ROHM BD6520F

Power Management Switch IC Series for PCs and Digital Consumer Product
Large Current Output
Power Management Switch ICs
BD6520F,BD6522F
No.09029EAT12
Description
The power switch for expansion module is a power management switch having one circuit of N-channel Power MOS FET.
The switch realizes 50mΩ(Typ.) ON resistance. The switch turns on smoothly by the built-in charge pump, therefore, it is
possible to reduce inrush current at switch on. And soft start control by external capacitor is available.
Further, it has a discharge circuit that discharges electric charge from capacitive load at switch off, Under voltage lockout
circuit, and a thermal shutdown circuit.
Features
1) Low on resistance (50mΩ, Typ.) N-MOS switch built in
2) Maximum output current: 2A
3) Discharge circuit built in
4) Soft start control circuit built in
5) Under voltage lockout (UVLO) circuit built in
6) Thermal shutdown (Output off latching)
7) Reverse current flow blocking at switch off (only BD6522F)
Applications
Notebook PC, PC peripheral device, etc.
Lineup
Parameter
Supply Voltage
Switch current
On Resistance
OUT Rise Time
OUT Fall Time
Package
Reverse current flow blocking at switch off
Absolute Maximum Ratings
Parameter
Supply Voltage
CTRL Input Voltage
*1
*
*
BD6520F
3 to 5.5V
2A
50mΩ
2000us
3us
SOP8
-
Symbol
VDD
VCTRL
BD6522F
3 to 5.5V
2A
50mΩ
1000us
4us
SOP8
○
Switch Output Voltage
VOUT
Storage temperature
Power dissipation
TSTG
Pd
Rating
-0.3 to 6.0
-0.3 to 6.0
-0.3 to VDD + 0.3 (BD6520F)
-0.3 to 6.0
(BD6522F)
-55 to 150
560*1
Symbol
VDD
IOUT
TOPR
Limit
3.0 to 5.5
0 to 2
-25 to 85
Unit
V
V
V
V
℃
mW
Unit
V
A
℃
This value decreases 4.48mW/℃ above Ta=25℃
Resistance radiation design is not doing.
Operation is not guaranteed.
Operation conditions
Parameter
Supply Voltage
Switch current
Operating Temperature
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1/16
2009.05 - Rev.A
Technical Note
BD6520F,BD6522F
Electrical characteristics
◎BD6520F(Unless otherwise specified, Ta = 25℃, VDD = 5V)
Limit
Parameter
Symbol
Min.
Typ.
RON1
50
On Resistance
RON2
60
IDD
110
Operating Current
IDDST
VCTRLL
Control Input voltage
VCTRLH
2.5
-
Max.
70
85
220
2
0.7
-
Unit
Condition
mΩ
mΩ
uA
uA
V
V
VDD = 5V, VCTRL = 5V
VDD = 3V, VCTRL = 3V
VCTRL = 5V, OUT = OPEN
VCTRL = 0V, OUT = OPEN
VCTRL L = Low Level
VCTRL H = High Level
Control Input current
ICTRL
-1
0
1
uA
VCTRL = L, H
Turn On Delay
Trd
200
1000
2000
us
RL = 10Ω,SSCTL = OPEN
CTRL = L→H → OUT=50%
Turn On Rise Time
Tr
500
2000
7500
us
RL = 10Ω,SSCTL = OPEN
CTRL = 10% → 90%
Turn Off Delay
Tfd
-
3
20
us
RL = 10Ω,SSCTL = OPEN
CTRL = H→L → OUT=50%
Turn Off Fall Time
Tf
-
1
20
us
RL = 10Ω,SSCTL = OPEN
CTRL = 90% → 10%
Discharge Resistance
RSWDC
-
350
600
Ω
VDD = 5V, VCTRL = 0V, VOUT = 5V
UVLO Threshold Voltage
VUVLOH
VUVLOL
2.3
2.1
2.5
2.3
2.7
2.5
V
V
VDD increasing
VDD decreasing
UVLO Hysteresis Voltage
VHYS
100
200
300
mV
VHYS = VUVLOH - VUVLOL
Thermal Shutdown Threshold
TTS
-
135
-
℃
VCTRL = 5V
VSSCTL
-
13.5
-
V
VCTRL = 5V
SSCTL Output Voltage
◎BD6522F(Unless otherwise specified, Ta = 25℃, VDD = 5V)
Limit
Parameter
Symbol
Min.
Typ.
RON1
50
On Resistance
RON2
60
110
IDD
Operating Current
IDDST
VCTRLL
Control Input Voltage
VCTRLH
2.5
-
Max.
70
85
220
2
0.7
-
Unit
Condition
mΩ
mΩ
uA
uA
V
V
VDD = 5V, VCTRL = 5V
VDD = 3.3V, VCTRL = 3.3V
VCTRL = 5V, OUT = OPEN
VCTRL = 0V, OUT = OPEN
VCTRLL = Low Level
VCTRLH = High Level
Control Input Current
ICTRL
-1
0
1
uA
VCTRL = L, H
Turn On Time
TON
-
1000
3500
us
RL = 10Ω,SSCTL = OPEN
CTRL = H → OUT =90%
Turn Off Time
TOFF
-
4
20
us
RL = 10Ω,SSCTL = OPEN
CTRL = L → OUT = 10%
Discharge Resistance
RSWDC
-
350
600
Ω
VDD = 5V,VCTRL = 0V
UVLO Threshold Voltage
VUVLOH
VUVLOL
2.3
2.1
2.5
2.3
2.7
2.5
V
V
VDD increasing
VDD decreasing
UVLO Hysteresis Voltage
VHYS
100
200
300
mV
VHYS = VUVLOH - VUVLOL
Thermal Shutdown Threshold
TTS
-
135
-
℃
VCTRL = 5V
VSSCTL
-
13.5
-
V
VCTRL = 5V
SSCTL Output Voltage
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2/16
2009.05 - Rev.A
Technical Note
BD6520F,BD6522F
Measurement circuit
◎BD6520F
◎BD6522F
VDD
VDD
BD6520F
VDDA
OUTA
VDDA
OUTA
VDDB
OUTB
VDDB
OUTB
SSCTL
OUTC
SSCTL
DISC
CTRL
CSS
BD6522F
VSS
RL CL
IOUT
VCTRL
CTRL
CSS
RL CL
VSS
IOUT
VCTRL
Fig.1 Measurement circuit
Timing diagram
◎BD6522F
◎BD6520F
Tf
Tr
90%
VOUT
90%
50%
10%
50%
10%
Trd
VCTRLH
10%
Tfd
TOFF
TON
VCTRL
90%
VOUT
TON
VCTRL
VCTRLL
VCTRLH
TOFF
VCTRLL
Fig.2 Timing diagram
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© 2009 ROHM Co., Ltd. All rights reserved.
3/16
2009.05 - Rev.A
Technical Note
BD6520F,BD6522F
Typical characteristics
◎BD6520F
60
50
40
30
20
10
3
4
5
50
40
VDD=3.0V
30
VDD=3.3V
20
VDD=5.0V, 5.5V
10
6
80
60
40
20
0
-40
-20
0
20
40
60
80
2
100
4
5
6
AMBITENT TEMPERATURE : Ta [℃]
SUPPLY VOLTAGE : VDD [V]
Fig.3 On resistance
Fig.4 On resistance
Fig.5 Operating current
(CTRL enable)
1.0
0.10
100
80
60
40
20
Ta = 25℃
VDD = 5.0V
LEAK CURRENT : ILEAK [uA]
OPERATING CURRENT : IDDST [uA]
VDD = 5.0V
0.08
0.06
0.04
0.02
0.00
0
-40
3
SUPPLY VOLTAGE : VDD [V]
120
-20
0
20
40
60
80
0.6
0.4
0.2
0.0
2
100
0.8
3
4
5
6
0
20
40
60
80
100
AMBIENT TEMPERATURE : Ta [℃]
SUPPLY VOLTAGE : VDD [V]
AMBIENT TEMPERATURE : Ta [℃]
Fig.6 Operating current
(CTRL enable)
Fig.7 Operating current
(CTRL disenable)
Fig.8 Leak current
2.5
CTRL INPUT VOLTAGE : VCTRL [V]
Ta = 25℃
2.0
Low to High
1.5
High to Low
1.0
0.5
2.5
VDD = 5.0V
CTRL INPUT VOLTAGE : VCTRL [V]
2.5
2.0
1.5
1.0
0.5
0.0
0.0
2
3
4
5
1.5
1.0
0.5
0.0
-40
6
VDD = 5.0V
2.0
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
SUPPLY VOLTAGE : VDD [V]
AMBIENT TEMPERATURE : Ta [℃]
AMBIENT TEMPERATURE : Ta [℃]
Fig.9 CTRL input voltage
Fig.10 CTRL input voltage H→L
Fig.11 CTRL input voltage L→H
0.4
5
0.4
CTRL HYSTERESIS : VCTRLHYS [V]
Ta = 25℃
0.3
0.2
0.1
0
Ta = 25℃
VDD = 5.0V
TURN ON TIME :Ton [ms]
OPERATING CURRENT : IDD [uA]
60
Ta = 25℃
100
0
2
CTRL INPUT VOLTAGE : VCTRL [V]
70
OPERATING CURRENT : IDD [uA]
70
ON RESISTANCE : Ron [mΩ]
ON RESISTANCE : Ron [mΩ]
Ta = 25℃
0
CTRL HYSTERESIS : VCTRLHYS[V]
120
80
80
0.3
0.2
0.1
3
4
5
6
Ton
3
Tr
2
Trd
1
0
0
2
4
-40
-20
0
20
40
60
80
100
2
3
4
5
SUPPLY VOLTAGE : VDD[V]
AMBIENT TEMPERATURE : Ta [℃]
SUPPLY VOLTAGE : VDD [V]
Fig.12 CTRL hysteresis voltage
Fig.13 CTRL hysteresis voltage
Fig.14 Turn On Rise time
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4/16
6
2009.05 - Rev.A
Technical Note
BD6520F,BD6522F
5
7
7
Ta = 25℃
4
3
Ton
2
Tr
Trd
1
Tfd
4
3
Tf
2
1
-20
0
20
40
60
80
4
Tfd
3
2
Tf
1
3
4
5
6
-40
-20
0
20
40
60
80
SUPPLY VOLTAGE : VDD [V]
AMBIENT TEMPERATURE : Ta [℃]
Fig.15 Turn On Rise time
Fig.16 Turn Off Fall time
Fig.17 Turn Off Fall time
DISCHARGE RESISTANCE : RSWDC [Ω]
Ta = 25℃
400
300
200
100
0
2
3
4
5
500
VDD = 5.0V
400
300
200
100
0
-40
6
-20
0
20
40
60
80
VDD increasing
2.4
VDD decreasing
2.2
-40
20
40
60
80
10
10
100
1000
10000
Css [pF]
AMBIENT TEMPERATURE : Ta [℃]
Fig.21 UVLO hysteresis voltage
60
80
100
10
1
1
100
40
VDD = 5.0V, Ta = 25℃, RL = 10Ω
1
0
20
100
TURN OFF TIME : Toff [us]
TURN ON TIME : Ton [ms]
0.1
0
Fig.20 UVLO threshold voltage
VDD = 5.0V, Ta = 25℃, RL = 10Ω
0.2
-20
AMBIENT TEMPERATURE : Ta [℃]
100
VDD = 5.0V
0
2.6
2.0
100
Fig.19 Switch discharge resistance
0.3
-20
2.8
AMBIENT TEMPERATURE : Ta [℃]
Fig.18 Switch discharge resistance
100
3.0
VDD = 5.0V
SUPPLY VOLTAGE : VDD [V]
1
10
100
1000
10000
Css [pF]
Fig.22 Turn On Rise time (vs. Css)
Fig.23 Turn Off Fall time (vs. Css)
16
16
Ta = 25℃
VDD = 5.0V
14
SSCTL VOLTAGE : VSSCTL [V]
SSCTL VOLTAGE : VSSCTL [V]
Toff
5
AMBIENT TEMPERATURE : Ta [℃]
500
-40
6
0
2
100
UVLO THRESHOLD : VUVLO [V]
-40
DISCHARGE RESISTANCE : RSWDC [Ω]
Toff
5
0
0
UVLO HYSTERESIS : VUVLOHYS [V]
VDD = 5.0V
6
TURN OFF TIME : Toff [us]
TURN OFF TIME : Toff [us]
TURN ON TIME : Ton [ms]
VDD = 5.0V
12
10
8
6
4
2
0
14
12
10
8
6
4
2
0
2
3
4
5
SUPPLY VOLTAGE : VDD [V]
Fig.24 SSCTL output voltage
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© 2009 ROHM Co., Ltd. All rights reserved.
6
-40
-20
0
20
40
60
80
100
AMBIENT TEMPERATURE : Ta [℃]
Fig.25 SSCTL output voltage
5/16
2009.05 - Rev.A
Technical Note
BD6520F,BD6522F
◎BD6522F
60
50
40
30
20
10
3
4
5
50
40
VDD=3.3V
30
VDD=5.0V
20
10
6
80
60
40
20
0
-40
-20
0
20
40
60
80
2
100
5
6
SUPPLY CURRENT : VDD [V]
Fig.26 ON resistance
Fig.27 ON resistance
Fig.28 Operating current
(CTRL enable)
1.0
0.10
80
60
40
20
0
Ta = 25℃
VDD = 5.0V
LEAK CURRENT : ILEAK [uA]
OPERATING CURRENT : IDDST [uA]
100
0.08
0.06
0.04
0.02
-20
0
20
40
60
80
100
0.8
0.6
0.4
0.2
0.0
0.00
2
3
4
5
0
6
20
40
60
80
100
AMBIENT TEMPERATURE : Ta [℃]
SUPPLY VOLTAGE : VDD [V]
AMBIENT TEMPERATURE : Ta [℃]
Fig.29 Operating current
(CTRL enable)
Fig.30 Operating current
(CTRL disenable)
Fig.31 Leak current
2.5
2.5
2.0
Low to High
1.5
High to Low
1.0
0.5
0.0
0.4
Ta = 25℃
VDD = 5.0V
2.0
CTRL HYSTERESIS : VCTRLHYS[V]
CTRL INPUT VOLTAGE : VCTRL [V]
Ta = 25℃
High to Low
1.5
Low to High
1.0
0.5
0.3
0.2
0.1
0.0
2
3
4
5
6
0
-40
-20
0
20
40
60
80
100
2
3
4
5
6
SUPPLY VOLTAGE : VDD [V]
AMBIENT TEMPERATURE : Ta [℃]
SUPPLY VOLTAGE : VDD [V]
Fig.32 CTRL input voltage
Fig.33 CTRL input voltage
Fig.34 CTRL hysteresis voltage
5
0.4
5
Ta = 25℃
0.3
0.2
0.1
0.0
VDD = 5.0V
4
TURN ON TIME : Ton [ms]
TURN ON TIME : Ton [ms]
VDD = 5.0V
3
2
1
-20
0
20
40
60
80
100
4
3
2
1
0
0
-40
4
AMBIENT TEMPERATURE : Ta [℃]
VDD = 5.0V
-40
3
SUPPLY VOLTAGE : VDD [V]
120
OPERATING CURRENT : IDD [uA]
60
Ta = 25℃
100
0
2
CTRL INPUT VOLTAGE : VCTRL [V]
70
OPERATING CURRENT : IDD [uA]
70
ON RESISTANCE : Ron [mΩ]
ON RESISTANCE : Ron [mΩ]
Ta = 25℃
0
CTRL HYSTERESIS : VCTRLHYS [V]
120
80
80
2
3
4
5
6
-40
-20
0
20
40
60
80
AMBIENT TEMPERATURE : Ta [℃]
SUPPLY VOLTAGE :VDD [V]
AMBIENT TEMPERATURE : Ta [℃]
Fig.35 CTRL hysteresis voltage
Fig.36 Turn On time
Fig.37 Turn On time
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6/16
100
2009.05 - Rev.A
Technical Note
BD6520F,BD6522F
7
6
TURN OFF TIME : Toff [us]
5
4
3
2
1
5
4
3
2
1
0
2
3
4
5
-40
6
-20
0
20
40
60
80
SUPPLY VOLTAGE : VDD [V]
AMBIENT TEMPERATURE : Ta [℃]
Fig.38 Turn Off time
Fig.39 Turn Off time
200
100
-40
-20
0
20
40
60
80
2.6
VDD increasing
2.4
VDD decreasing
2.2
-20
0
20
40
60
80
0.1
-20
0
20
40
60
80
100
Fig.43 UVLO hysteresis voltage
SSCTL VOLTAGE : VSSCTL [V]
TURN OFF TIME : Toff [us]
10000
6
16
10
Ta = 25℃
14
12
10
8
6
4
2
0
1
1000
5
AMBIENT TEMPERATURE : Ta [℃]
VDD = 5.0V, Ta = 25℃, RL = 10Ω
1
4
0.2
-40
100
VDD = 5.0V, Ta = 25℃, RL = 10Ω
10
3
VDD = 5.0V
100
Fig.42 UVLO threshold voltage
100
100
0
AMBIENT TEMPERATURE : Ta [℃]
Fig.41 Switch discharge resistance
10
100
0
AMBIENT TEMPERATURE : Ta [℃]
1
200
Fig.40 Switch discharge resistance
2.8
-40
100
300
2
2.0
0
400
SUPPLY VOLTAGE : VDD [V]
Ta = 25℃
300
Ta = 25℃
0.3
VDD = 5.0V
400
500
100
3.0
500
UVLO THRESHOLD : VUVLO [V]
DISCHARGE RESISTANCE : RSWDC [Ω]
6
UVLO HYSTERESIS : VUVLOHYS [V]
TURN OFF TIME : Toff [us]
VDD = 5.0V
0
TURN ON TIME : Ton [ms]
DISCHARGE RESISTANCE : RSWDC [Ω]
7
Ta = 25℃
1
10
100
1000
10000
Css [pF]
Css [pF]
Fig.44 Turn On time (vs. Css)
Fig.45 Turn Off time (vs. Css)
2
3
4
5
6
SUPPLY VOLTAGE : VDD [V]
Fig.46 SSCTL output voltage
SSCTL VOLTAGE : VSSCTL [V]
16
14
VDD = 5.0V
12
10
8
6
4
2
0
-40
-20
0
20
40
60
80
100
AMBIENT TEMPERATURE : Ta [℃]
Fig.47 SSCTL output voltage
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7/16
2009.05 - Rev.A
Technical Note
BD6520F,BD6522F
Waveform data
VDD = 5V, CL = 47uF, RL = 47Ω, unless otherwise specified.
VCTRL
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
VCTRL
(5V/div.)
VCTRL
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
TIME (1ms/div.)
TIME (5ms/div.)
Fig.48 Turn On Rise Time
(BD6520F)
VCTRL
(5V/div.)
TIME (1ms/div.)
Fig.49 Turn Off Fall Time
(BD6520F)
VCTRL
(5V/div.)
Fig.50 Turn On Rise Time
(BD6522F)
VCTRL
(5V/div.)
CL=330uF
Open
CL=330uF
Open
VOUT
(5V/div.)
470pF
1000pF
2200pF
4700pF
IOUT
(0.2A/div.)
IOUT
(0.5A/div.)
TIME (5ms/div.)
TIME (2ms/div.)
Fig.51 Turn Off Fall Time
(BD6522F)
VCTRL
(5V/div.)
IOUT
(0.5A/div.)
Fig.52 Inrush current vs. Css
(BD6520F)
TIME (2ms/div.)
Fig.53 Inrush current vs. Css
(BD6522F)
VCTRL
(5V/div.)
DISC terminal not in use
VOUT
(2V/div.)
VOUT
(2V/div.)
Temperature decline
DISC terminal in use
Thermal shut down
Latch release Return
TIME (500ms/div.)
TIME (20ms/div.)
Fig.54 Discharge: CL = 47uF, RL = Open
(BD6522F)
Fig.55 Thermal shutdown
VDD
(2V/div.)
VDD
(2V/div.)
VOUT
(2V/div.)
VOUT
(2V/div.)
TIME (500ms/div)
Fig.56 UVLO (at VDD increase)
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TIME (500ms/div)
Fig.57 UVLO (at VDD decrease)
8/16
2009.05 - Rev.A
Technical Note
BD6520F,BD6522F
Block diagram, pin configuration, pin description
(BD6520F)
VDDA
OUTA
1
8
VDDB
OUTB
2
7
Oscillator
SSCTL
Charge
OUTC
Pump
3
6
+
UVLO
-
Band
Thermal
Gap
Shutdown
S
Q
FF
R
VDDA
1
8 OUTA
VDDB
2
7 OUTB
SSCTL
3
6 OUTC
CTRL 4
CTRL
5 VSS
4
VSS
5
Fig.58 Block diagram(BD6520F)
Pin No.
Symbol
Pin Function
Switch input pin
At use, connect each pin outside.
1,2
VDDA, VDDB
3
SSCTL
Soft start setting pin
Add external capacitor, it is possible to delay switch On, Off time.
4
CTRL
Control input pin
Switch On at High level, switch Off at Low level.
5
VSS
6,7,8
OUTA, OUTB, OUTC
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© 2009 ROHM Co., Ltd. All rights reserved.
Ground
Switch output pin
At use, connect each pin outside.
9/16
2009.05 - Rev.A
Technical Note
BD6520F,BD6522F
(BD6522F)
VDDA
OUTA
1
8
VDDB
OUTB
2
7
Oscillator
SSCTL
Charge
Pump
3
+
UVLO
-
DISC
Band
Thermal
Gap
Shutdown
S
Q
6
FF
R
CTRL
VDDA
1
8 OUTA
VDDB
2
7 OUTB
SSCTL
3
6 DISC
4
CTRL 4
5 VSS
VSS
5
Fig.59 Block diagram(BD6522F)
Pin No.
Symbol
Pin Function
Switch input pin
At use, connect each pin outside.
1,2
VDDA, VDDB
3
SSCTL
Soft start setting pin
Add external capacitor, it is possible to delay switch On, Off time.
4
CTRL
Control input pin
Switch On at High level, switch Off at Low level.
5
VSS
Ground
6
DISC
Discharge pin
7,8
OUTA, OUTB
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Switch output pin
At use, connect each pin outside.
10/16
2009.05 - Rev.A
Technical Note
BD6520F,BD6522F
I/O circuit
Symbol
Equivalent circuit
BD6520F
Pin No.
Equivalent circuit
BD6522F
SSCTL
SSCTL
SSCTL
3
CTRL
CTRL
CTRL
4
DISC
DISC
6
(BD6522F)
OUT
6 (BD6520F),
7, 8
OUT
OUT
Fig.60 I/O circuit
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11/16
2009.05 - Rev.A
Technical Note
BD6520F,BD6522F
Functional description
1. Switch operation
VDD pin and OUT pin are connected to the drain and the source of switch MOSFET respectively. And the VDD is used
also as power source input to internal control circuit.
When CTRL input is set to High level and the switch is turned on, VDD and OUT is connected by a 50mΩ switch. In a
normal condition, current flows from VDD to OUT. If voltage of OUT is higher than VDD, current flows from OUT to VDD,
since the switch is bidirectional.
In BD6520F, there is a parasitic diode between the drain and the source of switch MOSFET. Therefore, even when the
switch is off, if the voltage of OUT is higher than that of VDD, current flows from OUT to VDD. In BD6522F, there is not this
parasitic diode, it is possible to prevent current from flowing reversely from OUT to VDD.
2. Thermal shutdown
Thermal shut down circuit turns off the switch when the junction temperature exceeds 135℃(Typ.).
The switch off status of the thermal shut down is latched. Therefore, even when the junction temperature goes down,
switch off is maintained. To release the latch, it is necessary to input a signal to switch off to CTRL terminal or make UVLO
status. When the switch on signal is input or UVLO is released, the switch output is recovered.
The thermal shut down circuit works when CTRL signal is active.
3. Low voltage malfunction prevention circuit (UVLO)
The UVLO circuit monitors the voltage of the VDD pin, when the CTRL input is active. UVLO circuit prevents the switch
from turning on until the VDD exceeds 2.5V(Typ.). If the VDD drops below 2.3V(Typ.) while the switch turns on, then UVLO
shuts off the switch.
4. Soft start control
In BD6520F/BD6522F, soft start is carried out in order to reduce inrush current at switch on. Further, in order to reduce
inrush current, soft start control pin (SSCTL) is prepared.
By connecting external capacitor to between SSCTL and GND, it is possible to make smoother the switch rise time. When
the switch is enabled, SSCTL outputs voltage of about 13.5V.
SSCTL terminal requires high impedance, so pay attention in packaging it so that there should not be leak current. And
when voltage is impressed from the outside to SSCTL terminal, switch on, off cannot be made correctly.
5. Discharge circuit
When the switch between the VDD and the OUT is OFF, the 200Ω(Typ.) discharge switch between OUT and GND turns on.
By turning on this switch, electric charge at capacitive load is discharged.
In BD6522F, the input of discharge circuit is separately prepared as DISC pin. When to use the discharge circuit, connect
OUT pin and DISC pin outside.
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12/16
2009.05 - Rev.A
Technical Note
BD6520F,BD6522F
Timing diagram
VDD
VCTRL
VOUT
Discharge circuit
ON
OFF
ON
Fig.61 Normal operation
VDD
VUVLOL
VUVLOH
VCTRL
VOUT
Discharge circuit ON
OFF
Fig.62 UVLO operation
Over temperature
corrected
Over temperature
occurs
Over temperature
occurs
Over temperature
corrected
VDD
VCTRL
VOUT
Latch
Release
Discharge circuit
OFF
Set
Release
ON
Release
OFF
Set
Release
OFF
Fig.63 Thermal shutdown operation
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13/16
2009.05 - Rev.A
Technical Note
BD6520F,BD6522F
Typical application circuits
BD6520F
Power Supply
OUTA
VDDA
VDDA
1µF
VDDB
OUTB
SSCTL
OUTC
CTRL
VSS
VDDB
OUTB
SSCTL
On/Off
CTRL
Fig.64 Power supply switch circuit (BD6520F)
DISC
VSS
Fig.65 Power supply switch circuit (BD6522F)
BD6522F
BD6522F
OUTA
VDDA
OUTA
Power Supply B
VDDB
Load
Css
On/Off
VDDA
OUTA
1µF
Load
Css
Power Supply A
BD6522F
Power Supply
OUTB
VDDB
Load
OUTB
Css
Css
SSCTL
DISC
SSCTL
DISC
On/Off
On/Off
CTRL
VSS
CTRL
VSS
Fig.66 2 power supply changeover switch circuit (BD6522F)
Thermal derating characteristic
(SOP8)
600
POWER DISSIPATION: Pd[mW]
500
400
300
200
100
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE: Ta [℃ ]
Fig. 67 Power dissipation curve
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14/16
2009.05 - Rev.A
Technical Note
BD6520F,BD6522F
Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the
same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used
present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic
element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal.
Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than
the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when
no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals
a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become 135°C (typ.) or higher, the thermal shutdown circuit operates and turns a switch OFF.
The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed
at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the
LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use.
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15/16
2009.05 - Rev.A
Technical Note
BD6520F,BD6522F
 Ordering part number
B
D
6
Part No.
5
2
0
F
Part No.
6520
6522
-
Package
F: SOP8
E
2
Packaging and forming specification
E2: Embossed tape and reel
(SOP8)
SOP8
<Tape and Reel information>
6
5
+6°
4° −4°
0.3MIN
7
4.4±0.2
6.2±0.3
8
1 2
3
0.9±0.15
5.0±0.2
(MAX 5.35 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
0.11
S
1.27
0.42±0.1
1pin
(Unit : mm)
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Reel
16/16
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.05 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
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R0039A