REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R247-94. 94-07-25 K. A. Cottongim B Add case outlines T, U, Y, and Z. 98-02-23 K. A. Cottongim C Added device type 02. Updated table I for the addition of RadHard limits for the device type 02. Updated paragraph 4.3.5 to add the RadHard requirements. Redrew entire document. -sld. 02-06-21 Raymond Monnin REV SHEET REV C C C SHEET 15 16 17 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Steve Duncan STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS POST OFFICE BOX 3990 COLUMBUS, OHIO 43216-5000 http://www.dscc.dla.mil CHECKED BY Michael C. Jones APPROVED BY Kendall A. Cottongim MICROCIRCUIT, HYBRID, LINEAR, 5 VOLT, SINGLE CHANNEL, DC-DC CONVERTER DRAWING APPROVAL DATE 94-05-25 REVISION LEVEL C SIZE A CAGE CODE 5962-93163 67268 SHEET DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 1 OF 17 5962-E451-02 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 Federal stock class designator \ RHA designator (see 1.2.1) 93163 01 Device type (see 1.2.2) / H Device class designator (see 1.2.3) X Case outline (see 1.2.4) X Lead finish (see 1.2.5) \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 02 Circuit function MFL2805S SMFL2805S DC-DC converter, 50 W, +5 V output DC-DC converter, 50 W, +5 V output 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 2 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter T U X Y Z Descriptive designator See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 Terminals Package style 12 12 12 12 12 Tabbed flange mount, lead formed up Flange mount, lead formed down Flange mount, short lead Tabbed flange mount, short lead Tabbed flange mount, lead formed down 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Input voltage range 2/............................................................... Power dissipation (PD): Device types 01and 02 (non-RHA) ........................................ Device type 02 (RHA level R) ................................................ Lead soldering temperature (10 seconds)................................. Storage temperature range ....................................................... -0.5 V dc to +50 V dc 18 W 20 W +300°C -65°C to +150°C 1.4 Recommended operating conditions. Input voltage range (VIN)............................................................ Output power ............................................................................. Case operating temperature range (TC) .................................... +16 V dc to +40 V dc ≤ 50 W -55°C to +125°C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. HANDBOOKS 1/ 2/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. An undervoltage lockout circuit shuts the unit off when the input voltage drops to approximately 12 volts. Operation of the unit between 12 volts and 16 volts is nondestructive at reduced output power, but performance is not guaranteed. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 3 DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534). Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked in MIL-HDBK-103 and QML-38534. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 4 TABLE I. Electrical performance characteristics. Test Output voltage Symbol VOUT Conditions 1/ -55°C ≤ TC ≤ +125°C VIN = 28 V dc ±0.5 V no external sync unless otherwise specified Group A subgroups IOUT = 10 A dc 1 Device types 01,02 2,3 R Output current IOUT VIN = 16 V dc to 40V dc R VOUT ripple voltage VRIP IOUT = 10 A, B.W. = 10 kHz to 2 MHz VRLINE VRLOAD IIN 4.875 5.125 1,2,3 02 4.70 5.30 1,2,3 01,02 0.0 10 1,2,3 02 0.0 10 1 01,02 20 1,2,3 02 30 1,2,3 01,02 20 1,2,3 02 30 1,2,3 01,02 120 1,2,3 02 150 1,2,3 01,02 14 R 1,2,3 02 17 IOUT = 0 A, Inhibit 2 (pin 12) tied to output return (pin 8) 1,2,3 01,02 70 R 1,2,3 02 90 1,2,3 01,02 8.8 12 1,2,3 02 8.8 12 IOUT = 0 A, Inhibit (pin 4 and pin 12) = open VOUT < 1.0 V dc R A mVp-p 50 01,02 IOUT = 0 to 5 A V 35 1,2,3 IOUT = 10 A, VIN =16V dc to 40V dc IOUT = 0 A, Inhibit 1(pin4) tied to input return (pin 2) ISC 5.05 75 R Short circuit current 4.95 02 R Input current Max 1,2,3 R VOUT load regulation Unit Min 2,3 R VOUT line regulation Limits mV mV mA A See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Symbol IIN ripple current IRIP Conditions 1/ -55°C ≤ TC ≤ +125°C VIN = 28 V dc ±0.5 V no external sync unless otherwise specified Group A subgroups IOUT = 10 A, B.W. = 10 kHz to 10 MHz 1 Device types Limits Min 01,02 Efficiency Eff 02 1 01 77 02 75 01 75 02 73 1,2,3 02 72 Input to output or any pin to case at 500 V dc, TC = +25°C 1 01,02 100 R 1 02 100 4 01,02 1000 4 02 1000 1 01,02 16 IOUT = 10 A R ISO Capacitive load 2/ 3/ CL No effect on dc performance, TC = +25°C R Power dissipation load fault PD Short circuit 75 2,3 R Switching frquency FS IOUT = 10 A External sync range 4/ FSYNC IOUT = 10 A, TTL level to pin 6 R % MΩ µF W 18 1,2,3 02 20 4 01,02 5,6 R mAp-p 50 1,2,3 2,3 Isolation Max 45 2,3 R Unit 550 650 525 675 4,5,6 02 500 700 4,5,6 01,02 525 675 4,5,6 02 525 675 kHz kHz See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol VOUT step load transient 5/ VTLOAD Conditions 1/ -55°C ≤ TC ≤ +125°C VIN = 28 V dc ±0.5 V no external sync unless otherwise specified Group A subgroups Device types Limits Unit Min Max 01 -350 +350 02 -500 +500 01 -350 +350 02 -500 +500 4,5,6 02 -1200 +1200 4,5,6 01,02 3.0 4,5,6 02 4.0 4,5,6 01,02 3.0 R 4,5,6 02 4.0 IOUT = 10 A, Input step 16 V dc to 40 V dc 4,5,6 01,02 300 R 4,5,6 02 400 IOUT = 10 A, Input step 40 V dc to 16 V dc 4,5,6 01,02 300 R 4,5,6 02 400 IOUT = 10 A, Input step 16 V dc to 40 V dc 4,5,6 01,02 300 R 4,5,6 02 400 IOUT = 10 A, Input step 40 V dc to 16 V dc 4,5,6 01,02 300 R 4,5,6 02 400 IOUT = 10 A, VIN = 0 to 40 V dc 4,5,6 01,02 25 R 4,5,6 02 50 IOUT = 5 A to 10 A 4,5,6 IOUT = 10 A to 5 A IOUT = 5 A to 10 A R mV pk IOUT = 10 A to 5 A VOUT step load transient recovery 3/ 5/ 6/ TTLOAD IOUT = 5 A to 10 A R IOUT = 10 A to 5 A VOUT step line transient 3/ 7/ VOUT step line transient recovery 3/ 6/ 7/ Start up overshoot 3/ VTLINE TTLINE VtonOS ms mV pk µs mV pk See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Start up delay 8/ Load fault recovery 3/ Symbol TonD TrLF Conditions 1/ -55°C ≤ TC ≤ +125°C VIN = 28 V dc ±0.5 V no external sync unless otherwise specified Group A subgroups Device types Limits IOUT = 10 A, VIN = 0 to 28 V dc 4,5,6 01,02 6 R 4,5,6 02 12 4,5,6 01,02 4 4,5,6 02 8 Min IOUT = 10 A R Unit Max ms ms 1/ Post irradiation testing shall be in accordance with 4.3.5 herein. 2/ Capacitive load may be any value from 0 to the maximum limit without compromising dc performance. 3/ Parameter shall be tested as part of design characterization and after design or process changes; therefore, the parameter shall be guaranteed to limits specified in table I. 4/ A TTL level waveform (VIH = 4.5 V minimum, VIL = 0.8 V maximum) with a 50 percent ±10 percent duty cycle applied to the sync input pin (pin 6) within the the sync range frequency shall cause the converter's switching frequency to become synchronous with the frequency applied to the sync input pin (pin 6). 5/ Load step transition time is between 2 and 10 microseconds. 6/ Recovery time is measured from the initiation of the transient until VOUT has returned to within ±1 percent of its final value. 7/ Input step transition time greater than 10 microseconds. 8/ Turn-on delay time measurement is either for a step application of power at the input or the removal of a ground signal from the inhibit 1 pin (pin 4) or inhibit 2 pin (pin 12) while power is applied to the input STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 8 Case outline T. Symbol A A1 φb D D1 e E E1 F L φP q/q1 q2 s T Millimeters Min Max 10.16 5.33 5.84 0.89 1.14 50.55 51.05 37.85 38.35 5.08 BSC 69.85 72.39 63.25 63.75 1.14 1.40 6.10 6.60 3.43 3.68 44.20 44.70 28.96 29.46 6.10 6.60 10.92 11.43 Inches Min Max .400 .210 .230 .035 .045 1.990 2.010 1.490 1.510 .200 BSC 2.750 2.850 2.490 2.510 .045 .055 .240 .260 .135 .145 1.740 1.760 1.140 1.160 .240 .260 .430 .450 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inchpound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Device weight: 86 grams maximum. FIGURE 1. Case outline(s). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 9 Case outline U. Symbol Millimeters Min Max 10.16 5.46 5.72 0.89 1.14 37.97 38.23 5.08 BSC 3.30 BSC 87.38 87.88 75.95 76.45 63.37 63.63 1.14 1.40 6.10 6.60 11.94 12.19 3.12 3.38 31.88 32.13 69.85 70.36 6.22 6.48 5.84 6.86 A A1 φb D e e1 E E1 E2 F L L1 φP q q1 S T Inches Min Max .400 .215 .225 .035 .045 1.495 1.505 .200 BSC .130 BSC 3.440 3.460 2.990 3.010 2.495 2.505 .045 .055 .240 .260 .470 .480 .123 .133 1.255 1.265 2.750 2.770 .245 .255 .230 .270 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inchpound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Device weight: 86 grams maximum. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 10 Case outline X. Symbol Millimeters Min Max 10.16 5.46 5.72 0.89 1.14 37.97 38.23 5.08 BSC 3.30 BSC 75.95 76.45 63.37 63.63 1.14 1.40 6.10 6.60 5.58 6.10 3.12 3.38 31.88 32.13 69.85 70.36 6.22 6.48 A A1 φb D e e1 E E1 F L L1 φP q q1 S Inches Min Max .400 .215 .225 .035 .045 1.495 1.505 .200 BSC .130 BSC 2.990 3.010 2.495 2.505 .045 .055 .240 .260 .220 .240 .123 .133 1.255 1.265 2.750 2.770 .245 .255 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inchpound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Device weight: 86 grams maximum. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 11 Case outline Y. Symbol Millimeters Min Max 10.16 5.33 5.84 0.89 1.14 50.55 51.05 37.85 38.35 5.08 BSC 63.25 63.75 1.14 1.40 6.99 8.26 6.10 6.60 3.43 3.68 44.20 44.70 28.96 29.46 6.10 6.60 A A1 φb D D1 e E F L L1 φP q/q1 q2 s Inches Min Max .400 .210 .230 .035 .045 1.990 2.010 1.490 1.510 .200 BSC 2.490 2.510 .045 .055 .275 .325 .240 .260 .135 .145 1.740 1.760 1.140 1.160 .240 .260 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inchpound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Device weight: 86 grams maximum. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 12 Case outline Z. Symbol Millimeters Min Max 10.16 5.33 5.84 0.89 1.14 50.55 51.05 37.85 38.35 5.08 BSC 69.85 72.39 63.25 63.75 1.14 1.40 6.10 6.60 3.43 3.68 44.20 44.70 28.96 29.46 6.10 6.60 8.64 9.65 A A1 φb D D1 e E E1 F L φP q/q1 q2 s T Inches Min Max .400 .210 .230 .035 .045 1.990 2.010 1.490 1.510 .200 BSC 2.750 2.850 2.490 2.510 .045 .055 .240 .260 .135 .145 1.740 1.760 1.140 1.160 .240 .260 .340 .380 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inchpound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Device weight: 86 grams maximum. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 13 Device types 01 and 02 Case outlines T, U, X, Y, and Z Terminal number 1 2 3 4 5 6 7 8 9 10 11 12 Terminal symbol Input Input common Tri Inhibit 1 Sync output Sync input Positive output Output common Remote sense return Positive remote sense Slave to master Master to slave/ Inhibit 2 NOTES: 1. Multiple devices may be used in parallel to drive a common load. When using this mode of operation the load current is shared by two or three devices. In the current sharing mode, one device is designated as the master. The slave to master pin (pin 11) of the master device is not connected and the master to slave/inhibit 2 pin (pin 12) of the master is connected to the slave to master pin (pin 11) of the slave device(s). The device(s) designated as slave(s) have the master to slave/inhibit 2 pin (pin 11) connected to the remote sense return pin (pin 9). 2. A second slave device may be placed in parallel with a master and slave device, this requires the Tri pin (pin 3) of the master device to be connected to the remote sense pin (pin 9). When paralleled, 95 percent of the sum of the power of the devices is available at the load. This means that 143 watts at 5 volts is available for three devices in parallel. When using remote sense in parallel operation, only the master device should have its remote sense pins (pins 9 and 10) connected to the load, and the slave devices should have the remote sense pins (pins 9 and 10) connected to the output power pins (pins 7 and 8). 3. The device has a sync input pin (pin 6) and a sync output pin (pin 5) which allows multiple devices, whether they're in a single unit or master/slave configurations to be synchronized to a system clock or each other. Two or more devices may be synchronized to each other by connecting the sync output pin (pin 5) of one to the sync input pin (pin 6) of another. 4. The device has two inhibit options, one is ground referenced to the input common and the other is referenced to the output common. The output referred inhibit pin uses the master to slave/inhibit 2 pin (pin 12). This pin is normally used to parallel devices, and a TTL compatiable open collector low will inhibit the device when applied to this pin. FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 14 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) --- Interim electrical parameters Final electrical parameters 1*, 2, 3, 4, 5, 6 Group A test requirements 1, 2, 3, 4, 5, 6 1 Group C end-point electrical parameters 1, 2, 3, 4, 5, 6 End-point electrical parameters for radiation hardness assurance (RHA) devices * PDA applies to subgroup 1. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1015 of MIL-STD-883. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 7, 8, 9, 10, and 11 shall be omitted. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 15 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5. Radiation hardness assurance (RHA). RHA qualification is required only for those devices with the RHA designator as specified herein. RHA level R Units Total ionizing dose tolerance level 100 kRad (Si) Single event upset survival level (LET) 40 MeV a. Radiation dose rate is in accordance with condition C of method 1019 of MIL-STD-883. Unless otherwise specified, components are tested at a rate of 9 rad(Si)/s, in accordance with method 1019 of MIL-STD-750 or MIL-STD-883, as applicable. b. The manufacturer shall perform a worst-case and radiation susceptibility analysis on the device. This analysis shall show that the minimum performance requirements of each component has adequate design margin under worst-case operating conditions (extremes of line voltage, temperatures, load, frequency, radiation environment, etc.). This analysis guarantees the post-irradiation parameter limits specified in table I. c. RHA testing shall be performed at the component level for initial device qualification, and after design changes that may affect the RHA performance of the device. As an alternative to testing, components may be procured to manufacturer radiation guarantees that meet the minimum performance requirements. Component radiation performance guarantees shall be established in compliance with MIL-PRF-19500, Group D or MIL-PRF-38535, Group E, as applicable. For components with less than adequate performance margin, component lot radiation acceptance screening shall be performed. d. The manufacturer shall establish procedures controlling component radiation testing, and shall establish radiation test plans used to implement component lot qualification during procurement. Test plans and test reports shall be filed and controlled in accordance with the manufacturer's configuration management system. e. The device manufacturer shall designate a RHA program manager to oversee component lot qualification, and to monitor design changes for continued compliance to RHA requirements. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 16 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished in accordance with MIL-PRF-38534. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Post Office Box 3990, Columbus, Ohio 432165000, or telephone (614) 692-1081. 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-93163 A REVISION LEVEL C SHEET 17 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 02-06-21 Approved sources of supply for SMD 5962-93163 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. 1/ 2/ Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-9316301HTA 5962-9316301HTC 5962-9316302HTA 5962-9316302HTC 5962R9316302HTA 5962R9316302HTC 5962R9316302KTA 5962R9316302KTC 50821 50821 50821 50821 50821 50821 50821 50821 MFL2805SW/883 MFL2805SW/883 SMFL2805SW/HO SMFL2805SW/HO SMFL2805SW/HR SMFL2805SW/HR SMFL2805SW/KR SMFL2805SW/KR 5962-9316301HUA 5962-9316301HUC 5962-9316302HUA 5962-9316302HUC 5962R9316302HUA 5962R9316302HUC 5962R9316302KUA 5962R9316302KUC 50821 50821 50821 50821 50821 50821 50821 50821 MFL2805SV/883 MFL2805SV/883 SMFL2805SV/HO SMFL2805SV/HO SMFL2805SV/HR SMFL2805SV/HR SMFL2805SV/KR SMFL2805SV/KR 5962-9316301HXA 5962-9316301HXC 5962-9316302HXA 5962-9316302HXC 5962R9316302HXA 5962R9316302HXC 5962R9316302KXA 5962R9316302KXC 50821 50821 50821 50821 50821 50821 50821 50821 MFL2805S/883 MFL2805S/883 SMFL2805S/HO SMFL2805S/HO SMFL2805S/HR SMFL2805S/HR SMFL2805S/KR SMFL2805S/KR 5962-9316301HYA 5962-9316301HYC 5962-9316302HYA 5962-9316302HYC 5962R9316302HYA 5962R9316302HYC 5962R9316302KYA 5962R9316302KYC 50821 50821 50821 50821 50821 50821 50821 50821 MFL2805SY/883 MFL2805SY/883 SMFL2805SY/HO SMFL2805SY/HO SMFL2805SY/HR SMFL2805SY/HR SMFL2805SY/KR SMFL2805SY/KR 5962-9316301HZA 5962-9316301HZC 5962-9316302HZA 5962-9316302HZC 5962R9316302HZA 5962R9316302HZC 5962R9316302KZA 5962R9316302KZC 50821 50821 50821 50821 50821 50821 50821 50821 MFL2805SZ/883 MFL2805SZ/883 SMFL2805SZ/HO SMFL2805SZ/HO SMFL2805SZ/HR SMFL2805SZ/HR SMFL2805SZ/KR SMFL2805SZ/KR The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 1 of 2 STANDARD MICROCIRCUIT DRAWING BULLETIN - CONTINUED. DATE: 02-06-21 Vendor CAGE number Vendor name and address 50821 Interpoint Corporation 10301 Willows Road Redmond, WA 98073-9705 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. 2 of 2