CPW2-0650-S006B–Silicon Carbide Schottky Diode Chip Z-Rec™ Rectifier VRRM = 650 V IF(AVG)= 6 A Features • • • • • • • Qc Chip Outline = 16 nC 650-Volt Schottky Rectifier Zero Reverse Recovery Zero Forward Recovery High-Frequency Operation Temperature-Independent Switching Behavior Extremely Fast Switching Positive Temperature Coefficient on VF Part Number Anode Cathode Package Marking CPW2-0650-S006B Al Ni/Ag Sawn on Foil Wafer # on Foil Maximum Ratings 6B Rev. W2-0650-S00 Datasheet: CP Symbol Parameter Value Unit Test Conditions Note VRRM Repetitive Peak Reverse Voltage 650 V VRSM Surge Peak Reverse Voltage 650 V VDC DC Blocking Voltage 650 V 6 A TJ=175˚C 41 A TC=25˚C, tP = 10 ms, Half Sine Wave, D=0.3 1 TC=25˚C, tP=10 µs, Pulse 1 IF(AVG) Average Forward Current IFRM Repetitive Peak Forward Surge Current IFSM Non-Repetitive Peak Forward Surge Current 200 A TJ , Tstg Operating Junction and Storage Temperature -55 to +175 ˚C Subject to change without notice. www.cree.com/power 1 Electrical Characteristics Symbol Parameter Typ. Max. Unit Test Conditions VF Forward Voltage 1.6 1.9 1.8 2.4 V IF = 6 A TJ=25°C IF = 6 A TJ=175°C IR Reverse Current 12 24 60 220 μA VR = 650 V TJ=25°C VR = 650 V TJ=175°C QC Total Capacitive Charge 16 nC VR = 650 V, IF = 6 A di/dt = 500 A/μs TJ = 25°C C Total Capacitance 294 27 26 pF VR = 0 V, TJ = 25°C, f = 1 MHz VR = 200 V, TJ = 25˚C, f = 1 MHz VR = 400 V, TJ = 25˚C, f = 1 MHz Note: 1. Assumes θJC Thermal Resistance of 1.6˚C/W or less Mechanical Parameters Parameter Typ. Unit Die Size 1.55 x 1.55 mm Anode Pad Size 1.29 x 1.29 mm Anode Pad Opening 1.08 x 1.08 mm Thickness 377 ± 10% μm Wafer Size 100 mm 4 μm 1.8 μm Anode Metalization (Al) Cathode Metalization (Ni/Ag) Frontside Passivation 2 CPW2-0650-S006B Rev. - Polyimide Note Chip Dimensions A symbol B A dimension mm inch A 1.55 0.061 B 1.29 0.051 B Part Number Anode Cathode Package Marking CPW2-0650-S006B Al Ni/Ag Sawn on Foil Wafer # on Foil The die-on-tape method of delivering these SiC die may be considered a means of temporary storage only. Due to an increase in adhesion over time, die stored for an extended period may affix too strongly to the tape. These die should be stored in a temperature-controlled nitrogen dry box soon after receipt. Cree will further recommend that all die be removed from tape to a waffle pack, to a similar storage medium, or used in production within 2 – 3 weeks of delivery to assure 100% release of all die without issues. This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited to equipment used in the operation of nuclear facilities, life-support machines, cardiac defibrillators or similar emergency medical equipment, aircraft navigation or communication or control systems, air traffic control systems, or weapons systems. Copyright © 2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks and Z-Rec is a trademark of Cree, Inc. 3 CPW2-0650-S006B Rev. - Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 Fax: +1.919.313.5451 www.cree.com/power