Reliability Qualification Report

Reliability Qualification Report
Voltage Controlled Oscillators (VCOs)
Phase-Locked Loops (PLL)
Products Qualified
All VCO Modules in T Packages
All VCO Modules in U Packages
All VCO Modules in K Packages
All VCO Modules in W Packages
All VCO Modules in X Packages
All PLL Modules in PLL250 Packages
All PLL Modules in PLL300 Packages
All PLL Modules in PLL350 Packages
All PLL Modules in PLL400 Packages
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for
inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of this information, and all such information shall
be entirely at the user’s own risk. Data subject to change.
303 S. Technology Ct, Broomfield CO, 80021
Phone: (800) SMI-MMIC
http://www.sirenza.com
Document RQR-104598 Rev. C
1
VCO & PLL Qualification Report
I. Introduction
Sirenza Microdevices’ Voltage-Controlled Oscillators are optimized for low phase noise and flat power and
modulation sensitivity across the frequency band. They provide excellent phase noise in a low cost
solution. The surface mount package is designed for ease of assembly on standard pick and place SMT
equipment.
Sirenza Microdevices’ Phase-Locked Loops are ideal for synthesizer applications for large infrastructure
programs. This integrated solution has low phase noise, fast settling time, and excellent return loss.
These PLLs are assembled in a surface mount package.
II. Qualification Overview
Sirenza recognizes that the parts, processes, design rules and manufacturing techniques employed in the
design reflect in the quality and reliability of the product. Since Sirenza’s VCOs and PLLs are
manufactured at the same site and uses the same major elements (processes and components), they are
considered as one qualification family.
III. Qualification Methodology
This qualification was executed using a T-package voltage controlled oscillator and a 350 Outline package
phase-locked loop. The Sirenza Microdevices qualification process consists of a series of tests designed to
stress various potential failure mechanisms. This testing is performed to ensure that Sirenza Microdevices
products are robust against potential failure modes that could arise from the various package failure
mechanisms stressed. The qualification testing is based on JEDEC and Mil-Std test methods common to
the semiconductor industry. Qualification testing include extreme hot and cold environments (temperature
cycling), vibration, and mechanical shock, and humidity conditions.
IV. Qualification By Similarity
All products in a qualification family can be qualified by similarity provided that one family member passes
qualification testing. Sirenza’s VCO modules are also packaged in U, K, W, and X package styles that are
similar to the T package style. Sirenza’s PLL modules are also packaged in PLL250, PLL300, and PLL400
package styles that are similar to the PLL350 package. No new potential failure mechanisms are
introduced when using the different package styles. Therefore, the following are qualified by similarity:
All VCO Modules in T Packages
All VCO Modules in U Packages
All VCO Modules in K Packages
All VCO Modules in W Packages
All VCO Modules in X Packages
All PLL Modules in PLL250 Packages
All PLL Modules in PLL300 Packages
All PLL Modules in PLL350 Packages
All PLL Modules in PLL400 Packages
303 S. Technology Ct, Broomfield CO, 80021
Phone: (800) SMI-MMIC
http://www.sirenza.com
Document RQR-104598 Rev. C
2
V. Qualification Test Results
Group 1.0 Sequential Stress testing (Qualification Vehicle: VCO)
Test Name
Test Condition/
Standard
Sample Size
Results
High Temperature
Bake
125°C
24 hours
Unbiased
10
Pass
Temperature-Humidity
Soak
85°C/ 85%RH
168 hours
10
Pass
Reflow
3X @ 230°C
10
Temperature-Humidity
Operating
85°C/ 85%RH
1000 hours
Biased
10
Temperature Cycle
-40°C to +85°C
30 cycles
10
Pass
Pass
Pass
Group 2.0 Sequential Stress testing (Qualification Vehicle: VCO)
Test Name
Test Condition/
Standard
Sample Size
Results
Aging
85°C
21 days
Unbiased
10
Pass
Solder Heat
Resistance
2X at 225°C
10
Pass
Reflow to board
63/37 solder
3X @ 230°C
10
Shear Test
1000 grams
30 sec
10
303 S. Technology Ct, Broomfield CO, 80021
Phone: (800) SMI-MMIC
Pass
Pass
http://www.sirenza.com
Document RQR-104598 Rev. C
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V. Qualification Test Results (con’t)
Group 3.0 Sequential Stress testing (Qualification Vehicle: VCO)
Test Name
Test Condition/
Standard
Sample Size
Results
Mechanical Shock
50G’s, 11mS
10
Pass
Random Vibration
10-3000Hz
6G
15min per axis
10
Pass
Group 4.0 Sequential Stress testing (Qualification Vehicle: VCO)
Test Name
Test Condition/
Standard
Sample Size
Results
Coplanarity
Maximum 0.05mm
10
Pass
ESD
HBM
2000V
10
Pass
Group 5.0 High Temperature Operating Life (Qualification Vehicle: VCO)
Test Condition
Test Standard
Tamb=85°C
Biased
2000 hours
303 S. Technology Ct, Broomfield CO, 80021
-
Sample Size
Results
50
Pass
Phone: (800) SMI-MMIC
http://www.sirenza.com
Document RQR-104598 Rev. C
6
V. Qualification Test Results (con’t)
Group 1.0 Sequential Stress testing (Qualification Vehicle: PLL)
Test Condition
Test Standard
Sample Size
Results
Mechanical Shock (50G’s,
11mS)
Mil-Std 202, Condition A,
Method 213B
25
Pass
Solderability
Re-flow to evaluation board
25
Pass
Cold Resistance
(-10°C, 96hrs)
Biased, -10°C, 96hrs
25
Pass
Thermal Shock
-35°C to +85°C
30’ dwell
30 cycles
25
Pass
Random Vibration
10-2000Hz
6G
15min per axis
25
Pass
Temperature-Humidity
Soak
85°C/ 85%RH
500 hours
25
Pass
Group 2.0 Sequential Stress testing (Qualification vehicle: PLL)
Test Condition
Test Standard
Sample Size
Results
Aging
21 days @ 85°C
25
Pass
Resistance to
Solder Heat
Re-flow 2x, 230°C peak
25
Pass
Solderability
Re-flow to evaluation board
25
Pass
Shear Test
Non-Destruct (1000 grams/30
sec, applied to cover
orthogonally)
25
Pass
303 S. Technology Ct, Broomfield CO, 80021
Phone: (800) SMI-MMIC
http://www.sirenza.com
Document RQR-104598 Rev. C
5