rev. 0.2 03/11 Micross Components reserves the right to change products or specifications without notice. 7 iPEM 16 Mb ASYNC SRAM AS8SLC512K32PECA DOCUMENT TITLE 16Mb, 512K x 32, SRAM, 3.3V, 0.990”sq. - 68 LD. PLCC, Multi-Chip Package [iPEM] REVISION HISTORY Rev # 0.0 History Initial Release Release Date July 2008 Status Advance 0.1 Added Micross Information January 2010 Advance 0.2 Upgraded document to “Release” status. March 2011 Obsoleted and discontinued PEC package which had pin-out errors. Added PECA package reflecting correct pin-out. Contact Micross for whitepaper addressing the pin-out error on the PEC package. AS8SLC512K32PECA Rev. 0.2 03/11 Release Micross Components reserves the right to change products or specifications without notice. 8