Reliability Qualification Report Voltage Controlled Oscillators (VCOs) Phase-Locked Loops (PLL) Products Qualified All VCO Modules in T Packages All VCO Modules in U Packages All VCO Modules in K Packages All VCO Modules in W Packages All VCO Modules in X Packages All PLL Modules in PLL250 Packages All PLL Modules in PLL300 Packages All PLL Modules in PLL350 Packages All PLL Modules in PLL400 Packages The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the user’s own risk. Data subject to change. 303 S. Technology Ct, Broomfield CO, 80021 Phone: (800) SMI-MMIC http://www.sirenza.com Document RQR-104598 Rev. C 1 VCO & PLL Qualification Report I. Introduction Sirenza Microdevices’ Voltage-Controlled Oscillators are optimized for low phase noise and flat power and modulation sensitivity across the frequency band. They provide excellent phase noise in a low cost solution. The surface mount package is designed for ease of assembly on standard pick and place SMT equipment. Sirenza Microdevices’ Phase-Locked Loops are ideal for synthesizer applications for large infrastructure programs. This integrated solution has low phase noise, fast settling time, and excellent return loss. These PLLs are assembled in a surface mount package. II. Qualification Overview Sirenza recognizes that the parts, processes, design rules and manufacturing techniques employed in the design reflect in the quality and reliability of the product. Since Sirenza’s VCOs and PLLs are manufactured at the same site and uses the same major elements (processes and components), they are considered as one qualification family. III. Qualification Methodology This qualification was executed using a T-package voltage controlled oscillator and a 350 Outline package phase-locked loop. The Sirenza Microdevices qualification process consists of a series of tests designed to stress various potential failure mechanisms. This testing is performed to ensure that Sirenza Microdevices products are robust against potential failure modes that could arise from the various package failure mechanisms stressed. The qualification testing is based on JEDEC and Mil-Std test methods common to the semiconductor industry. Qualification testing include extreme hot and cold environments (temperature cycling), vibration, and mechanical shock, and humidity conditions. IV. Qualification By Similarity All products in a qualification family can be qualified by similarity provided that one family member passes qualification testing. Sirenza’s VCO modules are also packaged in U, K, W, and X package styles that are similar to the T package style. Sirenza’s PLL modules are also packaged in PLL250, PLL300, and PLL400 package styles that are similar to the PLL350 package. No new potential failure mechanisms are introduced when using the different package styles. Therefore, the following are qualified by similarity: All VCO Modules in T Packages All VCO Modules in U Packages All VCO Modules in K Packages All VCO Modules in W Packages All VCO Modules in X Packages All PLL Modules in PLL250 Packages All PLL Modules in PLL300 Packages All PLL Modules in PLL350 Packages All PLL Modules in PLL400 Packages 303 S. Technology Ct, Broomfield CO, 80021 Phone: (800) SMI-MMIC http://www.sirenza.com Document RQR-104598 Rev. C 2 V. Qualification Test Results Group 1.0 Sequential Stress testing (Qualification Vehicle: VCO) Test Name Test Condition/ Standard Sample Size Results High Temperature Bake 125°C 24 hours Unbiased 10 Pass Temperature-Humidity Soak 85°C/ 85%RH 168 hours 10 Pass Reflow 3X @ 230°C 10 Temperature-Humidity Operating 85°C/ 85%RH 1000 hours Biased 10 Temperature Cycle -40°C to +85°C 30 cycles 10 Pass Pass Pass Group 2.0 Sequential Stress testing (Qualification Vehicle: VCO) Test Name Test Condition/ Standard Sample Size Results Aging 85°C 21 days Unbiased 10 Pass Solder Heat Resistance 2X at 225°C 10 Pass Reflow to board 63/37 solder 3X @ 230°C 10 Shear Test 1000 grams 30 sec 10 303 S. Technology Ct, Broomfield CO, 80021 Phone: (800) SMI-MMIC Pass Pass http://www.sirenza.com Document RQR-104598 Rev. C 5 V. Qualification Test Results (con’t) Group 3.0 Sequential Stress testing (Qualification Vehicle: VCO) Test Name Test Condition/ Standard Sample Size Results Mechanical Shock 50G’s, 11mS 10 Pass Random Vibration 10-3000Hz 6G 15min per axis 10 Pass Group 4.0 Sequential Stress testing (Qualification Vehicle: VCO) Test Name Test Condition/ Standard Sample Size Results Coplanarity Maximum 0.05mm 10 Pass ESD HBM 2000V 10 Pass Group 5.0 High Temperature Operating Life (Qualification Vehicle: VCO) Test Condition Test Standard Tamb=85°C Biased 2000 hours 303 S. Technology Ct, Broomfield CO, 80021 - Sample Size Results 50 Pass Phone: (800) SMI-MMIC http://www.sirenza.com Document RQR-104598 Rev. C 6 V. Qualification Test Results (con’t) Group 1.0 Sequential Stress testing (Qualification Vehicle: PLL) Test Condition Test Standard Sample Size Results Mechanical Shock (50G’s, 11mS) Mil-Std 202, Condition A, Method 213B 25 Pass Solderability Re-flow to evaluation board 25 Pass Cold Resistance (-10°C, 96hrs) Biased, -10°C, 96hrs 25 Pass Thermal Shock -35°C to +85°C 30’ dwell 30 cycles 25 Pass Random Vibration 10-2000Hz 6G 15min per axis 25 Pass Temperature-Humidity Soak 85°C/ 85%RH 500 hours 25 Pass Group 2.0 Sequential Stress testing (Qualification vehicle: PLL) Test Condition Test Standard Sample Size Results Aging 21 days @ 85°C 25 Pass Resistance to Solder Heat Re-flow 2x, 230°C peak 25 Pass Solderability Re-flow to evaluation board 25 Pass Shear Test Non-Destruct (1000 grams/30 sec, applied to cover orthogonally) 25 Pass 303 S. Technology Ct, Broomfield CO, 80021 Phone: (800) SMI-MMIC http://www.sirenza.com Document RQR-104598 Rev. C 5