Materials Analysis

Environmental Management and Materials Information
Product Content Information for: MAX3637ETM+
Links
Qualifications
Package Description
Chemical Composition Summary
Detailed Package Component Data
Qualifications Top
Lead−Free Qualified
Yes
REACH
Yes: 2011−06−20
RoHS Qualified
Yes
Starting Date Code: 1052+
Green
Moisture Sensitivity Level
L1
Flammability Meets UL−94 (V−0 Rating)
Yes
Assembler Qualified
UTL
Package Description Top
Package Code
T4877+4
Package Type
TQFN *
Package Description
Thin Quad Flatpack, No Leads
Package Option
Sawn/Epad
Footprint Area (mm2)
50.4
Body Size
7x7x0.8mm
Pin Count
48
Unit Weight in Grams
0.1323334
Chemical Composition Summary Top
Maxim NIA/NIU Substance List (PDF, 24k)
Substance
CAS
Number
Aluminum (Al)
7429−90−5
0
0
Antimony (Sb2O3)
1309−64−4
0
0
0
0
0
0
BCB Resin
Bromine (Br)
7726−95−6
Amount
(grams)
% of
Unit Weight
1
Carbon (C)
7440−44−0
0
0
Carbon Black
1333−86−4
0
0
Ceramic (BaTiO3)
12047−27−7
0
0
Chromium (Cr)
7440−47−3
0
0
Cobalt (Co)
7440−48−4
0
0
Copper (Cu)
7440−50−8
0.05101
38.54658
Gold (Au)
7440−57−5
0.00086
0.64987
Indium (In)
7440−74−6
0
0
0
0
0.001165
0.88035
Insulator (Polyimide)
Iron (Fe)
7439−89−6
FeO2
12411−15−36
0
0
Lead (Pb)
7439−92−1
0
0
Magnesium (Mg)
7439−95−4
0
0
Manganese (Mn)
7439−96−5
0
0
0
0
0
0
NiPdAu
0
0
Nickel−V (NiV)
0
0
MnO3
Nickel (Ni)
7440−02−0
Palladium (Pd)
7440−05−3
0
0
Phosphorus (P)
7723−14−0
0
0
Silica (SiO2)
11126−22−0
0.05451
41.19142
Silicon (Si)
7440−21−3
0.009
6.80100
Silver (Ag)
7440−22−4
0.00327
2.47103
Solder Mask
0
0
Solder Paste
0
0
Spheron Polymer Passivation
0
0
Sulfur (S)
7704−34−9
0
0
Tin (Sn)
7440−31−5
0.00606
4.57934
Titanium (Ti)
7440−32−6
0
0
0
0
Titanium−W (TiW)
Tungsten (W)
7440−33−7
0
0
Vanadium (V)
7440−62−2
0
0
Zinc (Zn)
7440−66−6
6.8e−05
0.05139
ZnO
1314−13−2
0
0
Zirconium (Zr)
7440−67−7
0
0
Detailed Package Component Data Top
2
Bond Wire Components
Summary
Component Weight
0.00086
Substance
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Gold (Au)
0.00086
100.00000
0.64987
0
0
0
Aluminum (Al)
Die Attach Epoxy Components
Summary
Die Attach Material
Ablebond 8200T
Component Weight
0.00339
% of
Component Weight
% of
Unit Weight
0
0
0
0
0
0
20.05900
0.51385
Functionalized Ester
0
0
Functionalized Urethane
0
0
0
0
0
0
0
0
Polymeric
0
0
Polyoxypropylenediamine
0
0
0
0
0
0.00271
79.94100
2.04786
0
0
0
0
0
Substance
Amount
(grams)
Aromatic Amine
Copper (Cu)
0
Diester
Epoxy
Indium (In)
0.00068
0
Lactone
Lead (Pb)
Resin
Silver Filler (Ag)
Tin (Sn)
0
Other
Lead Finish/Plating Components
Summary
Lead Finish Plating
100% Tin
Assembly Lead Finish Process
Component Weight
Substance
Lead (Pb)
0.00606
Amount
(grams)
% of
Component Weight
% of
Unit Weight
0
0
0
3
Tin (Sn)
0.00606
100.00000
4.57934
NiPdAu
0
0
0
Gold (Au)
0
0
0
Nickel (Ni)
0
0
0
Lead Frame Components
Summary
Lead Frame Material
Copper C194
Component Weight
0.052803
% of
Component Weight
% of
Unit Weight
Aluminum (Al)
0
0
Carbon (C)
0
0
0
0
0
0
96.60436
38.54658
0
0
2.20631
0.88035
0
0
0
0
0
0
0
0
Palladium (Pd)
0
0
Phosphorus (P)
0
0
Silicon (Si)
0
0
1.06055
0.42317
Sulfur (S)
0
0
Tin (Sn)
0
0
0.000068
0.12878
0.05139
0
0
0
Substance
Chromium (Cr)
Amount
(grams)
ND
Cobalt (Co)
Copper (Cu)
0.05101
Gold (Au)
Iron (Fe)
0.001165
Lead (Pb)
Magnesium (Mg)
ND
Manganese (Mn)
Nickel (Ni)
Silver (Ag)
Zinc (Zn)
Zirconium (Zr)
ND
0.00056
Mold Compound Components
Summary
Mold Material
Sumitomo G770HCD
Resin Type
Multi−Functional
Component Weight
Substance
0.06023
Amount
(grams)
% of
Component Weight
% of
Unit Weight
4
Antimony (Sb2O3)
ND
0
0
Bromine (Br)
ND
0
0
Carbon Black
0
0
Epoxy
0
0
Epoxy Cresol Novolac
0
0
Metal Hydroxide
0
0
Phenol Novolac
0
0
Silica (SiO2)
0.05451
90.50307
41.19142
Resin
0.00572
9.49693
4.32242
0
0
Substance
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Silicon Chip
0.00900
100
6.80100
Other
Silicon Chip Components
Substrate Components
Summary
Substrate Weight
Substrate Material
0
Substrate Core Material
0
Bromine−Free
0
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Copper
0
0
0
Gold
0
0
0
Nickel
0
0
0
Substrate Core Material
0
0
0
Solder Mask
0
0
0
Triazol
0
0
Other
0
0
Substance
5
Notes:
1. Lead Form: GW − Gull Wing, TH − Through Hole.
2. Refer to product data sheet to confirm actual wire diameter.
3. 'ND' means None Detected, negligible amount present.
* This package may be remarked. If remarked, the package will contain additional homogeneous
materialsinksthat are not listed in contents of this report.
+ Existing inventory of non Halogen−free product will be sold first. Halogen−free product is identified by
date code only. If you need to confirm delivery of Halogen−free product, please contact Customer
Service.
This part is qualified as lead−free.
Parts qualified as lead−free can be manufactured and supplied as lead−free, if and only if, the customer
makes such requests to the Maxim Business Units for approval. The navigation bar on the EMMI website
contains information regarding the lead−free process (e.g. MSL's, Peak reflow Temperatures, JEDEC
methods, frequently asked questions and answers, lead−free package tables, and status/qualification plans for
particular package types qualified as lead−free or in the qualification process).
This report was generated on 2012−01−23. For additional information, please visit the
Maxim/Dallas Environmental Management and Materials Information website located at:
http://www.maxim−ic.com/emmi
6