Materials Analysis

Environmental Management and Materials Information
Product Content Information for: MAX3624AETJ+T
Links
Qualifications
Package Description
Chemical Composition Summary
Detailed Package Component Data
Qualifications Top
Lead−Free Qualified
Yes
REACH
Yes: 2011−06−20
RoHS Qualified
Yes
Starting Date Code: 1052+
Green
Moisture Sensitivity Level
L1
Flammability Meets UL−94 (V−0 Rating)
Yes
Assembler Qualified
UTL
Package Description Top
Package Code
T3255+3
Package Type
TQFN *
Package Description
Thin Quad Flatpack, No Leads
Package Option
Sawn/Epad
Footprint Area (mm2)
26
Body Size
5x5x0.8mm
Pin Count
32
Unit Weight in Grams
0.0640997
Chemical Composition Summary Top
Maxim NIA/NIU Substance List (PDF, 24k)
Substance
CAS
Number
Aluminum (Al)
7429−90−5
0
0
Antimony (Sb2O3)
1309−64−4
0
0
0
0
0
0
BCB Resin
Bromine (Br)
7726−95−6
Amount
(grams)
% of
Unit Weight
1
Carbon (C)
7440−44−0
0
0
Carbon Black
1333−86−4
0
0
Ceramic (BaTiO3)
12047−27−7
0
0
Chromium (Cr)
7440−47−3
0
0
Cobalt (Co)
7440−48−4
0
0
Copper (Cu)
7440−50−8
0.02546
39.71937
Gold (Au)
7440−57−5
0.001
1.56007
Indium (In)
7440−74−6
0
0
0
0
0.000582
0.90796
Insulator (Polyimide)
Iron (Fe)
7439−89−6
FeO2
12411−15−36
0
0
Lead (Pb)
7439−92−1
0
0
Magnesium (Mg)
7439−95−4
0
0
Manganese (Mn)
7439−96−5
0
0
0
0
0
0
NiPdAu
0
0
Nickel−V (NiV)
0
0
MnO3
Nickel (Ni)
7440−02−0
Palladium (Pd)
7440−05−3
0
0
Phosphorus (P)
7723−14−0
0
0
Silica (SiO2)
11126−22−0
0.02785
43.44794
Silicon (Si)
7440−21−3
0.0023
3.58816
Silver (Ag)
7440−22−4
0.00081
1.26366
Solder Mask
0
0
Solder Paste
0
0
Spheron Polymer Passivation
0
0
Sulfur (S)
7704−34−9
0
0
Tin (Sn)
7440−31−5
0.003
4.68021
Titanium (Ti)
7440−32−6
0
0
0
0
Titanium−W (TiW)
Tungsten (W)
7440−33−7
0
0
Vanadium (V)
7440−62−2
0
0
Zinc (Zn)
7440−66−6
3.9e−05
0.06084
ZnO
1314−13−2
0
0
Zirconium (Zr)
7440−67−7
0
0
Detailed Package Component Data Top
2
Bond Wire Components
Summary
Component Weight
0.001
Substance
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Gold (Au)
0.00100
100.00000
1.56007
0
0
0
Aluminum (Al)
Die Attach Epoxy Components
Summary
Die Attach Material
Ablebond 8200T
Component Weight
0.00065
% of
Component Weight
% of
Unit Weight
0
0
0
0
0
0
20.00000
0.20281
Functionalized Ester
0
0
Functionalized Urethane
0
0
0
0
0
0
0
0
Polymeric
0
0
Polyoxypropylenediamine
0
0
0
0
0
0.00052
80.00000
0.81124
0
0
0
0
0
Substance
Amount
(grams)
Aromatic Amine
Copper (Cu)
0
Diester
Epoxy
Indium (In)
0.00013
0
Lactone
Lead (Pb)
Resin
Silver Filler (Ag)
Tin (Sn)
0
Other
Lead Finish/Plating Components
Summary
Lead Finish Plating
100% Tin
Assembly Lead Finish Process
Component Weight
Substance
Lead (Pb)
0.003
Amount
(grams)
% of
Component Weight
% of
Unit Weight
0
0
0
3
Tin (Sn)
0.00300
100.00000
4.68021
NiPdAu
0
0
0
Gold (Au)
0
0
0
Nickel (Ni)
0
0
0
Lead Frame Components
Summary
Lead Frame Material
Copper C194
Component Weight
0.026371
% of
Component Weight
% of
Unit Weight
Aluminum (Al)
0
0
Carbon (C)
0
0
0
0
0
0
96.54545
39.71937
0
0
2.20697
0.90796
0
0
0
0
0
0
0
0
Palladium (Pd)
0
0
Phosphorus (P)
0
0
Silicon (Si)
0
0
1.09969
0.45242
Sulfur (S)
0
0
Tin (Sn)
0
0
0.000039
0.14789
0.06084
0
0
0
Substance
Chromium (Cr)
Amount
(grams)
ND
Cobalt (Co)
Copper (Cu)
0.02546
Gold (Au)
Iron (Fe)
0.000582
Lead (Pb)
Magnesium (Mg)
ND
Manganese (Mn)
Nickel (Ni)
Silver (Ag)
Zinc (Zn)
Zirconium (Zr)
ND
0.00029
Mold Compound Components
Summary
Mold Material
Sumitomo G770HCD
Resin Type
Multi−Functional
Component Weight
Substance
0.03077
Amount
(grams)
% of
Component Weight
% of
Unit Weight
4
Antimony (Sb2O3)
ND
0
0
Bromine (Br)
ND
0
0
Carbon Black
0
0
Epoxy
0
0
Epoxy Cresol Novolac
0
0
Metal Hydroxide
0
0
Phenol Novolac
0
0
Silica (SiO2)
0.02785
90.51024
43.44794
Resin
0.00292
9.48976
4.55540
0
0
Substance
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Silicon Chip
0.00230
100
3.58816
Other
Silicon Chip Components
Substrate Components
Summary
Substrate Weight
Substrate Material
0
Substrate Core Material
0
Bromine−Free
0
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Copper
0
0
0
Gold
0
0
0
Nickel
0
0
0
Substrate Core Material
0
0
0
Solder Mask
0
0
0
Triazol
0
0
Other
0
0
Substance
5
Notes:
1. Lead Form: GW − Gull Wing, TH − Through Hole.
2. Refer to product data sheet to confirm actual wire diameter.
3. 'ND' means None Detected, negligible amount present.
* This package may be remarked. If remarked, the package will contain additional homogeneous
materialsinksthat are not listed in contents of this report.
+ Existing inventory of non Halogen−free product will be sold first. Halogen−free product is identified by
date code only. If you need to confirm delivery of Halogen−free product, please contact Customer
Service.
This part is qualified as lead−free.
Parts qualified as lead−free can be manufactured and supplied as lead−free, if and only if, the customer
makes such requests to the Maxim Business Units for approval. The navigation bar on the EMMI website
contains information regarding the lead−free process (e.g. MSL's, Peak reflow Temperatures, JEDEC
methods, frequently asked questions and answers, lead−free package tables, and status/qualification plans for
particular package types qualified as lead−free or in the qualification process).
This report was generated on 2012−01−23. For additional information, please visit the
Maxim/Dallas Environmental Management and Materials Information website located at:
http://www.maxim−ic.com/emmi
6