To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. 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Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. “Standard”: 8. 9. 10. 11. 12. Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. “Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. Renesas Technology Home Page: http://www.renesas.com Renesas Technology Corp. Customer Support Dept. April 1, 2003 Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party. 2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corporation by various means, including the Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corporation for further details on these materials or the products contained therein. 2SH30 Silicon N Channel IGBT High Speed Power Switching ADE-208-792A(Z) 2nd. Edition May 1999 Features • High speed switching • Low on-voltage Outline TO–3P C G E 1 2 3 1. Gate 2. Collector (Flange) 3. Emitter 2SH30 Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Collector to Emitter voltage VCES 600 V Gate to Emitter voltage VGES ±20 V Collector current IC 50 A Collector peak current ic(peak) 100 A 100 W Note1 Collector dissipation PC Channel temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C Note: 1. Value at Tc = 25°C Electrical Characteristics (Ta = 25°C) Item Symbol Min Typ Max Unit Test Conditions Zero gate voltage collector current I CES — — 250 µA VCE = 600V, VGE = 0 Gate to emitter leak current I GES — — ±1 µA VGE = ± 20 V, VCE = 0 Gate to emitter cutoff voltage VGE(off) 6.0 — 8.0 V I C = 50 mA, VCE = 10V Collector to emitter saturation VCE(sat) voltage — 2.1 2.6 V I C = 50 A, VGE = 15V Input capacitance Cies — 2800 — pF VCE = 10V, VGE = 0 f = 1MHz Switching time tr — 280 — ns I C = 50 A t on — 430 — ns RL = 6 Ω tf — 300 600 ns VGS = ±15V t off — 650 1300 ns Rg = 50 Ω 2 2SH30 Main Characteristics Power vs. Temperature Derating Maximum Safe Operation Area 100 er I C (A) I C (A) Collector Current I C (A) 15 V 2 0.5 0.2 40 200 400 600 800 Collector to Emitter Voltage VCE (V) 12 V Pulse Test 11 V 10 V 30 20 9V 10 VGE = 8 V Tc = 25 °C 0 t) ) Typical Output Characteristics 50 1 ho 3 10 30 100 300 1000 Collector to Emitter Voltage VCE (V) 50 5 1s °C 25 Reverse Bias SOA 100 0.1 Ta = 25 °C 1 s( c= (T 50 100 150 200 Case Temperature Tc (°C) 10 m 10 on 0.1 0.01 20 = ati 0.3 PW Collector Current 1 0.03 0 0 Collector Current s 3 Op 40 s 10 m 80 0µ DC Channel Dissipation 120 10 30 1 Pch (W) 160 0 2 4 6 8 10 Collector to Emitter Voltage VCE (V) 3 2SH30 Collector to Emitter Saturation Voltage vs. Gate to Emitter Voltage Typical Transfer Characteristics 40 30 Tc = 75°C 20 25°C 10 –25°C 0 4 8 12 Collector to Emitter Saturation Voltage V CE(sat) (V) Gate to Emitter Voltage 4 Collector to Emitter Saturation Voltage V CE(sat) (V) V CE = 10 V Pulse Test 16 5 3 I C = 50 A 2 25 A 40 A 1 V GE (V) Collecot to Emitter Saturation Voltage vs. Collector Current 10 Pulse Test 4 0 20 4 8 12 Gate to Emitter Voltage 16 20 V GE (V) Typical Capacitance vs. Collecotor to Emitter Voltage 10000 3000 5 Capacitance C (pF) Collector Current I C (A) 50 2 –25°C 1 25°C 0.5 Tc = 75°C 0.2 V GE = 15 V Pulse Test 0.1 0.1 1 3 0.3 10 30 Collector Current I C (A) 300 100 Coes 30 Cres 10 3 1 100 Cies 1000 VGE = 0 f = 1 MHz 0 10 20 30 40 50 Collector to Emitter Voltage V CE (V) 2SH30 Switching Characteristics 1000 300 16 12 VGE I C = 50 A 200 V CC = 400 V 300 V 200 V 100 4 VCE 0 8 40 80 120 160 Gate Charge Qg (nc) Switching Time t (ns) V CC = 200 V 300 V 400 V 400 V GE (V) 20 Gate to Emitter Voltage Collector to Emitter Voltage V CE (V) Dynamic Input Characteristics 500 500 t d(off) 200 tf 100 50 20 0 200 10 1 Switching Characteristics 10 1 50 5 2 10 20 Collector Current I C (A) 100 Switching Characteristics tf tr t d(on) I C = 50A, R L= 6 Ω V GE = ±15 V 100 300 500 3 10 30 Gate Resistance Rg ( Ω ) 500 Switching Time t (ns) Switching Time t (ns) 1000 30 V CC = 300V, V GE = ±15 V Rg = 50 Ω , Ta = 25°C tf t d(off) 100 tr 1000 5000 3000 300 t d(on) 200 100 t d(off) tr t d(on) 50 20 10 25 I C = 50A, RL = 6 Ω V GE = ±15 V, Rg = 50 Ω 50 75 100 Case Temperature Tc (°C) 125 5 2SH30 Normalized Transient Thermal Impedance vs. Pulse Width Normalized Transient Thermal Impedance γ s (t) 3 Tc = 25°C 1 D=1 0.5 0.3 0.2 0.1 θ ch – c(t) = γ s (t) • θ ch – c θ ch – c = 1.25 °C/W, Tc = 25 °C 0.1 0.05 PDM 0.02 1 lse 0.0 t pu ho 1s 0.03 0.01 10 µ D= PW T PW T 100 µ 1m 10 m 100 m Pulse Width PW (S) Switching Time Test Circuit 1 10 Waveform 90% 10% 0 Vin Ic Monitor 90% V CE Vin Monitor VCE Monitor Rg 10% RL td(on) tr ton D.U.T. 90% V CC Vin ± 15 V Ic 10% td(off) tf toff 6 2SH30 Package Dimensions Unit: mm 5.0 ± 0.3 5.0 max 0.3 typ 1.5 typ 20.1 max 2.0 typ 0.5 typ 16.0 max 14.9 ± 0.2 1.0 typ φ 3.2 ± 0.2 1.4 max 2.0 typ 1.0 ± 0.2 3.6 typ 5.45 ± 0.2 18.0 ± 0.5 1.6 typ 2.8 typ 0.6 ± 0.2 0.9 typ 1.0 typ 5.45 ± 0.2 Hitachi Code EIAJ JEDEC TO–3P SC–65 — 7 2SH30 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Straße 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan. 8