RENESAS PS9331L2

Preliminary Data Sheet
PS9331L, PS9331L2
R08DS0111EJ0200
Rev.2.00
Jun 21, 2013
2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 6-PIN SDIP PHOTOCOUPLER
DESCRIPTION
The PS9331L and PS9331L2 are optical coupled isolators containing a GaAlAs LED on the input side and a photo
diode, a signal processing circuit and power MOSFETs on the output side on one chip.
The PS9331L and PS9331L2 are in 6-pin plastic SDIP (Shrink Dual In-line Package). The PS9331L2 has 8 mm
creepage distance. The mount area of 6-pin plastic SDIP is half size of 8-pin DIP.
The PS9331L and PS9331L2 are designed specifically for high common mode transient immunity (CMR) and high
switching speed. It is suitable for driving IGBTs and MOS FETs.
The PS9331L is lead bending type (Gull-wing) for surface mounting.
The PS9331L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
FEATURES
Long creepage distance (8 mm MIN.: PS9331L2)
Half size of 8-pin DIP
Peak output current (2.5 A MAX., 2.0 A MIN.)
High speed switching (tPLH, tPHL = 175 ns MAX.)
High common mode transient immunity (CMH, CML = ±50 kV/μs MIN.)
Operating Ambient Temperature (125 °C)
Embossed tape product : PS9331L-E3, PS9331L2-E3: 2 000 pcs/reel
Pb-Free product
Safety standards
• UL approved: No. E72422
• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
• SEMKO approved (EN 60065, EN 60950)
• DIN EN 60747-5-5 (VDE 0884-5) approved (Option)
PIN CONNECTION
(Top View)
6
5
4
SHIELD
•
•
•
•
•
•
•
•
•
1
2
1. Anode
2. NC
3. Cathode
4. VEE
5. VO
6. VCC
3
APPLICATIONS
• IGBT, Power MOS FET Gate Driver
• Industrial inverter
• AC Servo
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
Page 1 of 18
PS9331L, PS9331L2
PACKAGE DIMENSIONS (UNIT: mm)
Lead Bending Type (Gull-wing) For Surface Mount
PS9331L
4.58±0.3
6.8±0.25
(0.82)
9.7±0.3
0.25±0.15
0.2±0.15
3.5±0.2
3.7±0.25
7.62
1.27
0.4±0.1
0.8±0.25
0.25 M
Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount)
PS9331L2
4.58±0.3
6.8±0.25
(0.82)
11.5±0.3
1.27
0.4±0.1
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
0.25±0.15
0.2±0.15
3.5±0.2
3.7±0.25
7.62
0.75±0.25
0.25 M
Page 2 of 18
PS9331L, PS9331L2
PHOTOCOUPLER CONSTRUCTION
Parameter
Air Distance (MIN.)
Outer Creepage Distance (MIN.)
Isolation Distance (MIN.)
PS9331L
7 mm
7 mm
0.4 mm
PS9331L2
8 mm
8 mm
0.4 mm
MARKING EXAMPLE
R
9331
N320
Company Initial
Type Number
Assembly Lot
No. 1 pin Mark
N
3 20
Week Assembled
Year Assembled
(Last 1 Digit)
Rank Code
ORDERING INFORMATION
Part Number
Order Number
PS9331L
PS9331L-E3
PS9331L-AX
PS9331L-E3-AX
PS9331L2
PS9331L2-E3
PS9331L2-AX
PS9331L2-E3-AX
PS9331L-V
PS9331L-V-E3
PS9331L-V-AX
PS9331L-V-E3-AX
PS9331L2-V
PS9331L2-V-AX
PS9331L2-V-E3 PS9331L2-V-E3-AX
Note:
Solder Plating
Specification
Pb-Free
(Ni/Pd/Au)
Packing Style
Safety Standard
Approval
20 pcs (Tape 20 pcs cut) Standard
Embossed Tape 2 000
products
pcs/reel
(UL, CSA,
20 pcs (Tape 20 pcs cut) SEMKO
Embossed Tape 2 000
approved)
pcs/reel
20 pcs (Tape 20 pcs cut) DIN EN 60747-5-5
Embossed Tape 2 000
(VDE 0884-5)
pcs/reel
approved
20 pcs (Tape 20 pcs cut) (Option)
Embossed Tape 2 000
pcs/reel
Application
*1
Part Number
PS9331L
PS9331L2
PS9331L
PS9331L2
*1. For the application of the Safety Standard, following part number should be used.
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
Page 3 of 18
PS9331L, PS9331L2
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Diode
Parameter
Forward Current
Symbol
IF
Peak Transient Forward Current
(Pulse Width < 1 μs)
Reverse Voltage
Power Dissipation *1
Detector High Level Peak Output Current *2
Low Level Peak Output Current *2
Supply Voltage
Output Voltage
Power Dissipation *3
Isolation Voltage *4
Operating Frequency
Operating Ambient Temperature
Storage Temperature
Notes: *1.
*2.
*3.
*4.
IF (TRAN)
VR
PD
IOH (PEAK)
IOL (PEAK)
(VCC − VEE)
VO
PC
BV
f
TA
Tstg
Ratings
25
1.0
Unit
mA
A
5
45
2.5
2.5
0 to 35
0 to VCC
250
5 000
50
−40 to +125
−55 to +150
V
mW
A
A
V
V
mW
Vr.m.s.
kHz
°C
°C
Reduced to 1.2 mW/°C at TA = 110°C or more.
Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%
Reduced to 3.9 mW/°C at TA = 85°C or more.
AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-3 shorted together, 4-6 shorted together.
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Forward Current (ON)
Forward Voltage (OFF)
Operating Ambient Temperature
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
Symbol
(VCC − VEE)
IF (ON)
VF (OFF)
TA
MIN.
15
8
−2
−40
TYP.
10
MAX.
30
12
0.8
125
Unit
V
mA
V
°C
Page 4 of 18
PS9331L, PS9331L2
ELECTRICAL CHARACTERISTICS (at RECOMMENDED OPERATING CONDITIONS,
VEE = GND, unless otherwise specified)
Diode
Detector
Parameter
Forward Voltage
Reverse Current
Input Capacitance
High Level Output Current
Symbol
VF
IR
CIN
IOH
Low Level Output Current
IOL
High Level Output Voltage
Low Level Output Voltage
High Level Supply Current
Low Level Supply Current
UVLO Threshold
VOH
VOL
ICCH
ICCL
VUVLO+
VUVLO−
UVLOHYS
UVLO Hysteresis
Coupled
Notes: *1.
*2.
*3.
*4.
Conditions
IF = 10 mA, TA = 25°C
VR = 3 V, TA = 25°C
f = 1 MHz, VF = 0 V
VO = (VCC − 4 V) *2
VO = (VCC − 15 V) *3
VO = (VEE + 2.5 V) *2
VO = (VEE + 15 V) *3
IO = −100 mA *4
IO = 100 mA
VO = Open
VO = Open
VO > 5 V, IF = 10 mA
VO > 5 V, IF = 10 mA
Threshold Input Current
(L → H)
IFLH
IO = 0 mA, VO > 5 V
Threshold Input Voltage
(H → L)
VFHL
IO = 0 mA, VO < 5 V
MIN.
1.35
0.5
2.0
0.5
2.0
VCC − 3.0
10.8
9.5
0.4
TYP.*1
1.56
MAX.
1.75
10
30
2.2
Unit
V
μA
pF
A
2.4
A
VCC − 1.3
0.2
1.7
1.7
12.3
11.0
1.3
0.5
2.2
2.2
13.4
12.5
V
V
mA
mA
V
1.7
4.0
V
0.8
mA
V
Typical values at TA = 25°C, VCC − VEE = 30 V.
Maximum pulse width = 50 μs, Maximum duty cycle = 0.5%.
Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%.
VOH is measured with the DC load current in this testing (Maximum pulse width = 2 ms, Maximum duty cycle
= 20%).
SWITCHING CHARACTERISTICS (at RECOMMENDED OPERATING CONDITIONS,
VEE = GND, unless otherwise specified)
Parameter
Symbol
Propagation Delay Time (L → H)
tPLH
Propagation Delay Time (H → L)
tPHL
Pulse Width Distortion (PWD)
|tPHL−tPLH|
tPHL−tPLH
Propagation Delay Time
(Difference Between Any Two
Products)
Rise Time
tr
Fall Time
tf
|CMH|
Common Mode Transient
Immunity at High Level Output
|CML|
Common Mode Transient
Immunity at Low Level Output
Conditions
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz,
Duty Cycle = 50%,
IF = 10 mA
MIN.
TYP.*1
80
105
25
−90
40
40
MAX.
175
175
75
90
Unit
ns
ns
ns
ns
ns
ns
TA = 25°C, IF = 10 mA,
VCC = 30 V, VCM = 1.5 kV
50
kV/μs
TA = 25°C, IF = 0 mA,
VCC = 30 V, VCM = 1.5 kV
50
kV/μs
Notes: *1. Typical values at TA = 25°C, VCC−VEE = 30 V.
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
Page 5 of 18
PS9331L, PS9331L2
TEST CIRCUIT
Fig. 1 IOH Test Circuit
1
6
2
5
3
4
IF
VCC
Fig. 2 IOL Test Circuit
1
6
2
5
3
4
1.0 μF
1.0 μF
IOH
SHIELD
IOL
SHIELD
Fig. 3 VOH Test Circuit
IF
VCC
1
6
2
5
3
4
VCC
1.0 μF
VOH
100 mA
SHIELD
Fig. 4 VOL Test Circuit
1
6
2
5
3
4
VCC
1.0 μF
VOL
100 mA
SHIELD
Fig. 5 ICCH/ICCL Test Circuit
1
6
VCC
2
5
1.0 μF
Fig. 6 UVLO Test Circuit
IF = 10 mA 1
6
2
5
1.0 μF
VCC
VO > 5 V
3
4
SHIELD
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
3
4
SHIELD
Page 6 of 18
PS9331L, PS9331L2
Fig. 7 IFLH Test Circuit
IF
1
6
VCC
2
5
1.0 μF
3
4
VO > 5 V
SHIELD
Fig. 8 tPLH, tPHL, tr, tf Test Circuit and Wave Forms
IF = 10 mA
1
6
2
5
VCC
IF
1.0 μF
tr
tf
VO
10 kHz
50% DUTY
CYCLE
3
80%
50%
20%
10 Ω
10 nF
4
VOUT
tPLH
SHIELD
tPHL
Fig. 9 CMR Test Circuit and Wave Forms
IF A
6
1
B
2
5
3
4
SHIELD
+
VCM = 1.5 kV
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
VCC = 30 V
1.0 μF
VO
90%
1 500 V
VCM
0V
10%
VO
(Switch A: IF = 10 mA)
VO
(Switch B: IF = 0 mA)
tr
tr
VOH
26 V
1V
VOL
Page 7 of 18
PS9331L, PS9331L2
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
DETECTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
DIODE POWER DISSIPATION
vs. AMBIENT TEMPERATURE
50
Diode Power Dissipation PD (mW)
Detector Power Dissipation PC (mW)
300
250
200
150
100
50
0
25
50
75
100
125
25
50
75
125
100
150
THRESHOLD INPUT CURRENT vs.
AMBIENT TEMPERATURE
Threshold Input Current IFLH / IFHL (mA)
Forward Current IF (mA)
10
FORWARD CURRENT vs.
FORWARD VOLTAGE
TA = 125°C
100°C
85°C
50°C
25°C
−20°C
−40°C
0.1
1.2
1.4
1.6
1.8
2.0
2.2
2.4
3
VCC = 30 V,
VEE = GND,
Vth = 5 V
IFLH
2
1
IFHL
0
−50
−25
0
25
50
75
100
125
150
Forward Voltage VF (V)
Ambient Temperature TA (°C)
OUTPUT VOLTAGE vs.
FORWARD CURRENT
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT
35
High Level Output Voltage – Supply
Voltage VOH – VCC (V)
0
VCC = 30 V,
VEE = GND
25
20
15
10
5
0
0
20
Ambient Temperature TA (°C)
1
30
30
Ambient Temperature TA (°C)
10
0.01
1.0
40
0
150
100
Output Voltage VO (V)
<R>
1
2
3
Forward Current IF (mA)
VCC = 30 V,
VEE = GND,
IF = 10 mA
−1
−2
TA = −40°C
−3
−4
TA = 25°C
TA = 125°C
−5
−6
0.0
0.5
1.0
1.5
2.0
2.5
High Level Output Current IOH (A)
Remark The graphs indicate nominal characteristics.
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
Page 8 of 18
PS9331L, PS9331L2
VCC = 30 V,
VEE = GND,
IF = 0 mA
4
TA = 25°C
2
TA = −40°C
0.0
0.5
1.0
1.5
2.0
2.5
VEE = GND, IF = 10 mA,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
tPHL
75
tPLH
50
PWD
25
20
25
30
tPHL
75
tPLH
50
PWD
25
0
6
8
10
12
14
16
175
VCC = 30 V, VEE = GND,
IF = 10 mA, Rg = 10 Ω,
f = 10 kHz, Duty cycle = 50%
150
125
100
tPHL
75
tPLH
50
PWD
25
0
0
10
30
20
40
50
Supply Voltage VCC (V)
Load Capacitance Cg (nF)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD RESISTANCE
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. AMBIENT TEMPERATURE
175
VCC = 30 V, VEE = GND,
IF = 10 mA, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
125
100
tPHL
75
tPLH
50
PWD
25
0
0
100
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD CAPACITANCE
100
150
125
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. SUPPLY VOLTAGE
125
0
15
VCC = 30 V, VEE = GND,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
150
Forward Current IF (mA)
175
150
175
Low Level Output Current IOL (A)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
0
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
TA = 125°C
25
50
75
Load Resistance Rg (Ω)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
Low Level Output Voltage VOL (V)
6
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. FORWARD CURRENT
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
LOW LEVEL OUTPUT VOLTAGE vs.
LOW LEVEL OUTPUT CURRENT
175
150
125
VCC = 30 V, VEE = GND,
IF = 10 mA,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
tPHL
100
tPLH
75
50
25
0
−50
PWD
−25
0
25
50
75
100
125
150
Ambient Temperature TA (°C)
Remark The graphs indicate nominal characteristics.
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
Page 9 of 18
PS9331L, PS9331L2
SUPPLY CURRENT vs.
AMBIENT TEMPERATURE
SUPPLY CURRENT vs.
SUPPLY VOLTAGE
2.5
2.0
High Level Supply Current ICCH (mA),
Low Level Supply Current ICCL (mA)
High Level Supply Current ICCH (mA),
Low Level Supply Current ICCL (mA)
2.5
ICCH
ICCL
1.5
1.0
VCC = 30 V,
VEE = GND,
VO = OPEN
0.5
0.0
−50
−25
0
25
50
75
2.0
ICCH (IF = 10 mA)
1.5
ICCL (IF = 0 mA)
1.0
0.5
0.0
15
100 125 150
20
30
Supply Voltage VCC (V)
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. AMBIENT TEMPERATURE
LOW LEVEL OUTPUT VOLTAGE vs.
AMBIENT TEMPERATURE
0.5
Low Level Output Voltage VOL (V)
−0.5
VCC = 30 V, VEE = GND,
IF = 10 mA, IO = –100 mA
−1.0
−1.5
−2.0
−2.5
−3.0
−50 −25
0
25
50
75
0.4
VCC = 30 V, VEE = GND,
IF = 10 mA, IO = 100 mA
0.3
0.2
0.1
0.0
−50 −25
100 125 150
25
50
75
100 125 150
LOW LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
3.0
Low Level Output Current IOL (A)
3.0
2.5
2.0
1.5
1.0
0.5
0
Ambient Temperature TA (°C)
Ambient Temperature TA (°C)
High Level Output Current IOH (A)
25
Ambient Temperature TA (°C)
0.0
High Level Output Voltage – Supply
Voltage VOH – VCC (V)
VEE = GND,
VO = OPEN
VCC = 30 V, VEE = GND,
IF = 10 mA, VCC–VO = 4 V
0.0
−50 −25
0
25
50
75
100 125 150
Ambient Temperature TA (°C)
2.5
2.0
1.5
1.0
0.5
VCC = 30 V, VEE = GND,
IF = 10 mA, VO = 2.5 V
0.0
−50 −25
0
25
50
75
100 125 150
Ambient Temperature TA (°C)
Remark The graphs indicate nominal characteristics.
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
Page 10 of 18
PS9331L, PS9331L2
OUTPUT VOLTAGE vs. SUPPLY VOLTAGE
14
Output Voltage VO (V)
12
10
8
UVLOHYS
6
4
0
0
VUVLO+
(12.3 V)
VUVLO−
(11.0 V)
2
5
10
15
20
Supply Voltage VCC – VEE (V)
Remark The graphs indicate nominal characteristics.
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
Page 11 of 18
PS9331L, PS9331L2
TAPING SPECIFICATIONS (UNIT: mm)
7.5±0.1
1.5 +0.1
–0
4.5 MAX.
10.2±0.1
4.0±0.1
16.0±0.3
2.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
1.5 +0.1
–0
0.35
8.0±0.1
4.05±0.1
5.08±0.1
Tape Direction
PS9331L-E3
Outline and Dimensions (Reel)
R 1.0
100±1.0
2.0±0.5
13.0±0.2
330±2.0
2.0±0.5
21.0±0.8
17.5±1.0
21.5±1.0
Packing: 2 000 pcs/reel
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
Page 12 of 18
PS9331L, PS9331L2
11.5±0.1
1.5 +0.1
–0
4.5 MAX.
12.0±0.1
4.0±0.1
24.0±0.3
2.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
2.0 +0.1
–0
8.0±0.1
0.35
4.05±0.1
5.08±0.1
Tape Direction
PS9331L2-E3
Outline and Dimensions (Reel)
R 1.0
100±1.0
2.0±0.5
13.0±0.2
330±2.0
2.0±0.5
21.0±0.8
25.5±1.0
29.5±1.0
Packing: 2 000 pcs/reel
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
Page 13 of 18
PS9331L, PS9331L2
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
B
C
D
A
Part Number
Lead Bending
A
B
C
D
PS9331L
lead bending type (Gull-wing)
for surface mount
9.2
1.27
0.8
2.2
PS9331L2
lead bending type (Gull-wing)
for long creepage distance (surface mount)
10.2
1.27
0.8
2.2
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
Page 14 of 18
PS9331L, PS9331L2
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of peak reflow temperature
• Time of temperature higher than 220°C
• Time to preheat temperature from 120 to 180°C
• Number of reflows
• Flux
260°C or below (package surface temperature)
10 seconds or less
60 seconds or less
120 ± 30 s
Three
Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt% is
recommended.)
Package Surface Temperature T (°C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260°C MAX.
220°C
to 60 s
180°C
120°C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
• Preheating conditions
• Number of times
• Flux
260°C or below (molten solder temperature)
10 seconds or less
120°C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output
transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
Page 15 of 18
PS9331L, PS9331L2
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. Board designing
(1) By-pass capacitor of more than 1.0 μF is used between VCC and GND near device. Also, ensure that the distance
between the leads of the photocoupler and capacitor is no more than 10 mm.
(2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close
to the input block pattern of the photocoupler.
If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT
output side might affect the photocoupler’s LED input, leading to malfunction or degradation of characteristics.
(If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to
the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the
range of the recommended operating conditions, and be sure to thoroughly evaluate operation.)
(3) Pin 2 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may
degrade the internal noise environment of the device.
Note: *1. NC: Non-Connection (No Connection).
3. Make sure the rise/fall time of the forward current is 0.5 μs or less.
4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/μs or less.
5. Avoid storage at a high temperature and high humidity.
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
Page 16 of 18
PS9331L, PS9331L2
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Climatic test class (IEC 60068-1/DIN EN 60068-1)
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.6 × UIORM., Pd < 5 pC
Spec.
Unit
40/125/21
UIORM
Upr
1 130
1 808
Vpeak
Vpeak
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 × UIORM., Pd < 5 pC
Upr
2 119
Vpeak
Highest permissible overvoltage
UTR
8 000
Vpeak
CTI
175
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1)
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11))
2
Material group (DIN EN 60664-1 VDE0110 Part 1)
III a
Storage temperature range
Tstg
–55 to +150
°C
Operating temperature range
TA
–40 to +125
°C
Ris MIN.
Ris MIN.
1012
11
10
Ω
Ω
Tsi
Isi
Psi
175
400
700
°C
mA
mW
Ris MIN.
109
Ω
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
VIO = 500 V dc at TA = Tsi
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
Page 17 of 18
PS9331L, PS9331L2
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
R08DS0111EJ0200 Rev.2.00
Jun 21, 2013
Page 18 of 18
Revision History
PS9331L, PS9331L2 Data Sheet
Rev.
Date
Page
1.00
2.00
May 24, 2013
Jun 21, 2013
−
pp.8 to 11
Description
Summary
First edition issued
Addition of TYPICAL CHARACTERISTICS
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C-1
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