ROHM BR9010FV

Memory ICs
1, 2, and 4k bit EEPROMs for direct
connection to serial ports
BR9010 / BR9010F / BR9010FV / BR9020 /
BR9020F / BR9040 / BR9040F
Features
••BR9010
/ F / FV (1k bit): 64 words × 16 bits
BR9020 / F (2k bit): 128 words × 16 bits
BR9040 / F (4k bit): 256 words × 16 bits
•Single power supply operation
•Serial data input and output
•Automatic erase-before-write
•Low current consumption
–1.5mA (max.) active current: 3V
–2µA (max.) standby current: 3V
•Noise filter built into SK pin
•Compact DIP8, SOP8, SSOP-B8 packages (SSOPB8 is available only with BR9010).
•100,000 ERASE / WRITE cycles
•10 years Data Retention
•Easily connects to serial port
•Pin assignments
8
VCC R / B∗ 1
7
R / B∗ VCC 2
3
6
WC
CS
3
4
5
GND
SK
4
CS
1
SK
2
DI
DO
BR9010 /
BR9020 / 9040
BR9010F /
BR9010FV /
BR9020F /
BR9040F
8
WC
7
GND
6
DO
5
DI
∗ This pin is N.C. (non connection) on BR9010.
•Pin description
Pin
name
Function
CS
Chip select input
SK
Serial data clock input
DI
Operating code, address, and serial data input
DO
Serial data output
GND
Reference voltage for all I / O, 0V
WC
Write control input
R /B
READY, BUSY status signal output
VCC
Power supply connection
•TheOverview
BR90 series are serial EEPROMs that can be connected directly to a serial port and can be erased and written
electrically. Writing and reading is performed in word units, using four types of operation commands. Communication
occurs through CS, SK, DI, and DO pins, WC pin control is used to initiate a write disabled state, enabling these
EEPROMs to be used as one-time ROMs. During writing, operation is checked via the internal status check.
1
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
•Block diagram
BR9010 / F / FV
CS
Command decode
Power supply
voltage detector
Control
Clock generation
SK
Command
register
DI
Write
disable
Address
buffer
High voltage
generator
Address
decoder
6bit
6bit
WC
1024bit
EEPROM
Data
register
DO
16bit
array
R/W
amplifier
16bit
BR9020 / F, BR9040 / F
R/B
CS
Command decode
Power supply
voltage detector
Control
SK
DI
Clock generation
Command
register
Write
disable
Address
buffer
7 (8)
bit
High voltage
generator
Address
decoder
7 (8)
bit
WC
2,048
(4,096) bit
EEPROM
Data
register
DO
∗ Values in parentheses are for the BR9040 / F.
2
16bit
R/W
amplifier
16bit
array
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
•Absolute maximum ratings (Ta = 25°C)
Parameter
Applied voltage
Power dissipation
Symbol
VCC
Pd
Limits
Unit
– 0.3 ~ + 7.0
DIP8
500∗1
SOP8
350∗2
SSOP-B8
300∗3
V
mW
Storage temperature
Tstg
– 65 ~ + 125
°C
Operation temperature
Topr
– 40 ~ + 85
°C
Input voltage
—
– 0.3 ~ VCC + 0.3
V
∗ Reduced by 5.0mw∗1 / 3.5mw∗2 / 3.0mw∗3 for each increase in Ta of 1°C over 25°C.
•Recommended operating conditions
Parameter
Symbol
Power supply voltage
VCC
Input voltage
VIN
Limits
Unit
2.7 to 5.5 (write)
V
2.0 to 5.5 (read)
V
0 ~ VCC
V
3
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
Electrical characteristics
•BR9010
/ F / FV: At 5V (unless otherwise noted, Ta = – 40 to + 85°C, V
CC
Parameter
Symbol
Min.
Typ.
Input low level voltage 1
VIL1
—
—
Input high level voltage 1
VIH1
0.7 ×
—
Input low level voltage 2
VIL2
—
Max.
0.3 ×
= 5V ± 10%)
Unit
Conditions
V
DI Pin
—
V
DI Pin
0.2 ×
V
CS, SK, WC Pin
—
V
CS, SK, WC Pin
—
0.4
V
IOL = 2.1mA
—
VCC
V
IOH = – 0.4mA
µA
VIN = 0V ~ VCC
VCC
VCC
—
VCC
VIH2
Input high level voltage 2
0.8 ×
—
VCC
Output low level voltage
VOL
Output high level voltage
VOH
0
VCC –
0.4
ILI
–1
—
1
Output leak current
ILO
–1
—
1
µA
VOUT = 0V ~ VCC CS = VCC
Consumption current
during operation
ICC1
—
—
2
mA
f = 1MHz tE / W = 10ms (WRITE)
ICC2
—
—
1
mA
f = 1MHz (READ)
Standby current
ISB
µA
CS, SK, DI, WC, = VCC DO = OPEN
fSK
—
—
3
SK frequency
—
—
1
MHz
Input leak current
—
BR9010 / F / FV: At 3V (unless otherwise noted, Ta = – 40 to + 85°C, VCC = 3V ± 10%)
Parameter
Symbol
Min.
Typ.
VIL1
—
—
Input low level voltage 1
Max.
0.3 ×
Unit
Conditions
V
DI Pin
VCC
Input high level voltage 1
VIH1
Input low level voltage 2
VIL2
Input high level voltage 2
VIH2
Output low level voltage
VOL
Output high level voltage
VOH
0.7 ×
—
—
V
DI Pin
—
—
0.2 ×
V
CS, SK, WC Pin
0.8 ×
—
—
V
CS, SK, WC Pin
—
0.4
V
IOL = 100µA
—
VCC
V
IOH = – 100µA
VCC
VCC
VCC
0
VCC –
0.4
Input leak current
ILI
–1
—
1
µA
VIN = 0 ~ VCC
Output leak current
ILO
–1
—
1
µA
VOUT = 0 ~ VCC CS = VCC
Consumption current
during operation
ICC1
—
—
1.5
mA
f = 1MHz tE / W = 15ms (WRITE)
ICC2
—
—
500
µA
f = 1MHz (READ)
Standby current
ISB
—
—
µA
CS, SK, DI, WC, = VCC DO = OPEN
fSK
—
—
2
SK frequency
1
MHz
䊊 Not designed for radiation resistance
4
—
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
characteristics
•Electrical
BR9020
/
F: At 5V (unless otherwise noted, Ta = – 40 to + 85°C, V
•
CC
Parameter
= 5V ± 10%)
Symbol
Min.
Typ.
Max.
Unit
Input low level voltage 1
VIL1
—
—
0.3 × VCC
V
DI Pin
Conditions
Input high level voltage 1
VIH1
0.7 × VCC
—
—
V
DI Pin
Input low level voltage 2
VIL2
—
—
0.2 × VCC
V
CS, SK, WC Pin
Input high level voltage 2
VIH2
0.8 × VCC
—
—
V
CS, SK, WC Pin
Output low level voltage
VOL
0
—
0.4
V
IOL = 2.1mA
Output high level voltage
VOH
VCC – 0.4
—
VCC
V
IOH = – 0.4mA
Input leak current
ILI
–1
—
1
µA
VIN = 0V ~ VCC
Output leak current
ILO
–1
—
1
µA
VOUT = 0V ~ VCC CS = VCC
Consumption current
during operation
ICC1
—
—
2
mA
fSK = 1MHz tE / W = 10ms (WRITE)
ICC2
—
—
1
mA
fSK = 1MHz (READ)
Standby current
ISB
—
—
3
µA
CS, SK, DI, WC, = VCC DO, R / B = OPEN
SK frequency
fSK
—
—
1
MHz
•BR9020 / F: At 3V (unless otherwise noted, Ta = – 40 to + 85°C, V
CC
Parameter
—
= 3V ± 10%)
Symbol
Min.
Typ.
Max.
Unit
Conditions
Input low level voltage 1
VIL1
—
—
0.3 × VCC
V
DI Pin
Input high level voltage 1
VIH1
0.7 × VCC
—
—
V
DI Pin
Input low level voltage 2
VIL2
—
—
0.2 × VCC
V
CS, SK, WC Pin
Input high level voltage 2
VIH2
0.8 × VCC
—
—
V
CS, SK, WC Pin
Output low level voltage
VOL
0
—
0.4
V
IOL = 100µA
Output high level voltage
VOH
VCC – 0.4
—
VCC
V
IOH = – 100µA
ILI
–1
—
1
µA
VIN = 0V ~ VCC
Output leak current
ILO
–1
—
1
µA
VOUT = 0V ~ VCC CS = VCC
Consumption current
during operation
ICC1
—
—
1.5
mA
fSK = 1MHz tE / W = 15ms (WRITE)
ICC2
—
—
500
µA
fSK = 1MHz (READ)
Standby current
ISB
—
—
2
µA
CS, SK, DI, WC, = VCC DO, R / B = OPEN
SK frequency
fSK
—
—
1
MHz
Input leak current
—
5
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
characteristics
•Electrical
BR9040
/
F: At 5V (unless otherwise noted, Ta = – 40 to + 85°C, V
•
CC
Parameter
= 5V ± 10%)
Symbol
Min.
Typ.
Max.
Unit
Input low level voltage 1
VIL1
—
—
0.3 × VCC
V
DI Pin
Conditions
Input high level voltage 1
VIH1
0.7 × VCC
—
—
V
DI Pin
Input low level voltage 2
VIL2
—
—
0.2 × VCC
V
CS, SK, WC Pin
Input high level voltage 2
VIH2
0.8 × VCC
—
—
V
CS, SK, WC Pin
Output low level voltage
VOL
0
—
0.4
V
IOL = 2.1mA
Output high level voltage
VOH
VCC – 0.4
—
VCC
V
IOH = – 0.4mA
Input leak current
ILI
–1
—
1
µA
VIN = 0V ~ VCC
Output leak current
ILO
–1
—
1
µA
VOUT = 0V ~ VCC CS = VCC
Consumption current
during operation
ICC1
—
—
2
mA
fSK = 1MHz tE / W = 10ms (WRITE)
ICC2
—
—
1
mA
fSK = 1MHz (READ)
Standby current
ISB
—
—
3
µA
CS, SK, DI, WC, = VCC DO, R / B = OPEN
SK frequency
fSK
—
—
1
MHz
•BR9040 / F: At 3V (unless otherwise noted, Ta = – 40 to + 85°C, V
CC
Parameter
Symbol
—
= 3V ± 10%)
Min.
Typ.
Max.
Unit
Conditions
Input low level voltage 1
VIL1
—
—
0.3 × VCC
V
DI Pin
Input high level voltage 1
VIH1
0.7 × VCC
—
—
V
DI Pin
Input low level voltage 2
VIL2
—
—
0.2 × VCC
V
CS, SK, WC Pin
Input high level voltage 2
VIH2
0.8 × VCC
—
—
V
CS, SK, WC Pin
Output low level voltage
VOL
0
—
0.4
V
IOL = 100µA
Output high level voltage
VOH
VCC – 0.4
—
VCC
V
IOH = – 100µA
Input leak current
ILI
–1
—
1
µA
VIN = 0V ~ VCC
Output leak current
ILO
–1
—
1
µA
VOUT = 0V ~ VCC CS = VCC
Consumption current
during operation
ICC1
—
—
1.5
mA
fSK = 1MHz tE / W = 15ms (WRITE)
ICC2
—
—
500
µA
fSK = 1MHz (READ)
Standby current
ISB
—
—
2
µA
CS, SK, DI, WC, = VCC DO, R / B = OPEN
SK frequency
fSK
—
—
1
MHz
VCC = 3.0 ~ 3.3V
—
—
750
kHz
VCC = 2.7 ~ 3.0V
6
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
Operation timing characteristics
•BR9010
/ F / FV: At 5V (unless otherwise noted, Ta = – 40 to + 85°C, V
CC
Parameter
= 5V ± 10%)
Symbol
Min.
Typ.
Max.
Unit
CS setup time
tCSS
200
—
—
ns
CS hold time
tCSH
0
—
—
ns
Data setup time
tDIS
150
—
—
ns
Data hold time
tDIH
150
—
—
ns
DO rise delay time
tPD1
—
—
350
ns
DO fall delay time
tPD0
—
—
350
ns
Self-timing programming cycle
tE / W
—
—
10
ms
tCS
1
—
—
µs
CS minimum high level time
Time when DO goes High-Z (via CS)
tOH
0
—
400
ns
Data clock high level time
tWH
450
—
—
ns
Data clock low level time
tWL
450
—
—
ns
Write control setup time
tWCS
0
—
—
ns
Write control hold time
tWCH
0
—
—
ns
•BR9010 / F / FV: At 3V (unless otherwise noted, Ta = – 40 to + 85°C, V
CC
Parameter
= 3V ± 10%)
Symbol
Min.
Typ.
Max.
Unit
CS setup time
tCSS
200
—
—
ns
CS hold time
tCSH
0
—
—
ns
Data setup time
tDIS
150
—
—
ns
Data hold time
tDIH
150
—
—
ns
DO rise delay time
tPD1
—
—
350
ns
DO fall delay time
tPD0
—
—
350
ns
Self-timing programming cycle
tE / W
—
—
15
ms
tCS
1
—
—
µs
CS minimum high level time
Time when DO goes High-Z (via CS)
tOH
0
—
400
ns
Data clock high level time
tWH
450
—
—
ns
Data clock low level time
tWL
450
—
—
ns
Write control setup time
tWCS
0
—
—
ns
Write control hold time
tWCH
0
—
—
ns
7
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
Operation timing characteristics
•BR9020
/ F / FV: At 5V (unless otherwise noted, Ta = – 40 to + 85°C, V
CC
Parameter
= 5V ± 10%)
Symbol
Min.
Typ.
Max.
Unit
CS setup time
tCSS
200
—
—
ns
CS hold time
tCSH
0
—
—
ns
Data setup time
tDIS
150
—
—
ns
Data hold time
tDIH
150
—
—
ns
DO rise delay time
tPD1
—
—
350
ns
DO fall delay time
tPD0
—
—
350
ns
Self-timing programming cycle
tE / W
—
—
10
ms
tCS
1
—
—
µs
READY / BUSY display valid time
tSV
—
—
1
µs
Time when DO goes High-Z (via CS)
tOH
0
—
400
ns
Data clock high level time
tWH
450
—
—
ns
Data clock low level time
tWL
450
—
—
ns
Write control setup time
tWCS
0
—
—
ns
Write control hold time
tWCH
0
—
—
ns
CS minimum high level time
•BR9020 / F / FV: At 3V (unless otherwise noted, Ta = – 40 to + 85°C, V
CC
Parameter
= 3V ± 10%)
Symbol
Min.
Typ.
Max.
Unit
CS setup time
tCSS
200
—
—
ns
CS hold time
tCSH
0
—
—
ns
Data setup time
tDIS
150
—
—
ns
Data hold time
tDIH
150
—
—
ns
DO rise delay time
tPD1
—
—
350
ns
DO fall delay time
tPD0
—
—
350
ns
Self-timing programming cycle
tE / W
—
—
15
ms
CS minimum high level time
tCS
1
—
—
µs
READY / BUSY display valid time
tSV
—
—
1
µs
Time when DO goes High-Z (via CS)
tOH
0
—
400
ns
Data clock high level time
tWH
450
—
—
ns
Data clock low level time
tWL
450
—
—
ns
Write control setup time
tWCS
0
—
—
ns
Write control hold time
tWCH
0
—
—
ns
8
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
Operation timing characteristics
•BR9040
/ F: At 5V (unless otherwise noted, Ta = – 40 to + 85°C, V
CC
Parameter
= 5V ± 10%)
Symbol
Min.
Typ.
Max.
Unit
CS setup time
tCSS
200
—
—
ns
CS hold time
tCSH
0
—
—
ns
Data setup time
tDIS
150
—
—
ns
Data hold time
tDIH
150
—
—
ns
DO rise delay time
tPD1
—
—
350
ns
DO fall delay time
tPD0
—
—
350
ns
Self-timing programming cycle
tE / W
—
—
10
ms
tCS
1
—
—
µs
READY / BUSY display valid time
tSV
—
—
1
µs
Time when DO goes High-Z (via CS)
tOH
0
—
400
ns
Data clock high level time
tWH
500
—
—
ns
Data clock low level time
tWL
500
—
—
ns
Write control setup time
tWCS
0
—
—
ns
Write control hold time
tWCH
0
—
—
ns
CS minimum high level time
•BR9040 / F: At 3V (unless otherwise noted, Ta = – 40 to + 85°C, V
CC
Parameter
= 3V ± 10%)
Symbol
Min.
Typ.
Max.
Unit
CS setup time
tCSS
200
—
—
ns
CS hold time
tCSH
0
—
—
ns
Data setup time
tDIS
150
—
—
ns
Data hold time
tDIH
150
—
—
ns
DO rise delay time VCC = 3.0 ~ 3.3V
tPD1
—
—
350
ns
DO fall delay time VCC = 3.0 ~ 3.3V
tPD0
—
—
350
ns
DO rise delay time VCC = 2.7 ~ 3.0V
tPD1
—
—
500
ns
DO fall delay time VCC = 2.7 ~ 3.0V
tPD0
—
—
500
ns
Self-timing programming cycle
tE / W
—
—
15
ms
CS minimum high level time
tCS
1
—
—
µs
READY / BUSY display valid time
tSV
—
—
1
µs
Time when DO goes High-Z (via CS)
tOH
0
—
400
ns
Data clock high level time VCC = 3.0 ~ 3.3V
tWH
500
—
—
ns
Data clock low level time VCC = 3.0 ~ 3.3V
tWL
500
—
—
ns
Data clock high level time VCC = 2.7 ~ 3.0V
tWH
650
—
—
ns
Data clock low level time VCC = 2.7 ~ 3.0V
tWL
650
—
—
ns
Write control setup time
tWCS
0
—
—
ns
Write control hold time
tWCH
0
—
—
ns
9
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
•Input / output circuits
(1) Input circuits
RESET int.
CS int.
CS
SK
CS int.
WC
DI
(2) Output circuits
DO
DO
/ F / FV
∗ DO: BR9010
BR9020 / F
∗ DO: BR9040 / F
OE int.
OE int.
R/B
R / B: BR9020 / F, BR9040 / F
operation
•(1)Circuit
Command mode
Command
Start bit
Operating code
Address
Data
Read
(READ)
1010
1000
A0 A1 A2 A3 A4 A5 (A6) 夽2 (A7) 夽1
Write
(WRITE)
1010
0100
A0 A1 A2 A3 A4 A5 (A6) 夽2 (A7) 夽1
Erase / Write enabled
(EWEN)
1010
0011
Erase / Write disable
(EWDS)
1010
0000
∗ ∗ ∗ ∗ ∗ ∗ ∗
∗ ∗ ∗ ∗ ∗ ∗ ∗
∗ Either VIH or VIL
With BR9020 / F,
With BR9010 / F / FV,
10
夽1 is ‘0’
夽1 and 2 are ‘0’
∗
∗
D0 D1—D14 D15
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
(2) Timing chart
tCS
CS
tWH
tCSS
tCSH
SK
tWL
tDIH
tDIS
DI
tPD
tPD
tOH
DO
WC
• Data is read in on the rising edge of SK. Data is output in synchronism with the SK falling edge.
• During a READ operation, data is output from DO in synchronization with the SK rise.
• WC is related to the write command only. Read, erase / write enable, erase / write disable commands can be executed irrespective of the state of WC.
(3) Writing enabled / disabled
H
1
SK L
4
8
12
16
ENABLE = 1 1
DISABLE = 0 0
H
CS L
H
DI
1
0
1
0
0
0
L
High-Z
DO
H
R/B
WC
H or L
Fig.1
1) When the power supply is turned on, the latch used to acknowledge writing is reset in the same way as when the
write disable command is executed. Before entering the write mode, the write enabled mode must first be entered.
Once the write enabled mode has been recognized, it remains valid until the write disabled mode is entered, or
the power supply is turned off.
2) The clock is no longer necessary after the first 16 clock pulses have been received. Any subsequent input will be
ignored.
3) WC does not exist for either the write enabled or write disabled command, so WC may be either HIGH or LOW
when the command is being input.
4) Commands are received in these modes by means of 8-bit operating codes. Please be aware that, after an operating code has been entered, commands will not be canceled even if CS is set to HIGH. (To cancel a command,
either turn off the power supply, or input the command once again.)
11
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
operation
•(4)Circuit
Read cycle
H
SK
1
L
4
8
16
32
tCS
H
CS
L
STANDBY
H
DI
1
0
1
0
1
0
0
0
A0
A5
0
0
L
High-Z
DO
D0
High-Z
D15
tOH
WC
H or L
Fig.2 BR9010 / F / FV
H
SK
1
L
4
8
16
32
tCS
H
CS
L
STANDBY
H
DI
1
0
1
0
1
0
0
0
A0
A6
0
L
High-Z
DO
D0
High-Z
D15
tOH
H
R/B
WC
H or L
Fig.3 BR9020 / F
H
SK
1
L
4
8
16
32
tCS
H
CS
L
STANDBY
H
DI
1
0
1
0
1
0
0
0
A0
A6
A7
L
High-Z
DO
D0
High-Z
D15
tOH
H
R/B
WC
H or L
Fig.4 BR9040 / F
1) After the fall of the 16th clock pulse, 16-bit data is output from the DO pin in synchronization with the falling edge of the SK signal.
(DO output changes at a time lag of tPD0, tPD1 because of internal circuit delay following the falling edge of the SK signal. During the
tPD0 and tPD1 timing, the tPD time should be assured before data is read, to avoid the previous data being lost. See the synchronized
data input / output timing chart in Fig. 1.)
12
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
operation
•(5)Circuit
Writing cycle
H
4
1
SK
16
8
32
L
H
CS
L
tCS
H
DI
L
1
0
1
0
0
1
0
0 A0
A5 0
0 D0
D15
High-Z
DO
High-Z
tE / W
H
WC
L
tWCH
tWCS
Fig.5 BR9010 / F / FV
H
SK
4
1
L
8
16
32
H
CS
L
tCS
H
1
DI
0
1
0
1
0
0
A0
0
A6
0
D15
D0
High-Z
High-Z
DO
tSV
tE / W
H
R/B
H
WC
tWCS
L
tWCH
Fig.6 BR9020 / F
H
SK
1
L
4
8
16
32
H
CS
L
tCS
H
1
DI
0
1
0
0
1
0
0
A0
A6 A7 D0
D15
High-Z
High-Z
DO
tSV
tE / W
H
R/B
H
WC
L
tWCS
tWCH
Fig.7 BR9040 / F
13
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
1) During input in the write mode, CS must be LOW, but once writing starts, CS may be either HIGH or LOW.
However, if CS and WC share the same connection, both CS and WC should be set to LOW during writing operations.
(If the WC pin is set to HIGH during a writing operation, writing will be forcibly interrupted at that point. If this happens, the data for that address may be lost, in which case it should be rewritten to that address.)
2) Following input of a write command, CS goes HIGH. If CS is then set to LOW, data will be received from SK and
DI, because the command reception status has been entered.
If CS remains LOW following command input, however, without first going HIGH, command input will be canceled until CS is set to HIGH.
3) Starting from the rising edge of the 32nd clock, the R / B pin goes LOW after RSV has elapsed.
4) The R / B pin is LOW during writing operations. (Following the rising edge of SK after the last data D15 has been
read, the internal timer circuit is activated, and writing of data in the memory cell is automatically completed during tE / W.) At this point, SK input may be either HIGH or LOW during tE / W.
5) Following input of a write command, if CS falls while SK is LOW, the R / B status can be displayed from the DO
pin. (See the section on READY / BUSY states.)
(6) READY / BUSY display (R / B pin and DO pin)
1) This display outputs the internal status signal; the R / B pin outputs the HIGH or LOW status at all times. The display can also be output from the DO pin. Following completion of the writing command, if CS falls while SK is
LOW, either HIGH or LOW is output. (The display can also be output without using the R / B pin, leaving it open.)
2) When writing data to a memory cell, the READY / BUSY display is output from the rise of the 32nd clock pulse of
the SK signal after tSV, from the R / B pin.
R / B display = LOW: writing in progress
(The internal timer circuit is activated, and after the tE / W timing has been created, the timer circuit stops automatically. Writing of data to the memory cell is done during the tE / W timing, during which time other commands cannot be received.)
R / B display = HIGH: command standby state
(Writing of data to the memory cell has been completed and the next command can be received.)
SK
Clock
CS
Write command
DI
HIGH-Z
R/B
tPD
tOZ
READY
DO
BUSY
READY
BUSY
Fig.8 R / B status output timing
14
READY
HIGH-Z
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
notes
•(1)Operation
Turning the power supply on and off
1) When the power supply is turned on and off, CS should be set to HIGH ( = VCC).
2) When CS is LOW, the command input reception state (active) is entered. If the power supply is turned on in this
state, erroneous operations and erroneous writing can occur because of noise and other factors. To avoid this,
make sure CS is set to HIGH ( = VCC) before turning on the power supply.
(Good example) Here, the CS pin is pulled up to VCC.
When turning off the power supply, wait at least 10msec before turning it on again. Failing to
observe this condition can result in the internal circuit failing to be reset when the power supply is turned on.
(Bad example) CS is LOW when the power supply is turned on or off
In this case, because CS remains LOW, the EEPROM may perform erroneous operations or
write erroneous data because of noise or other factors.
∗ Please be aware that the case shown in this example can also occur if CS input is HIGH-Z.
VCC
VCC
GND
VCC
CS
GND
Good example
Bad example
(2) Noise countermeasures
1) SKnoise
If noise occurs at the rise of the SK clock input, the clock is assumed to be excessive, and this can cause malfunction because the bits are out of alignment.
2) WC noise
During a writing operation, noise at the WC pin can be erroneously judged to be data, and this can cause writing
to be forcibly interrupted.
3) VCC noise
Noise and surges on the power supply line can cause malfunction. We recommend installing a bypass capacitor
between the power supply and ground to eliminate this problem.
15
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
(3) Canceling modes
1) Read commands
SK
32 Clock
CS
Start bit
DI
Operating code
4 bits
Address
4 bits
8 bits
16 bits
DO
DO
Data
D15
Cancel can be performed for the entire read mode space
WC
H or L
Cancellation method: CS HIGH
2) Write commands
SK
32 clock
CS
DI
Start bit Operating code Address DO
4 bits
4 bits
8 bits
Data
D15
16 bits
tE / W
R/B
a
b
c
d
WC
Canceling methods
a: Canceled by setting CS HIGH. The WC pin is not involved.
b: If the WC pin goes HIGH for even a second, writing is forcibly interrupted. Cancellation occurs even if the CS pin
is HIGH. At this point, data has not been written to the memory, so the data in the designated address has not
yet been changed.
c: The operation is forcibly canceled by setting the WC pin to HIGH or turning off the power supply (although we do
not recommend using this method). The data in the designated address is not guaranteed and should be written
once again.
d: If CS is set to HIGH while the R / B signal is HIGH (following the tE / W timing), the IC is reset internally, and waits
for the next command to be input.
16
BR9010 / BR9010F / BR9010FV / BR9020 / BR9020F /
BR9040 / BR9040F
Memory ICs
•External dimensions (Units: mm)
9.3 ± 0.3
1
4
3.0 ± 0.2
0.5 ± 0.1
2.54
0°~15°
5
1
4
4.4 ± 0.2
6.4 ± 0.3
0.3 ± 0.1
0.1
1.15 ± 0.1
3.2 ± 0.2 3.4 ± 0.3
0.51Min.
7.62
8
(0.52)
0.15 ± 0.1
5
6.5 ± 0.3
8
0.65 0.22 ± 0.1
0.3Min.
0.1
DIP8
SSOP-B8
1
4
0.11
1.27
0.15 ± 0.1
4.4 ± 0.2
5
1.5 ± 0.1
6.2 ± 0.3
5.0 ± 0.2
8
0.4 ± 0.1
0.3Min.
0.15
SOP8
17