REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHEET REV SHEET 15 16 17 18 19 20 REV STATUS REV OF SHEETS SHEET PMIC N/A PREPARED BY Steve Duncan STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A 21 22 1 2 3 4 5 DRAWING APPROVAL DATE 08-11-17 REVISION LEVEL 8 9 10 11 12 13 http://www.dscc.dla.mil/ MICROCIRCUIT, MEMORY, DIGITAL, 3.3 VOLT BOOT BLOCK FLASH EPROM, 1M X 32-BIT, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 7 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 CHECKED BY Greg Cecil APPROVED BY Robert M. Heber 6 1 OF 5962-09205 22 5962-E048-09 14 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 Federal stock class designator \ RHA designator (see 1.2.1) 09205 01 Device type (see 1.2.2) / H Device class designator (see 1.2.3) X Case outline (see 1.2.4) X Lead finish (see 1.2.5) \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 02 03 04 Generic number AS8FLC1M32BQT-120/Q AS8FLC1M32BQT-100/Q AS8FLC1M32BQT-90/Q AS8FLC1M32BQT-70/Q Circuit function Access time FLASH EPROM, 1M x 32-bit FLASH EPROM, 1M x 32-bit FLASH EPROM, 1M x 32-bit FLASH EPROM, 1M x 32-bit 120 ns 100 ns 90 ns 70 ns 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 2 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Y Descriptive designator See figure 1 See figure 1 Terminals Package style 68 66 Ceramic quad flatpack, lead formed Pin-Grid-Array (66 HIP) 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) 2/............................................................. Signal voltage range (any pin except A9) 2/ ........................................ Power dissipation (PD)......................................................................... Storage temperature range ................................................................. Lead temperature (soldering, 10 seconds) .......................................... Data retention...................................................................................... Endurance (write/erase cycles) ........................................................... -0.5 V dc to +4.0 V dc -0.5 V dc to VCC +0.5 V dc 0.33 W maximum at 5 MHz -65C to +150C +300C 10 years minimum 100,000 cycles minimum RESET , OE , and A9 voltage for auto select and sector protect (VID): ............................................................................................................ -0.5 V dc to +12.5 V dc 3/ 1.4 Recommended operating conditions. Supply voltage range (VCC).................................................................. Input low voltage range (VIL)................................................................ Input high voltage range (VIH).............................................................. Case operating temperature range (TC) .............................................. +3.0 V dc to +3.6 V dc -0.5 V dc to +0.8 V dc +2.2 V dc to VCC + 0.3 V dc -55C to +125C RESET , OE , and A9 voltage for auto select and sector protect (VID), (VCC = +3.3 V): ..................................................................................... +11.5 V dc to +12.5 V dc 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Minimum DC voltage in input or I/O pins is -0.5 V dc. During voltage transitions, inputs may overshoot VSS to -2.0 V dc for periods up to 20 ns. Maximum DC voltage on output and I/O pins VCC +0.5 V dc. During voltage transitions, outputs may overshoot to VCC +2.0 V dc for periods up to 20 ns. 3/ Minimum DC input voltage on RESET , OE , and A9 is -0.5 V dc. During voltage transitions, RESET , OE , and A9 may overshoot VSS to -2.0 V dc for periods up to 20 ns. Maximum DC input voltage on A9 is +13.5 V which may overshoot to +14.0 V dc for periods up to 20 ns. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 3 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3. 3.2.4 Timing diagrams. The timing diagram(s) shall be specified on figures 4, 5, and 6. 3.2.5 Block diagram. The block diagram shall be as specified on figure 7. 3.2.6 Output load circuit. The output load circuit shall be as specified on figure 8. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available upon request. 3.6 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. 3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 4 3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 3.10 Endurance. A reprogrammability test shall be completed as part of the vendor’s reliability monitors. This reprogrammability test shall be done for the intial characterization and after any design process changes which may affect the reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of program/erase cycles listed in section 1.3 herein over the full military temperature range as specified herein. The vendors procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity. 3.11 Data retention. A data retention stress test shall be completed as part of the vendor’s reliabilty monitors. This test shall be done for the intial characterization and after any design or process change which may affect data retention. The methods and procedures may be vendor specific, but shall gurantee the number of years listed in section 1.3 herein over the full military temperature range as specified herein. The vendor’s procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 5 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ -55C TC +125C unless otherwise specified Group A subgroups Limits Device types Min Unit Max DC parameters Input leakage current ILI VCC = 3.6 V dc, VIN = GND to VCC 1,2,3 All 5 A Output leakage current ILO VCC = 3.6 V dc, VIN = GND to VCC 1,2,3 All 5 A VCC active current for read ICC1 CS = VIL, OE = VIH, f = 8 MHz, VCC = 3.6 V dc 1,2,3 All 70 mA 120 mA CS = VIL, OE = VIH, f = 14 MHz, VCC = 3.6 V dc VCC active current for Program or erase 3/ ICC2 CS = VIL, OE = VIH, VCC = 3.6 V dc 1,2,3 All 140 mA VCC standby current ICC3 VCC = 3.6 V dc, CS = VIH, f = 5 MHz, 1,2,3 All 0.25 mA RESET = VCC 0.3 V Input low level 3/ VIL 1,2,3 All -0.5 0.8 V Input high level 3/ VIH 1,2,3 All 2.2 VCC + 0.3 V V Output low voltage VOL VCC = 4.5 V dc, IOL = 12.0 mA 1,2,3 All 0.45 V Output high voltage VOH VCC = 4.5 V dc, IOH = -2.0 mA 1,2,3 All 2.4 Low VCC , lockout voltage VLKO 1,2,3 All 2.3 V 2.5 V Dynamic characteristics Address capacitance 3/ CAD VIN = 0 V dc, f = 1.0 MHz, TA = +25C 4 All 40 pF Output enable Capacitance COE VIN = 0 V dc, f = 1.0 MHz, TA = +25C 4 All 40 pF 3/ See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ -55C TC +125C unless otherwise specified Group A subgroups Limits Device types Min Unit Max Dynamic characterisitics - continued Write enable 3/ Capacitance CWE VIN = 0 V dc, f = 1.0 MHz, TA = +25C 4 All 15 pF Chip select capacitance 3/ CCS VIN = 0 V dc, f = 1.0 MHz, TA = +25C 4 All 15 pF Data I/O capacitance 3/ CI/O VIN = 0 V dc, f = 1.0 MHz, TA = +25C 4 All 15 pF See 4.3.1c 7,8A,8B All Functional testing Functional tests Read cycle AC timing characteristics Read cycle time 3/ tRC See figure 4 9,10,11 01 02 03 04 Address access time tACC See figure 4 9,10,11 01 02 03 04 120 100 90 70 ns Chip select access time tCE See figure 4 9,10,11 01 02 03 04 120 100 90 70 ns Output enable to output valid tOE See figure 4 9,10,11 01 02 03 04 40 35 35 30 ns Output hold from address, tOH See figure 4 9,10,11 All 0 ns tSR/W See figure 4 9,10,11 All 20 ns CS or OE change, Whichever is first 120 100 90 70 ns 3/ Latency between read and write operations See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ -55C TC +125C unless otherwise specified Group A subgroups Limits Device types Min Unit Max Write/Erase/ Program AC timing characteristics WE controlled Write cycle time 3/ tWC See figure 5 9,10,11 01 02 03 04 120 100 90 70 ns Chip select setup time tCS See figure 5 9,10,11 All 0 ns Write enable pulse width tWP See figure 5 9,10,11 All 35 ns Address setup time tAS See figure 5 9,10,11 All 0 ns Data setup time tDS See figure 5 9,10,11 01,02 45 ns 03 40 04 35 Data hold time tDH See figure 5 9,10,11 All 0 ns Address hold time tAH See figure 5 9,10,11 All 45 ns Write enable pulse width 3/ High tWPH See figure 5 9,10,11 All 30 ns Write/Erase/Program AC timing characteristics CS controlled Write cycle time 3/ tWC See figure 6 9,10,11 01 02 03 04 120 100 90 70 ns Write enable setup time tWS See figure 6 9,10,11 All 0 ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 8 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ -55C TC +125C unless otherwise specified Group A subgroups Limits Device types Min Unit Max Write/Erase/ Program AC timing characteristics CS controlled - continued Chip select pulse width tCP See figure 6 9,10,11 All 35 ns Address setup time tAS See figure 6 9,10,11 All 0 ns Data hold time tDH See figure 6 9,10,11 All 0 ns Data setup time tDS See figure 6 9,10,11 01,02 45 ns 03 40 04 35 Address hold time tAH See figure 6 9,10,11 All 45 ns Chip select pulse width 3/ High tCPH See figure 6 9,10,11 All 30 ns 1/ Unless otherwise specified, 3.0 V dc VCC 3.6 V dc and VSS = 0 V. 2/ Unless otherwise specified, the DC test conditions are as follows: Input pulse levels: VIH = VCC - 0.3 V and VIL = 0.3 V. Unless otherwise specified, the AC test conditions are as follows: Input pulse levels: VIL = 0 V and VIH = 3.0 V. Input rise and fall times: 5 nanoseconds. Input and output timing reference levels: 1.5 V. 3/ Parameters shall be tested as part of device characterization and after design and process changes. Parameters shall be guaranteed to the limits specified in table I for all lots not specifically tested. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 9 Case X. FIGURE 1. Case outline. FIGURE 1. Case outline(s). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 10 Case X - Continued. Symbol Millimeters Inches Min Max Min Max A 3.05 3.56 .120 .140 A2 0.13 0.38 .005 .015 B b .25 REF .010 REF 0.15 D/E 0.25 .006 20.32 BSC .010 .800 BSC D1/E1 22.10 22.61 .870 .890 D2/E2 24.89 25.40 .980 1.000 e L 1.27 BSC 0.89 R .050 BSC 1.14 .035 0.25 TYP .045 .010 TYP NOTES: 1. The U.S preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. FIGURE 1. Case outline(s) – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 11 Case outline Y. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 12 Case outline Y - Continued. Symbol Millimeters Inches Min Max Min Max A 5.33 6.22 .210 .245 A1 0.64 0.89 .025 .035 b 0.41 0.51 .016 .020 b1 1.14 1.40 .045 .055 b2 1.65 1.91 .065 .075 D/E 29.72 30.48 1.170 1.200 D1/E1 25.40 BSC 1.000 BSC D2 15.24 BSC .600 BSC D3 28.96 e L 29.21 1.140 2.54 BSC 3.68 1.150 .100 BSC 3.94 .145 .155 NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin 1 is identified by a .070 square pad. 3. Pin numbers are for reference only. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 13 Device types All Device types All Device types All Device types All Case outline X Case outline X Case outline X Case outline X Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 GND 18 GND 35 OE 52 GND 2 CS3 19 DQ8 36 CS2 53 DQ23 3 A5 20 DQ9 37 A17 54 DQ22 4 A4 21 DQ10 38 WE 2 55 DQ21 5 A3 22 DQ11 39 WE 3 56 DQ20 6 A2 23 DQ12 40 WE 4 57 DQ19 7 A1 24 DQ13 41 A18 58 DQ18 8 A0 25 DQ14 42 A19 59 DQ17 9 RESET 26 DQ15 43 NC 60 DQ16 10 DQ0 27 V 44 DQ31 61 V 11 DQ1 28 A11 45 DQ30 62 A10 12 DQ2 29 A12 46 DQ29 63 A9 13 DQ3 30 A13 47 DQ28 64 A8 14 DQ4 31 A14 48 DQ27 65 A7 15 DQ5 32 A15 49 DQ26 66 A6 16 DQ6 33 A16 50 DQ25 67 WE1 17 DQ7 34 CS1 51 DQ24 68 CS4 CC CC Note: NC = No connection FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 14 Device type All Device type All Device type All Device type All Case outline 4 Case outline 4 Case outline 4 Case outline 4 Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 DQ8 18 A15 35 DQ25 52 NC 2 DQ9 19 V 36 DQ26 53 CS3 3 DQ10 20 CS1 37 A7 54 GND 4 A14 21 A19 38 A12 55 DQ19 5 A16 22 DQ3 39 NC 56 DQ31 6 A11 23 DQ15 40 A13 57 DQ30 7 A0 24 DQ14 41 A8 58 DQ29 8 A18 25 DQ13 42 DQ16 59 DQ28 9 DQ0 26 DQ12 43 DQ17 60 A1 10 DQ1 27 OE 44 DQ18 61 A2 11 DQ2 28 A17 45 V 62 A3 12 RESET 29 WE1 46 CS4 63 DQ23 13 CS2 30 DQ7 47 NC 64 DQ22 14 GND 31 DQ6 48 DQ27 65 DQ21 15 DQ11 32 DQ5 49 A4 66 DQ20 16 A10 33 DQ4 50 A5 17 A9 34 DQ24 51 A6 CC CC NOTE: NC is a no connection FIGURE 2. Terminal connections. - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 15 RESET CS1 CS2 CS3 L H H H L L H H H L vcc 0.3 v H L H H L H L H H L vcc 0.3 v H H L H L H H L H L vcc 0.3 v X L L L L X X VID L VID VID H H vcc 0.3 v CS4 H H H L L H H H L L vcc 0.3 v WE1 WE 2 WE 3 WE 4 OE OPERATION ADRESSES H H H H L READ A0-Ax In L H H H L H L H H L H H L H L H H H L L H WRITE A0-Ax In X X X X X X L H H H H H Standby Output Disable X X X X X X X Reset L L L L L L L H Sector Protect L L L L L L L L H Sector Unprotect X X X X X X X X X DATA BUS DQ0-DQ7 Out DQ8-DQ15 Out DQ16-DQ31Out DQ24-DQ31 Out DQ0-DQ31 Out DQ0-DQ7 In DQ8-DQ15 In DQ16-DQ31 In DQ24-DQ31In DQ0-DQ31In X X Sector Address A7=L,A2=H, A1=L Sector Address A7=L,A2=H, A1=L Temporary Sector Unprotect DIN, DOUT DIN, DOUT DIN AIN NOTE: L = logic low = VIL, H = logic high = VIH, VID = 12.0 0.5 V, X = Don't Care, AIN = Address In, DOUT = Data Out. FIGURE 3. Truth table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 16 FIGURE 4. Read cycle timing diagram. NOTE: DQ7 of each die including DQ15, DQ23, and DQ31. FIGURE 5. Write cycle timing diagram, WE controlled. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 17 NOTE: DQ7 of each die including DQ15, DQ23, and DQ31. FIGURE 6. Write cycle timing diagram, CS controlled. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 18 FIGURE 7. Block diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 19 Typ. Unit Input pulse level VIL = 0 V, VIH = 3.0 V V Input rise and fall 5 ns Input and output reference level 1.5 V Timing reference level 1.5 V Parameter NOTES: 1. VZ is programmable from -2 V to +7 V. 2. IOL and IOH are programmable from 0 to 16 mA. 3. Tester impedance is Z = 50 ohms. 0 4. VZ is typically the midpoint of VOL and VOH. 5. I OL and IOH are adjusted to simulate a typical resistive load circuit. 6. ATE tester includes jig capacitance. FIGURE 8. Output load circuit. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 20 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1,4,7,9 Final electrical parameters 1*, 2,3,4,7,8A,8B,9,10,11 Group A test requirements 1,2,3,4,7,8A,8B,9,10,11 Group C end-point electrical parameters 1,2,3,4,7,8A,8B,9,10,11 End-point electrical parameters for Radiation Hardness Assurance (RHA) devices Not applicable * PDA applies to subgroup 1. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) (2) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. TA as specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table on figure 3. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 21 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-1081. 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-09205 A REVISION LEVEL SHEET 22 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 08-11-17 Approved sources of supply for SMD 5962-09205 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. 1/ 2/ Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-0920501HXA 5962-0920501HXC 5962-0920501HYA 5962-0920501HYC OEU86 OEU86 OEU86 OEU86 AS8FLC1M32BQT-120/Q AS8FLC1M32BQT-120/Q AS8FLC1M32BP-120/Q AS8FLC1M32BP-120/Q 5962-0920502HXA 5962-0920502HXC 5962-0920502HYA 5962-0920502HYC OEU86 OEU86 OEU86 OEU86 AS8FLC1M32BQT-100/Q AS8FLC1M32BQT-100/Q AS8FLC1M32BP-100/Q AS8FLC1M32BP-100/Q 5962-0920503HXA 5962-0920503HXC 5962-0920503HYA 5962-0920503HYC OEU86 OEU86 OEU86 OEU86 AS8FLC1M32BQT-90/Q AS8FLC1M32BQT-90/Q AS8FLC1M32BP-90/Q AS8FLC1M32BP-90/Q 5962-0920504HXA 5962-0920504HXC 5962-0920504HYA 5962-0920504HYC OEU86 OEU86 OEU86 OEU86 AS8FLC1M32BQT-70/Q AS8FLC1M32BQT-70/Q AS8FLC1M32BP-70/Q AS8FLC1M32BP-70/Q Vendor Similar PIN 2/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE Number OEU86 Vendor name and address Austin Semiconductor, Incorporated 8701 Cross Park drive Austin, TX 78754-4566 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.