产品规格书SPECIFICATION

规格书编号 :
SPEC NO :
产品 规 格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW FILTER
MODEL NO 型 号:
HDBF07016A24 SMD-24
PREPARED 编 制:
俞虹
CHECKED 审 核:
APPROVED 批 准:
倪山林
D A T E 日 期:
邓攀
2010-12-30
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子有限公司
Shoulder Electronics Limited
www.shoulder.cn
Tel:0755-82916880 Fax:0755-82916881
E-mail:[email protected]
Page 1 of 6
SAW FILTER
HDBF07016A24
SMD-24
更改历史记录
History Record
更改日期
Date
2010-12-30
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规格书编号
Spec. No.
产品型号
Part No.
HDBF07016A
HDBF07016A
24SP01
24
客户产品型号
Customer No.
Tel:0755-82916880 Fax:0755-82916881
更改内容描述
Modify Content
备注
Remark
Ver.01(Original)
E-mail:[email protected]
Page 2 of 6
SAW FILTER
HDBF07016A24
SMD-24
1. SCOPE
This specification shall cover the characteristics of SAW filter with HDBF07016A24 used for
the page system.
2. ELECTRICAL SPECIFICATION
Maximum incident power in passband
Max.DC voltage between any 2 terminals
Storage temperature range
Operation temperature range
+10dBm
30VDC
-40℃ to +85℃
-40℃ to +85℃
Electronic Characteristics
Parameter
Center Frequency
Insertion loss
-1 dB Bandwidth
-3 dB Bandwidth
-40 dB Bandwidth
Passband Variation
Absolute Delay
Group delay Variation (F0 +/- 12MHz)
Phase Linearity (F0 +/- 12MHz)
Ultimate Rejection (Over F0 +/- 20MHz)
Temperature Coefficient
Package Size
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Min.
69.8
15.5
16
40
Typical.
Max.
70
70.2
12.5
13.5
16
16.9
21.2
22
0.4
1.0
0.96
70
100
2.5
11.5
44
-86
SMD 13.3mm*6.5mm
E-mail:[email protected]
Unit
MHz
dB
MHz
MHz
MHz
dB
us
ns
deg
dB
ppm/°C
Page 3 of 6
SAW FILTER
HDBF07016A24
SMD-24
Typical frequency response
s
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Page 4 of 6
SAW FILTER
HDBF07016A24
SMD-24
3. TEST CIRCUIT
L1 = L2 =150 nH
C1 =C2=30pF
* Component values may change depending on board layout.
4.DIMENSION
Dimension
A
B
C
D
E
H
P
min
13.1
6.3
1.21
0.72
mm
typ
13.3
6.5
1.36
1.5
0.8
0.76
2.54
max
13.5
6.7
1.51
0.80
Pin Configuration
11
Input
5
Output
Other
Ground
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Page 5 of 6
SAW FILTER
HDBF07016A24
SMD-24
5. ENVIRONMENTAL CHARACTERISTICS
5-1 Temperature cycling
Subject the device to a low temperature of -40℃for 30 minutes. Following by a high
temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30 Minutes.
Then release the device into the room conditions for 1 to 2 hours prior to the measurement.
It shall meet the specifications in table 1.
5-2 Resistance to solder heat
Submerge the device terminals into the solder bath at 260℃ ±5℃ for 10±1 sec.
Then release the device into the room conditions for 4 hours. It shall meet the specifications
in table 1.
5-3 Solderability
Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than
95% area of the soldering pad must be covered with new solder. It shall meet the
specifications in table 1.
5-4 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the
filter shall fulfill the specifications in table 1.
5-5 Vibration
Subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude
of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in table 1.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction
of the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
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Page 6 of 6