Materials Analysis

Environmental Management and Materials Information
Product Content Information for: MAX3678UTN+
Links
Qualifications
Package Description
Chemical Composition Summary
Detailed Package Component Data
Qualifications Top
Lead−Free Qualified
Yes
REACH
Yes: 2011−06−20
RoHS Qualified
Yes
Starting Date Code: 1117+
Green
Moisture Sensitivity Level
L3
Flammability Meets UL−94 (V−0 Rating)
Yes
Assembler Qualified
UTL
Package Description Top
Package Code
T5688+3
Package Type
TQFN *
Package Description
Thin Quad Flatpack, No Leads
Package Option
Sawn/Epad
Footprint Area (mm2)
65.6
Body Size
8x8x0.8mm
Pin Count
56
Unit Weight in Grams
0.179249
Chemical Composition Summary Top
Maxim NIA/NIU Substance List (PDF, 24k)
Substance
CAS
Number
Aluminum (Al)
7429−90−5
0
0
Antimony (Sb2O3)
1309−64−4
0
0
0
0
0
0
BCB Resin
Bromine (Br)
7726−95−6
Amount
(grams)
% of
Unit Weight
1
Carbon (C)
7440−44−0
0
0
Carbon Black
1333−86−4
0
0
Ceramic (BaTiO3)
12047−27−7
0
0
Chromium (Cr)
7440−47−3
0
0
Cobalt (Co)
7440−48−4
0
0
Copper (Cu)
7440−50−8
0.0251
14.00287
Gold (Au)
7440−57−5
0.00128
0.71409
Indium (In)
7440−74−6
0
0
0
0
0.000573
0.31967
Insulator (Polyimide)
Iron (Fe)
7439−89−6
FeO2
12411−15−36
0
0
Lead (Pb)
7439−92−1
0
0
Magnesium (Mg)
7439−95−4
0
0
Manganese (Mn)
7439−96−5
0
0
0
0
0
0
NiPdAu
0
0
Nickel−V (NiV)
0
0
MnO3
Nickel (Ni)
7440−02−0
Palladium (Pd)
7440−05−3
0
0
Phosphorus (P)
7723−14−0
0
0
Silica (SiO2)
11126−22−0
0.119
66.38810
Silicon (Si)
7440−21−3
0.0102
5.69041
Silver (Ag)
7440−22−4
0.00303
1.69039
Solder Mask
0
0
Solder Paste
0
0
Spheron Polymer Passivation
0
0
Sulfur (S)
7704−34−9
0
0
Tin (Sn)
7440−31−5
0.00683
3.81034
Titanium (Ti)
7440−32−6
0
0
0
0
Titanium−W (TiW)
Tungsten (W)
7440−33−7
0
0
Vanadium (V)
7440−62−2
0
0
Zinc (Zn)
7440−66−6
3.6e−05
0.02008
ZnO
1314−13−2
0
0
Zirconium (Zr)
7440−67−7
0
0
Detailed Package Component Data Top
2
Bond Wire Components
Summary
Component Weight
0.00128
Substance
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Gold (Au)
0.00128
100.00000
0.71409
0
0
0
Aluminum (Al)
Die Attach Epoxy Components
Summary
Die Attach Material
Ablebond 8200T
Component Weight
0.0035
% of
Component Weight
% of
Unit Weight
0
0
0
0
0
0
20.00000
0.39052
Functionalized Ester
0
0
Functionalized Urethane
0
0
0
0
0
0
0
0
Polymeric
0
0
Polyoxypropylenediamine
0
0
0
0
0
0.00280
80.00000
1.56207
0
0
0
0
0
Substance
Amount
(grams)
Aromatic Amine
Copper (Cu)
0
Diester
Epoxy
Indium (In)
0.00070
0
Lactone
Lead (Pb)
Resin
Silver Filler (Ag)
Tin (Sn)
0
Other
Lead Finish/Plating Components
Summary
Lead Finish Plating
100% Tin
Assembly Lead Finish Process
Component Weight
Substance
Lead (Pb)
0.00683
Amount
(grams)
% of
Component Weight
% of
Unit Weight
0
0
0
3
Tin (Sn)
0.00683
100.00000
3.81034
NiPdAu
0
0
0
Gold (Au)
0
0
0
Nickel (Ni)
0
0
0
Lead Frame Components
Summary
Lead Frame Material
Copper C194
Component Weight
0.025939
% of
Component Weight
% of
Unit Weight
Aluminum (Al)
0
0
Carbon (C)
0
0
0
0
0
0
96.76549
14.00287
0
0
2.20903
0.31967
0
0
0
0
0
0
0
0
Palladium (Pd)
0
0
Phosphorus (P)
0
0
Silicon (Si)
0
0
0.88670
0.12831
Sulfur (S)
0
0
Tin (Sn)
0
0
0.000036
0.13879
0.02008
0
0
0
Substance
Chromium (Cr)
Amount
(grams)
ND
Cobalt (Co)
Copper (Cu)
0.02510
Gold (Au)
Iron (Fe)
0.000573
Lead (Pb)
Magnesium (Mg)
ND
Manganese (Mn)
Nickel (Ni)
Silver (Ag)
Zinc (Zn)
Zirconium (Zr)
ND
0.00023
Mold Compound Components
Summary
Mold Material
Sumitomo G770HCD
Resin Type
Multi−Functional
Component Weight
Substance
0.1315
Amount
(grams)
% of
Component Weight
% of
Unit Weight
4
Antimony (Sb2O3)
ND
0
0
Bromine (Br)
ND
0
0
Carbon Black
0
0
Epoxy
0
0
Epoxy Cresol Novolac
0
0
Metal Hydroxide
0
0
Phenol Novolac
0
0
Silica (SiO2)
0.11900
90.49430
66.38810
Resin
0.01250
9.50570
6.97354
0
0
Substance
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Silicon Chip
0.01020
100
5.69041
Other
Silicon Chip Components
Substrate Components
Summary
Substrate Weight
Substrate Material
0
Substrate Core Material
0
Bromine−Free
0
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Copper
0
0
0
Gold
0
0
0
Nickel
0
0
0
Substrate Core Material
0
0
0
Solder Mask
0
0
0
Triazol
0
0
Other
0
0
Substance
5
Notes:
1. Lead Form: GW − Gull Wing, TH − Through Hole.
2. Refer to product data sheet to confirm actual wire diameter.
3. 'ND' means None Detected, negligible amount present.
* This package may be remarked. If remarked, the package will contain additional homogeneous
materialsinksthat are not listed in contents of this report.
+ Existing inventory of non Halogen−free product will be sold first. Halogen−free product is identified by
date code only. If you need to confirm delivery of Halogen−free product, please contact Customer
Service.
This part is qualified as lead−free.
Parts qualified as lead−free can be manufactured and supplied as lead−free, if and only if, the customer
makes such requests to the Maxim Business Units for approval. The navigation bar on the EMMI website
contains information regarding the lead−free process (e.g. MSL's, Peak reflow Temperatures, JEDEC
methods, frequently asked questions and answers, lead−free package tables, and status/qualification plans for
particular package types qualified as lead−free or in the qualification process).
This report was generated on 2012−01−23. For additional information, please visit the
Maxim/Dallas Environmental Management and Materials Information website located at:
http://www.maxim−ic.com/emmi
6