CERAMIC RESONATOR Data Sheet

SHOULDER ELECTRONICS LIMITED
CERAMIC RESONATOR Data Sheet
PRODUCT 产 品:
CERAMIC
MODEL NO 型 号:
ZTACV…MX
PREPARED 编 制:
Fengyu
CHECKED 审 核:
York
APPROVED 批 准:
Lijiating
DATE
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日 期:
RESONATOR
2008-01-25
Page: 1
SHOULDER ELECTRONICS LIMITED
1 SCOPE
This specification shall cover the characteristics of the ceramic resonator 16.00-50.00MHZ.
2 PART NO.
PART NUMBER
CUSTOMER PART NO
SPECIFICATION NO
ZTACV…MX
3 OUTLINE DRAWING AND STRUCTURE
3.1 Appearance
No visible damage and dirt.
3.2 Except the chip(ceramic element, ceramic base, capacitance slice), the materials don’t
contain lead.
0.7±0.2
3.1±0.2
25.0 *
3.3 Dimensions
P
0.7±0.2
1.2±0.2
3.0±0.2
3.7±0.2
① INPUT
② OUTPUT
*:EIAJ MONTHLY CODE
4 RATING AND ELECTRICAL SPECIFICATIONS:
4.1 RATING
Items
Content
Withstanding Voltage (V)
50 (DC,1min)
Insulation Resistance Ri,(MΩ)min.
100 (100V,1min)
Operating Temperature Range (℃)
-25~+85
Storage Temperature Range (℃)
-55~+85
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4.2 ELECTRICAL SPECIFICATIONS
Items
Oscillation Frequency Fosc(MHz)
Frequency Accuracy (%)
Resonant Impedance Ro(Ω) max.
Content
25.000
±0.5
40
±0.3
(Oscillation Frequency drift,
-25℃~+85℃)
6V DC
15V p-p
Temperature Coefficient of Oscillation
Frequency (%) max.
Rating Voltage
UR(V)max.
Aging Rate (%) max.
±0.2(For Ten Years)
5 TEST
5.1 Test Conditions
Parts shall be tested under a condition (Temperature:+20℃±15℃,Humidity:
65%±20%R.H.)unless the standard condition(Temperature:+25℃±3℃,Humidity
:65%±5% R.H.) is regulated to test.
5.2 Test Circuit:
IC: 1/6 TC74HCU04
X: Ceramic Resonator
C1,C2: 15pF
6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
No
Item
Condition of Test
6.1
Humidity
Keep the resonator at 40℃±2℃ and 90%-95%
RH for 96h±4h. Then Release the resonator
into the room Condition for 1h prior to the
Measurement.
6.2
High
Temperature
Exposure
Subject the resonator to 85℃±5℃ for 96s,
then release the resonator into the room
conditions for 1h prior to the measurement.
6.3
Low
Temperature
Exposure
Subject the resonator to -25℃±5℃ for 96h,
then release the resonator into the room
conditions for 1h prior to the measurement.
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Performance
Requirements
It shall fulfill
the
specifications
in Table 1.
It shall fulfill
the
specifications
in Table 1.
It shall fulfill
the
specifications
SHOULDER ELECTRONICS LIMITED
in Table 1.
6.4
Soldering
Test
6.5
Solder
Ability
6.6
Vibration
6.7
Mechanical
Shock
Passed through the re-flow oven under the
following condition and left at room
temperature for 1h before measurement.
It shall fulfill
Temperature at the surface of the
Time
the
substrate
specifications
Preheat 150℃±5℃
80s-120 s
in Table 1.
≥230℃
20 s -40s
Solder≥250℃
ing
10s max
(Peak:260℃)
The terminals
shall be at
Dipped in 245℃±5℃ solder bath for 3s±0.5 s
least
95%
with rosin flux (25wt% ethanol solution.)
covered
by
solder.
Subject the resonator to vibration for 2h each in It shall fulfill
x、y and z axis With the amplitude of 1.5mm, the
the frequency shall be varied uniformly specifications
between the limits of 10 Hz—55Hz.
in Table 1.
It shall fulfill
Drop the resonator randomly onto a wooden the
floor from the height of 100cm 3 times.
specifications
in Table 1.
(To be continued)
6 PHYSICAL AND ENVIRONMENAL CHARACTERISICS
No
Item
Condition of Test
6.8
Temperature
Cycling
6.9
Board
Bending
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Subject the resonator to -40℃ for 30
min. followed by a high temperature of
85℃ for 30 min.
Cycling shall be repeated 5 times with a
transfer time of 15s. At the room
temperature for 1h prior to the
measurement.
Mount
a
glass-epoxy
board
(Width=40mm,thickness=1.6mm),then
bend it to 1mm displacement and keep it
for 5s. (See the following figure)
Page: 4
Performance
Requirements
It shall fulfill the
specifications
in
Table 1.
Mechanical damage
such as breaks shall
not occur.
SHOULDER ELECTRONICS LIMITED
PRESS
PRESS HEAD
SUPPORT BAR
Table 1
Item
Specification after test
Oscillation Frequency Change |△F/Fosc|
Resonant Impedance (Ω) max
≤0.3%
40
The limits in the above table are referenced to the initial measurements.
7 RECOMMENDED LAND PATTERN AND REFLOW SOLDERING STANDARD
CONDITIONS
7.1Recommended land pattern
T1
T2
W
3.0±0.2
0.7±0.2
4.1±0.2
7.2Recommended reflow soldering standard conditions
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SHOULDER ELECTRONICS LIMITED
Tem.(℃)
within 10s
250 255℃
Peak:260℃
Pre-heating
within
80-120s.
8
within
20-40s
PACKAGE
To protect the products in storage and transportation,it is necessary to pack them(outer
and inner package).On paper pack, the following requirements are requested.
8.1 Dimensions and Mark
At the end of package, the warning (moisture proof, upward put) should be stick to it.
Dimensions and Mark (see below)
⑥
③
⑤
④
②
①
⑦
⑥ Belt
① Pack age
③ Label
② Certificate ④ Tyi ng
⑦ Inner Box
of Approval ⑤ Adhesiv e tape
8.2 Section of package
Package is made of corrugated paper with thickness of 0.8cm.Package has 12 inner
boxes, each box has 5 reels (each reel for plastic bag).
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SHOULDER ELECTRONICS LIMITED
8.3 Quantity of package
Per plastic reel
1000 pieces of piezoelectric ceramic part
Per inner box
5 reels
Per package
12 inner boxes
(60000 pieces of
piezoelectric ceramic part)
8.4Reel
φ
max
8.5 Packing Method Sketch Map
Blank Pocket
20 Pitches
Leader
200mm Max
Blank Pocket
20 Pitches
Loaded Pocket
8.6Test Condition Of Peeling Strength
Strengt
Peeling
①
g
h 20-70
10° Max
②
①
Top Tape
② Carrier Tape
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SHOULDER ELECTRONICS LIMITED
9 EIAJ Monthly Code
2003 / 2005 / 2007 / 2009
MONTH
CODE
JAN
A
FEB
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MAR
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APR
D
MAY
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JUN
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SEP
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OCT
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NOV
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DEC
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2004 / 2006 / 2008 / 2010
MONTH
CODE
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JUL
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OCT
X
NOV
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DEC
Z
10 OTHER
10.1 Caution of use
10.1.1 Do not use this product with bend. Please don’t apply excess mechanical stress to
the
component.
10.1.2 The component may be damaged when an excess stress will be applied.
10.1.3 This specification mentions the quality of the component as a single unit. Please
insure the component is thoroughly evaluated in your application circuit.
10.2 Notice
10.2.1 Please return one of this specification after your signature of acceptance.
10.2.2 When something gets doubtful with this specifications, we shall jointly work to get
an agreement.
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