SHOULDER ELECTRONICS LIMITED CERAMIC RESONATOR Data Sheet PRODUCT 产 品: CERAMIC MODEL NO 型 号: ZTTCV…MT PREPARED 编 制: Fengyu CHECKED 审 核: York APPROVED 批 准: Lijiating DATE Http://www.shoulder.cn 日 期: RESONATOR 2008-01-25 Page: 1 SHOULDER ELECTRONICS LIMITED 1 SCOPE This specification shall cover the characteristics of the ceramic resonator 8.00-13.00MHZ. 2 PART NO. PART NUMBER CUSTOMER PART NO SPECIFICATION NO ZTTCV…MT 3 OUTLINE DRAWING AND DIMENSIONS 3.1 Appearance: No visible damage and dirt. 3.2 Except the chip(ceramic element, ceramic base, capacitance slice), the materials don’t contain lead. 12.0 M 0.7±0.2 3.1±0.2 3.3 Dimensions 0.7±0.2 0.9±0.2 1.3±0.2 1.5±0.2 3.7±0.2 4 RATING AND ELECTRICAL SPECIFICATIONS 4.1 RATING Items Content Withstanding Voltage (V) 50 (DC，1min) Insulation Resistance Ri,（MΩ）min. 100 （100V，1min） Operating Temperature Range (℃) -20～+80 Storage Temperature Range (℃) -55～+85 Http://www.shoulder.cn Page: 2 SHOULDER ELECTRONICS LIMITED 4.2 ELECTRICAL SPECIFICATIONS Oscillation Frequency Fosc（MHz） 8.00-13.00 Frequency Accuracy （%） ±0.5 Resonant Impedance Ro（Ω）max. 30 ±0.3 （Oscillation Frequency drift，-25℃～+85℃） Temperature Coefficient of Oscillation Frequency （%） max. 6V DC Rating Voltage UR（V）max. 15V p-p Aging Rate （%）max. ±0.3 （For Ten Years） 5 MEASUREMENT 5.1 Measurement Conditions Parts shall be measured under a condition ( Temp.：20℃±15℃,Humidity ：65%±20% R.H.) unless the standard condition(Temp.：25℃±3℃,Humidity ：65%±5% R.H.) is regulated to measure. 5.2 Test Circuit IC: 1/6TC4069UBP×2 X: Ceramic Resonator 6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS No. Item 6.1 Humidity 6.2 Vibration 6.3 Mechanical Shock Http://www.shoulder.cn Condition of Test Keep the resonator at 40℃±2℃ and 90%-95% RH for 96h±4h. Then Release the resonator into the room Condition for 1h prior to the Measurement. Subject the resonator to vibration for 2h each in x、y and z axis With the amplitude of 1.5mm, the frequency shall be varied uniformly between the limits of 10 Hz—55Hz. Drop the resonator randomly onto a wooden floor from the height of 100cm 3 times. Page: 3 Performance Requirements It shall fulfill the specifications in Table 1. It shall fulfill the specifications in Table 1. It shall fulfill the SHOULDER ELECTRONICS LIMITED specifications in Table 1. 6.4 Soldering Test 6.5 Solder Ability 6.6 High Temperature Exposure 6.7 Low Temperature Exposure Passed through the re-flow oven under the following condition and left at room temperature for 1h before measurement. Temperature at the surface of the Time substrate Preheat 150℃±5℃ 60s±10 s Peak 260℃±5℃ 10s±3 s It shall fulfill the specifications in Table 1. The terminals shall be at Dipped in 245℃±5℃ solder bath for 3s±0.5 s least 95% with rosin flux (25wt% ethanol solution.) covered by solder. It shall fulfill Subject the resonator to 80℃±5℃ for 96s, the then release the resonator into the room specifications conditions for 1h prior to the measurement. in Table 1. It shall fulfill Subject the resonator to –20℃±5℃ for 96h, the then release the resonator into the room specifications conditions for 1h prior to the measurement. in Table 1. （To be continued） 6 PHYSICAL AND ENVIRONMENAL CHARACTERISICS No. 6.8 6.9 Item Performance Requirements Condition of Test Temperature Cycling Subject the resonator to -40℃ for 30 min. followed by a high temperature of 85℃ for 30 min. It shall fulfill the Cycling shall be repeated 5 times with a specifications in transfer time of 15s. At the room Table 1. temperature for 1h prior to the measurement. Board Bending Mount a glass-epoxy board (Width=40mm,thickness=1.6mm),then bend it to 1mm displacement and keep it for 5s. (See the following figure) Http://www.shoulder.cn Page: 4 Mechanical damage such as breaks shall not occur. SHOULDER ELECTRONICS LIMITED PRESS PRESS HEAD SUPPORT BAR Table 1 Item Oscillation Frequency Change △Fosc/Fosc (%) max Resonant Impedance (Ω) max Specification after test ±0.3 40 The limits in the above table are referenced to the initial measurements. 7 RECOMMENDED LAND PATTERN AND REFLOW SOLDERING STANDARD CONDITIONS 7.1Recommended land pattern 4.1±0.2 1.5± 0.2 1.5± 0.2 ± 0.2 0.7± 0.2 1.0± 0.2 Http://www.shoulder.cn Page: 5 UNIT:mm SHOULDER ELECTRONICS LIMITED 7.2Recommended reflow soldering standard conditions Tem.(℃) within 10s 250 255℃ Peak:260℃ Pre-heating within 80-120s. 8 within 20-40s PACKAGE To protect the products in storage and transportation，it is necessary to pack them(outer and inner package).On paper pack, the following requirements are requested. 8.1 Dimensions and Mark At the end of package, the warning (moisture proof, upward put) should be stick to it. Dimensions and Mark (see below) ⑥ ③ ⑤ ④ ② ① ⑦ ⑥ Belt ① Pack age ③ Label ② Certificate ④ Tyi ng ⑦ Inner Box of Approval ⑤ Adhesiv e tape Http://www.shoulder.cn Page: 6 SHOULDER ELECTRONICS LIMITED 8.2 Section of package Package is made of corrugated paper with thickness of 0.8cm.Package has 12 inner boxes, each box has 5 reels (each reel for plastic bag). 8.3 Quantity of package Per plastic reel 1000 pieces of piezoelectric ceramic part Per inner box 5 reels Per package 12 inner boxes (60000 pieces of piezoelectric ceramic part) 8.4Reel φ max 8.5 Packing Method Sketch Map Blank Pocket 20 Pitches Leader 200mm Max Blank Pocket 20 Pitches Loaded Pocket 8.6Test Condition Of Peeling Strength P Streng eeling ① 70g th 20- 10° Max ② ① Top Tape ② Carrier Tape Http://www.shoulder.cn Page: 7 SHOULDER ELECTRONICS LIMITED 9 OTHER 9.1 Caution of use 9.1.1 Do not use this product with bend. Please don’t apply excess mechanical stress to the component and terminals at soldering. 9.1.2 The component may be damaged when an excess stress will be applied. 9.1.3 This specification mentions the quality of the component as a single unit. Please insure the component is thoroughly evaluated in your application circuit. 9.2 Notice 9.2.1 Please return one of this specification after your signature of acceptance. 9.2.2 When something gets doubtful with this specifications, we shall jointly work to get an agreement. Http://www.shoulder.cn Page: 8 SHOULDER ELECTRONICS LIMITED