产品规格书 SPECIFICATION

规格书编号
SPEC NO :
产品 规 格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW FILTER
MODEL NO 型 号:
HDF4552
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
D A T E 日 期:
2008-1-30
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子有限公司
Shoulder Electronics Limited
www.shoulder.cn
Tel:0755-82916880 Fax:0755-82916881
E-mail:[email protected]
Page 1 of 11
SAW FILTER
HDF4552
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History Record
更改日期
Date
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规格书编号
Spec. No.
产品型号
Part No.
客户产品型号
Customer No.
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更改内容描述
Modify Content
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备注
Remark
Page 2 of 11
SAW FILTER
HDF4552
1.Features
_ RF bandpass filter for CDMA450 Tx. Part
_ Usable bandwidth 5MHz (452.5MHz ~ 457.5 MHz)
_ High attenuation
_ No matching 50Ω single-ended operation
_ Ceramic Surface Mounted Device Package ( 3.8 mm *3.8 mm )
2. Maximum Ratings
Parameter
Operating Temperature Range
Storage Temperature Range
DC Voltage VDC
Power Handling Capability
Rating
-30~85
-40~85
10
27
Unit
°C
°C
V
dBm
2-1-1Electrical characteristics( T=25°C)
Minimum
Center Frequency ( F0 )
Insertion Loss (F0 +/- 2.5 MHz)
Amplitude Ripple (F0 +/- 2.5 MHz)
MHz
dB
dB
VSWR (F0 +/- 2.5 MHz)
Relative Attenuation
0.3 MHz ~ 350.0 MHz
350.0 MHz ~ 441.0 MHz
462.5 MHz ~ 467.5 MHz
467.5 MHz ~ 1200 MHz
1200 MHz ~ 2000 MHz
Input/Output Impedance
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-
Typical
455.0
Maximum
-
-
2.0
2.8
-
0.8
1.2
-
1.4
2.0
-
dB
25
25
40
25
20
30
30
30
-
Ω
-
50
E-mail:[email protected]
-
Page 3 of 11
SAW FILTER
HDF4552
2-1-2.Electrical characteristics( T=+70°C~-20°C)
Minimum
Center Frequency ( F0 )
Insertion Loss (F0 +/- 2.5 MHz)
Amplitude Ripple (F0 +/- 2.5 MHz)
MHz
dB
dB
VSWR (F0 +/- 2.5 MHz)
Relative Attenuation
0.3 MHz ~ 350.0 MHz
350.0 MHz ~ 441.0 MHz
462.5 MHz ~ 467.5 MHz
467.5 MHz ~ 1200 MHz
1200 MHz ~ 2000 MHz
Input/Output Impedance
-
Typical
455.0
Maximum
-
-
2.0
3.5
-
0.8
1.2
-
1.4
2.0
-
dB
Ω
25
25
30
25
20
-
30
30
30
50
-
2-2.Typical frequency response
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Page 4 of 11
SAW FILTER
HDF4552
2-3 Input / Output VSWR Charts
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Page 5 of 11
SAW FILTER
HDF4552
2-4 Input / Output Smith Charts
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Page 6 of 11
SAW FILTER
HDF4552
3. TEST CIRCUIT
4. DIMENSION
5.Environmental Performance Characteristics
Item
High
temperature
Low
temperature
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Condition
The specimen shall be store at a temperature of
85±2℃ for 96±4h. Then it shall be subjected to
standard atmospheric conditions for 1h, after
which measurement shall be made within 1h.
The specimen shall be store at a temperature of
-30±3℃ for 96±4h. Then it shall be subjected to
standard atmospheric conditions for 1h, after
which measurement shall be made within 1h.
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Specifications
Mechanical
characteristics and
specifications
in
electrical
Page 7 of 11
SAW FILTER
Humidity
Thermal
shock
Resistance to
Soldering
heat
HDF4552
The specimen shall be store at a temperature of
40±2℃ with relative humidity of 90% to 96%
for 96±4h. Then it shall be subjected to standard
atmospheric conditions for 1h, after which
measurement shall be made within 1h.
The specimen shall be subjected to 8 continuous
cycles each as shown below. Then it shall be
subjected to standard atmospheric conditions for
1h, after which measurement shall be made
within 1h.
Temperature
Duration
1
+25℃=>-40℃
0.5h
2
-40℃
4h
3
-40℃=>+85℃
2h
4
+85℃
4h
5
+85℃=>+25℃
0.5h
6
+25℃
1h
Reflow soldering method
Peak: 255 ±5 ℃, 220 ±5℃, 40s
At electrode temperature of the specimen.
characteristics shall
be satisfied. There
shall
be
no
excessive change in
appearance.
The specimen shall be passed through the reflow
furnace with the condition shown in the above
profile for 1 time.
The specimen shall be stored at standard
atmospheric conditions for 1h, after which the
measurement shall be made. Test board shall be
1.6 mm thick. Base material shall be glass fabric
base epoxy resin.
Solder ability Immerse the pins melt solder at 260℃+5/-0℃ More then 95% of
for 5 sec.
total area of the
pins should be
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Page 8 of 11
SAW FILTER
HDF4552
covered with solder
6.Mechanical Test
Items
Vibration
Drop
Lead pull
Lead bend
Conditions
600-3300rpm amplitude 1.5mm
3 directions 2 H each
On maple plate from 1m high 3 times
Pull with 1kg force for 30 seconds
90o bending with 500g weigh 2 times
Specifications
There shall be no
damage.
7. REMARK
7.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
7.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
7.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
8. Packing
8.1 Dimensions
(1) Carrier Tape: Figure 1
(2) Reel: Figure 2
(3) The product shall be packed properly not to be damaged during transportation and storage.
8.2 Reeling Quantity
1000 pcs/reel 7’’
3000 pcs/reel 13’’
8.3 Taping Structure
(1) The tape shall be wound around the reel in the direction shown below.
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Page 9 of 11
SAW FILTER
HDF4552
(2) Label
Device Name
User Product Name
Quantity
Lot No.
(3) Leader part and vacant position specifications.
9. TAPE SPECIFICATIONS
9.1 Tensile Strength of Carrier Tape: 4.4N/mm width
9.2 Top Cover Tape Adhesion (See the below figure)
(1) pull off angle: 0~15º
(2) speed: 300mm/min.
(3) force: 20~70g
[Figure 1] Carrier Tape Dimensions
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Page 10 of 11
SAW FILTER
HDF4552
[Unit:mm]
W
F
E
P0
P1
P2
D0
D1
t1
t2
A
B
12.00
±0.30
5.50
±0.10
1.75
±0.10
4.00
±0.10
8.00
±0.10
2.00
±0.10
Ø1.50
Ø1.0
±0.25
0.25
±0.05
1.65
±0.10
4.04
±0.10
4.10
±0.10
[Figure 2]
[Unit:mm]
A
B
C
D
E
W
t
r
Ø330
±1.0
Ø100
±0.5
Ø13
±0.5
Ø21
±0.8
2
±0.5
13
±0.3
3
max.
1.0
max.
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Page 11 of 11