20L - SSOP Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 SP B1: 172.8700 mg B2: 160.0368 mg B3: 169.2389 mg B4: 172.2182 mg B1: 159.0300 mg B2: 158.3682 mg Body Size (mil/mm) Package Weight – Site 2 209 mil B1:166.0000 mg B2:161.0140 mg SUMMARY The 20L-SSOP Pb-Free package is qualified at two assembly sites. Packages from different assembly sites may have different material composition. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Orient Semiconductor Electronics Taiwan (OSET) Package Qualification Report #s 030604, 043102, 042702, 053005, 120410 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Pure Sn Lead Finish Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP20OSET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04102 Rev. *P Page 1 of 13 20L - SSOP Pb-Free Package NiPdAu Lead Finish Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP20OSET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS B1. MATERIAL COMPOSITION Pure Tin Lead Finish (Note 3) Material Substance Composition Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Copper Nickel Magnesium Silicon Sn Epoxy resin Metal Silver Si Au Epoxy resin1 Epoxy resin2 Phenol resin Aromatic phosphate Silica Carbon black Others 7440-50-8 7440-02-0 7439-95-4 7440-21-3 7440-31-5 Proprietary Proprietary 7440-22-4 7440-21-3 7440-57-5 Proprietary Proprietary Proprietary Proprietary 36.1500 1.1300 0.0800 0.3000 3.3200 0.0600 0.0200 0.3400 12.9700 0.6800 2.9500 2.3600 2.9500 1.7700 % weight of substance per Homogeno us material 95.9904% 3.0005% 0.2124% 0.7966% 100.0000% 14.2857% 4.7619% 80.9524% 100.0000% 100.0000% 2.5038% 2.0031% 2.5038% 1.5023% 60676-86-0 1333-86-4 Proprietary 106.3700 0.2400 1.1800 90.2818% 0.2037% 1.0015% CAS Number Package Weight (mg): Weight by mg 172.8700 PPM % weight of substance per package 209,117 6,537 463 1,735 19,205 347 116 1,967 75,027 3,934 17,065 13,652 17,065 10,239 20.9117% 0.6537% 0.0463% 0.1735% 1.9205% 0.0347% 0.0116% 0.1967% 7.5027% 0.3934% 1.7065% 1.3652% 1.7065% 1.0239% 615,318 1,388 6,826 61.5318% 0.1388% 0.6826% % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04102 Rev. *P Page 2 of 13 100.0000 20L - SSOP Pb-Free Package B2. MATERIAL COMPOSITION NiPdAu Lead Finish (Note 3) Material Substance Composition Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Cu Fe P Zn Pb Polyimide NBR Bismaleimide Phenol resin Ni Pd Au Acrylic resin Polybutadiene derivative Butadiene copolymer Epoxy resin Acrylate Peroxide Additive Silver Silicon Gold Silica Fused Epoxy Resin(1) Epoxy Resin(2) Phenol Resin Carbon black 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7439-92-1 Trade Secret 9003-18-3 79922-55-7 28453-20-5 7440-02-0 7440-05-3 7440-57-5 Trade Secret Trade Secret 36.2400 0.8700 0.0600 0.0400 0.0100 0.0400 0.0100 0.0100 0.0100 0.3800 0.0400 0.0038 0.0200 0.0200 % weight of substance per Homogenou s material 97.2700% 2.3300% 0.1500% 0.1000% 0.0200% 0.0900% 0.0200% 0.0200% 0.0100% 89.6649% 9.4384% 0.8966% 6.1920% 6.1920% Trade Secret 0.0100 3.0960% 62 0.0062% Trade Secret Trade Secret Trade Secret Trade Secret 7440-22-4 7440-21-3 7440-57-5 60676-86-0 158117-90-9 85954-11-6 26834-02-6 1333-86-4 0.0100 0.0100 0.0030 0.0100 0.2400 7.3800 0.3700 103.8500 4.0000 2.2900 4.0000 0.1100 3.0960% 3.0960% 0.9288% 3.0960% 74.3034% 100.0000% 100.0000% 90.8972% 3.5011% 2.0044% 3.5011% 0.0963% 62 62 19 62 1,500 46,114 2,312 648,913 24,994 14,309 24,994 687 0.0062% 0.0062% 0.0019% 0.0062% 0.1500% 4.6114% 0.2312% 64.8913% 2.4994% 1.4309% 2.4994% 0.0687% % Total: 100.0000 CAS Number Package Weight (mg): Weight by mg 160.0368 % weight of substance per package PPM 226,448 5,436 375 250 62 250 62 62 62 2,374 250 24 125 125 22.6448% 0.5436% 0.0375% 0.0250% 0.0062% 0.0250% 0.0062% 0.0062% 0.0062% 0.2374% 0.0250% 0.0024% 0.0125% 0.0125% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04102 Rev. *P Page 3 of 13 20L - SSOP Pb-Free Package B3. MATERIAL COMPOSITION Copper Wire and NiPdAu Lead Finish (Note 3) Material Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Substance Composition Purpose of Use Encapsulation Cu Fe P Zn Pb Polyimide NBR Bismaleimide Phenol resin Ni Pd Au Silver Epoxy resin A Epoxy resin B Dilute A Dilute B Hardener Dicyandiamide Organic peroxide Silicon Copper Epoxy Resin A Epoxy , Cresol Novolac Phenol resin Silica , Crystalline, Quarts Silica Fused Carbon black Metal Hydroxide 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7439-92-1 Trade Secret 9003-18-3 79922-55-7 28453-20-5 7440-02-0 7440-05-3 7440-57-5 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret Trade Secret 461-58-5 Trade Secret 33.4811 0.8169 0.0287 0.0435 0.0035 0.0313 0.0069 0.0070 0.0035 0.3080 0.0278 0.0049 0.0672 0.0036 0.0055 0.0036 0.0055 0.0045 0.0005 0.0005 % weight of substance per Homogenou s material 97.2656% 2.3731% 0.0833% 0.1264% 0.0102% 0.0909% 0.0200% 0.0203% 0.0102% 90.4092% 8.1612% 1.4296% 74.0000% 4.0000% 6.0000% 4.0000% 6.0000% 5.0000% 0.5000% 0.5000% 7440-21-3 7440-50-8 Trade Secret 29690-82-2 1.9757 0.1849 6.6112 6.6112 100.0000% 100.0000% 5.0000% 5.0000% 11,674 1,093 39,064 39,064 1.1674% 0.1093% 3.9064% 3.9064% Trade Secret 14808-60-7 6.6112 0.6509 5.0000% 0.4923% 39,064 3,846 3.9064% 0.3846% 60676-86-0 1333-86-4 Trade Secret 101.0326 0.3967 10.3105 76.4100% 0.3000% 7.7977% 596,983 2,344 60,923 59.6983% 0.2344% 6.0923% % Total: 100.0000 CAS Number Package Weight (mg): Weight by mg 169.2389 PPM 197,833 4,827 170 257 21 185 41 41 21 1,820 164 29 397 21 32 21 32 27 3 3 19.7833% 0.4827% 0.0170% 0.0257% 0.0021% 0.0185% 0.0041% 0.0041% 0.0021% 0.1820% 0.0164% 0.0029% 0.0397% 0.0021% 0.0032% 0.0021% 0.0032% 0.0027% 0.0003% 0.0003% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04102 Rev. *P % weight of substance per package Page 4 of 13 20L - SSOP Pb-Free Package B4. MATERIAL COMPOSITION Copper Wire and Pure Tin Lead Finish (Note 3) Material Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Substance Composition Purpose of Use Encapsulation Cu Fe P Zn Pb Polyimide NBR Bismaleimide Phenol resin Tin Silver Epoxy resin A Epoxy resin B Dilute A Dilute B Hardener Dicyandiamide Organic peroxide Silicon Copper Epoxy Resin A Epoxy , Cresol Novolac Phenol resin Silica , Crystalline, Quarts Silica Fused Carbon black Metal Hydroxide CAS Number Weight by mg 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7439-92-1 Trade Secret 9003-18-3 79922-55-7 28453-20-5 7440-31-5 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret Trade Secret 461-58-5 Trade Secret 33.4811 0.8169 0.0287 0.0435 0.0035 0.0313 0.0069 0.007 0.0035 3.3200 0.0672 0.0036 0.0055 0.0036 0.0055 0.0045 0.0005 0.0005 % weight of substance per Homogenou s material 97.2654% 2.3732% 0.0834% 0.1264% 0.0102% 0.0909% 0.0200% 0.0203% 0.0102% 100.0000% 73.9274% 3.9604% 6.0506% 3.9604% 6.0506% 4.9505% 0.5501% 0.5501% 7440-21-3 7440-50-8 Trade Secret 29690-82-2 1.9757 0.1849 6.6112 6.6112 100.0000% 100.0000% 5.0000% 5.0000% 11,472 1,074 38,389 38,389 1.1472% 0.1074% 3.8388% 3.8388% Trade Secret 14808-60-7 6.6112 0.6509 5.0000% 0.4923% 38,389 3,780 3.8388% 0.3780% 60676-86-0 1333-86-4 Trade Secret 101.0326 0.3967 10.3105 76.4100% 0.3000% 7.7976% 586,654 2,303 59,868 58.6655% 0.2303% 5.9869% % Total: 100.0000 Package Weight (mg): 172.2182 PPM % weight of substance per package 194,410 4,743 167 253 20 182 40 41 20 19,278 390 21 32 21 32 26 3 3 19.4411% 0.4743% 0.0167% 0.0253% 0.0020% 0.0182% 0.0040% 0.0041% 0.0020% 1.9278% 0.0390% 0.0021% 0.0032% 0.0021% 0.0032% 0.0026% 0.0003% 0.0003% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04102 Rev. *P Page 5 of 13 20L - SSOP Pb-Free Package ASSEMBLY Site 2: Amkor Technology Philippines (P1/P2) Package Qualification Report # 040606, 072108, 063503 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Pure Sn Lead Finish Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP20-Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04102 Rev. *P Page 6 of 13 20L - SSOP Pb-Free Package NiPdAu Lead Finish Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP20Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS B1. MATERIAL COMPOSITION (Note 3) Pure Sn Lead finish Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ag Sn Resin Ag Metal oxide Amine Gamma Butyrolactone Si Au Multi-aromatic Resin SiO2 Carbon Black Epoxy, Cresol Novolac Phenol Resin 7440-50-8 7439-89-6 7723-14-0 1314-13-2 7440-22-4 7440-31-5 Trade Secret 7440-22-4 Trade Secret Trade Secret Trade Secret 46.8400 1.1300 0.0100 0.0600 1.0400 2.6600 0.5800 1.9400 0.0800 0.0800 0.0800 % weight of substance per Homogeno us material 95.4360% 2.3024% 0.0204% 0.1222% 2.1190% 100.0000% 21.0145% 70.2899% 2.8986% 2.8986% 2.8986% 7440-21-3 7440-57-5 Trade secret 13.3400 0.4000 7.3300 100.0000% 100.0000% 7.4980% 60676-86-0 1333-86-4 29690-82-2 84.0700 0.4900 1.9600 85.9963% 0.5012% 2.0049% Trade secret 3.9100 3.9996% CAS Number Package Weight (mg): Weight by mg 166.0000 PPM 282,169 6,807 60 361 6,265 16,024 3,494 11,687 482 482 482 80,361 2,410 44,157 506,446 2,952 11,807 23,554 % Total: % weight of substance per package 28.2200% 0.6800% 0.0100% 0.0400% 0.6300% 1.6000% 0.3500% 1.1700% 0.0500% 0.0500% 0.0500% 8.0400% 0.2400% 4.4200% 50.6400% 0.3000% 1.1800% 2.3600% 100.0000 B2. MATERIAL COMPOSITION (Note 3) Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04102 Rev. *P Page 7 of 13 20L - SSOP Pb-Free Package NiPdAu Lead finish Material Lead frame Purpose of Use Base Material Frame Plating Lead Finish External Plating Die Attach Adhesive Die Wire Mold Compound Circuit Interconnect Encapsulation Substance Composition CAS Number Cu 7440-50-8 Fe P Zn Ni Pd Au 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 Ni 7440-02-0 Pd Au Resin Ag Metal Oxide Amine 7440-05-3 7440-57-5 Trade Secret 7440-22-4 Trade Secret Trade Secret Gamma Butyrolactone Trade Secret Silicon Au 7440-21-3 7440-57-5 Multi-aromatic Resin Trade Secret SiO2 Filler Carbon Black 60676-86-0 1333-86-4 Epoxy Cresol Novolac Trade Secret Phenol Resin Trade Secret Package Weight (mg): Weight by mg % weight of substance per Homogenous material PPM % weight of substance per package 46.0000 1.1100 0.0100 0.0600 0.8600 0.0200 0.0040 97.4989% 2.3527% 0.0212% 0.1272% 97.2851% 2.2624% 0.4525% 285,689 6,894 62 373 5,341 124 25 28.5689% 0.6894% 0.0062% 0.0373% 0.5341% 0.0124% 0.0025% 0.3600 0.0080 0.0020 0.4000 1.3200 0.0600 0.0600 97.2973% 2.1622% 0.5405% 21.0526% 69.4737% 3.1579% 3.1579% 2,236 50 12 2,484 8,198 373 373 0.2236% 0.0050% 0.0012% 0.2484% 0.8198% 0.0373% 0.0373% 0.0600 5.4700 0.4000 3.1579% 100.0000% 99.9900% 373 33,972 2,484 0.0373% 3.3972% 0.2484% 7.9000 90.1000 0.5200 7.5374% 85.9651% 0.4961% 49,064 559,579 3,230 4.9064% 55.9579% 0.3230% 2.0900 4.2000 1.9941% 4.0073% 12,980 26,085 1.2980% 2.6085% 161.0140 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04102 Rev. *P Page 8 of 13 20L - SSOP Pb-Free Package ASSEMBLY Site 3: Cypress Manufacturing Limited (CML) Package Qualification Report #s 063711, 121405 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP20- CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04102 Rev. *P Page 9 of 13 20L - SSOP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1. Using Gold Wire Material Lead frame Lead Finish Die Attach Purpose of Use Base Material External Plating Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation 42.4100 % weight of substance per Homogenous material 96.1896% 266,679 26.6679% 7440-21-3 0.2900 0.6577% 1,824 0.1824% Mg 7439-95-4 0.0700 0.1588% 440 0.0440% Ni Ni Pd Au Ag Proprietary Bismeleide Proprietary Polymer Methacrylate Acrylate Ester Organic Peroxide Si Au SiO2 Phenol Resin Epoxy Resin 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 1.3200 0.8900 0.0200 0.0200 0.1920 0.0216 2.9939% 95.6989% 2.1505% 2.1505% 80.0000% 9.0000% 8,300 5,596 126 126 1,207 136 0.8300% 0.5596% 0.0126% 0.0126% 0.1207% 0.0136% Trade Secret 0.0120 5.0000% 75 0.0075% Trade Secret Trade Secret 0.0048 0.0048 2.0000% 2.0000% 30 30 0.0030% 0.0030% Trade Secret 0.0048 2.0000% 30 0.0030% 3.6700 1.2400 96.8900 5.4400 100.0000% 100.0000% 89.0042% 4.9972% 23,077 7,797 609,256 34,207 2.3077% 0.7797% 60.9256% 3.4207% 6.5300 5.9985% Substance Compositio n CAS Number Cu 7440-50-8 Si 7440-21-3 7440-57-5 60676-86-0 Proprietary Proprietary Package Weight (mg): Weight by mg 159.0300 % weight of substance per package PPM 41,061 4.1061% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04102 Rev. *P Page 10 of 13 20L - SSOP Pb-Free Package B2. Using Copper Wire Purpose of Use Material Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation 42.4100 % weight of substance per Homogenous material 96.1896% 267,794 26.7794% 7440-21-3 0.2900 0.6577% 1,831 0.1831% Mg 7439-95-4 0.0700 0.1588% 442 0.0442% Ni Ni Pd Au Ag Proprietary Bismeleide Proprietary Polymer Methacrylate Acrylate Ester Organic Peroxide Si Cu SiO2 Phenol Resin Epoxy Resin 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 1.3200 0.8900 0.0200 0.0200 0.1920 0.0216 2.9939% 95.6989% 2.1505% 2.1505% 80.0000% 9.0000% 8,335 5,620 126 126 1,212 136 0.8335% 0.5620% 0.0126% 0.0126% 0.1212% 0.0136% Trade Secret 0.0120 5.0000% 76 0.0076% Trade Secret Trade Secret Trade Secret 0.0048 0.0048 0.0048 2.0000% 2.0000% 2.0000% 30 30 30 0.0030% 0.0030% 0.0030% 3.6700 0.5782 96.8900 5.4400 6.5300 100.0000% 100.0000% 89.0044% 4.9972% 5.9985% 23,174 3,651 611,804 34,350 41,233 2.3174% 0.3651% 61.1804% 3.4350% 4.1233% % Total: 100.0000 Substance Composition CAS Number Weight by mg Cu 7440-50-8 Si 7440-21-3 7440-50-8 60676-86-0 Proprietary Proprietary Package Weight (mg): 158.3682 % weight of substance per package PPM II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tube HIC Others Material Cover tape Carrier tape End Pin End Plug Humidity Indicator Shielding bag Lead PPM <2.0 <2.0 <2.0 <2.0 <10.0 <2.0 Cadmium PPM <2.0 <2.0 <2.0 <2.0 < 5.0 <2.0 Cr VI PPM <2.0 <2.0 <2.0 <2.0 < 4.0 <2.0 Mercury PPM <2.0 <2.0 <2.0 <2.0 < 1.0 <2.0 PBB PPM <0.0005 <0.0005 <0.0005 <0.0005 < 100.0 <5.0 PBDE PPM <0.0005 <0.0005 <0.0005 <0.0005 < 100.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-ENDP-R CoA-EPLG-R CoA-HIC-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04102 Rev. *P Page 11 of 13 20L - SSOP Pb-Free Package Document History Page Document Title: Document Number: Rev. 20L - SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04102 ** *A ECN No. Orig. of Change 388679 EML 417225 YXP *B 432489 MRB *C 602516 MRB *D 2602510 MAHA DCON Description of Change New document Edited Summary section – edited package weight for assembly site 1, and added package weight for assembly site 2. Added “(PMDD)” on title page. Edited Note 3 on footer section. Added Note 4 on footer section. Added qual report # 043102 for assembly site 1. Revised section I-B of assembly site 1 to reflect updated package weight. Added PMDD data for assembly site 2. Added referencing to the automotive qualification report number 042702 for assembly site 1. 1. Updated Cypress Logo 2. Added package weight on Site 3 3. Added on the material composition the percent weight per homogeneous material and weight of substance per package on assembly site 1 and 2. 4. Added PMDD for assembly site 3 5. Deleted assembly site 1 and 2 on the declaration of Packaging/Indirect. 6. Update Lead, CrIV, PBB and PBDE on the Declaration of Packaging/Indirect Materials. 1.Added the following for assembly site 1: a. Package weight for NiPdAu lead finish b. Table A for NiPdAu lead finish c. Reference QTP 053005 d. Material composition table for NiPdAu lead finish 2. Changed CoA-SP28-R to CoA-SP20-R for assembly site 3. Changed CML to WEB in distribution list. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04102 Rev. *P Page 12 of 13 20L - SSOP Pb-Free Package Document History Page Document Title: Document Number: Rev. 20L - SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04102 *E ECN Orig. of No. Change 2819624 MAHA *F 2915244 SMYU *G 3067069 MAHA *H 3440953 MAHA *I 3562734 UDR *J 3645620 COPI *K 4032303 YUM *L *M 4086966 YUM 4146716 UDR *N *O *P 4426949 HLR 4594594 HLR 5052095 HLR SLLO Description of Change Corrected the CAS number of Magnesium and Silica on Table B1 of assembly site 1. Corrected the spelling of Proprietary in Proprietary Polymer on the material composition table of assembly site 3. Added the CAS number of SiO2 on the material composition table of assembly site 3. Corrected the CAS number of Magnesium on the material composition table of assembly site 3. 1.Added the following for assembly site 2: a. Package weight for NiPdAu lead finish b. Table A for NiPdAu lead finish c. Reference QTP 074606 d. Material composition table for NiPdAu lead finish Added percent signs to the percent weight per homogeneous material and weight of substance per package values on the following: 1. Table B1 of assembly site 1 2. Assembly site 3 Added percent signs to the percent weight per homogeneous material values on Assembly site 2. Expressed the weight by mg, package weight, % weight of substance per Homogeneous material, and % weight of substance per package in four decimal places; and recalculated the PPM values for all assembly sites. Added B3 under Site 1 with reference QTP # 120410 for SSOP 20L Copper Wire Qualification. Added PMDD B2 for Assembly Site 3. CML-RA Copper wire qualification under QTP # 121405. Added assembly site name in the Assembly heading. Changed Assembly Code to Assembly Site Name. Added “P1/P2” in the assembly heading in site 2. Added B4 under Site 1 with reference QTP # 120410 for SSOP 20L Copper Wire Qualification. Added 063503 on the QTP reference for Assembly Site 2. Sunset Due – No Change Changed the substances with “------------- “to “Trade Secret Removed Distribution and Posting. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04102 Rev. *P Page 13 of 13