70 Maxess Road ! Melville, New York 11747 (631) 936-7500 ! Fax (631) 396-7575 RECOMMENDED REFLOW SOLDERING PROFILE (Temperature Sensitive SMT Products) TEMPERATURE (°C) 250 +230°C Max. 200 +175 ~ +195°C Typical Liquidus Temperature of Common Sn-Pb Solders PREHEAT 150 NATURAL COOLING 100 50 0 25 50 75 100 125 150 TIME (SECONDS) TEMPERATURE LIMITS Peak Temperature +230°C +220°C +200°C Max. Duration 5 SECONDS 10 SECONDS 25 SECONDS The above reflow soldering profile and temperature limits applies to NSFC and NSPC series… Stacked Film Chip Capacitors 70 Maxess Road ! Melville, New York 11747 (516) 936-7500 ! Fax (516) 396-7575 RECOMMENDED FLOW-WAVE SOLDERING PROFILE (General SMT Products) Max. Temp +250° +200° TEMP ( °C ) +150° NATURAL COOLING* +100° +50° Time in wave 0 TIME** ** - Duration of wave soldering cycle is not component dependent. All products identified below can withstand direct immersion in solder without pre-heat. Maximum time within the wave is identified for each component style below. The above flow-wave soldering profile applies to the following NIC surface mount product series: Series Type NMC NRC NRSN NIS NTC NIN NCB NRD NSD Ceramic Chip Capacitors Thick Film Chip Resistors and Resistor Arrays 0402/0603 Chip Inductors Tantalum Chip Capacitors Wirewound Chip Inductors Ferrite Chip Beads Silicon and Schottky Barrier Rectifier Diodes NTC Chip Thermistors NTHC NSPC Stacked Film Chip Capacitors Max. Temp. Max. Time in Wave +260°C 10 Seconds +260°C 5 Seconds +250°C 10 Seconds +250°°C 5 Seconds