ACNW3190 5.0 Amp High Output Current IGBT Gate Drive Optocoupler Data Sheet Lead (Pb) Free RoHS 6 fully compliant RoHS 6 fully compliant options available; -xxxE denotes a lead-free product Description Features The ACNW3190 contains an AlGaAs LED, which is optically coupled to an integrated circuit with a power output stage. This optocoupler is ideally suited for driving power IGBTs and MOSFETs used in motor control inverter applications. The high operating voltage range of the output stage provides the drive voltages required by gate controlled devices. The voltage and high peak output current supplied by this optocoupler make it ideally suited for direct driving IGBTs with ratings up to 1200V/200 A, 600 V/300 A. For IGBTs with higher ratings, the ACNW3190 can be used to drive a discrete power stage which drives the IGBT gate. The ACNW3190 has the highest insulation voltage of VIORM=1414 Vpeak in the IEC/ EN/DIN EN 60747-5-2. • 5.0 A Maximum Peak Output Current Functional Diagram • 15 kV/µs Minimum Common Mode Rejection (CMR) at VCM = 1500 V • 0.5 V Maximum Low Level Output Voltage (VOL) Eliminates Need for Negative Gate Drive • ICC = 5 mA Maximum Supply Current • Under Voltage Lock-Out Protection (UVLO) with Hysteresis • Wide Operating VCC Range: 15 to 30 Volts • 500 ns Maximum Switching Speeds • Industrial Temperature Range: -40°C to 100°C • Safety Approval UL Recognized 5000 Vrms for 1 min. N/C 1 8 VCC ANODE 2 7 VO CATHODE 3 6 VEE N/C 4 5 VEE CSA Approval IEC/EN/DIN EN 60747-5-2 Approved VIORM = 1414 Vpeak Applications • IGBT/MOSFET Gate Drive SHIELD • AC/Brushless DC Motor Drives • Industrial Inverters • Switch Mode Power Supplies TRUTH TABLE LED VCC - VEE “POSITIVE GOING” (i.e., TURN-ON) VCC - VEE “NEGATIVE GOING” (i.e., TURN-OFF) VO OFF 0 - 30 V 0 - 30 V LOW ON 0 - 11 V 0 - 9.5 V LOW ON 11 - 13.5 V 9.5 - 12 V TRANSITION ON 13.5 - 30 V 12 - 30 V HIGH A 0.1 μF bypass capacitor must be connected between pins 5 and 8. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. Ordering Information ACNW3190 is UL Recognized with 5000Vrms for 1 minute per UL1577. Option Part number RoHS Compliant Package Surface Mount Gull Wing Tape & Reel -000E ACNW3190 -300E -500E 400mil DIP-8 X X X X X IEC/EN/DIN EN 60747-5-2 Quantity X 42 per tube X 42 per tube X 750 per reel To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry. Example 1: ACNW3190-500E to order product of 400mil DIP Gull Wing Surface Mount package in Tape and Reel packaging with IEC/EN/DIN EN 60747-5-2 Safety Approval in RoHS compliant. Example 2: ACNW3190-000E to order product of 400mil DIP package in tube packaging and RoHS compliant. Option datasheets are available. Contact your Avago sales representative or authorized distributor for information. Package Outline Drawings ACNW3190 Outline Drawing (8-pin Wide Body Package) 11.00 MAX. (0.433) 11.15 ± 0.15 (0.442 ± 0.006) 8 7 6 9.00 ± 0.15 (0.354 ± 0.006) 5 TYPE NUMBER A HCNWXXXX DATE CODE YYWW 1 2 3 4 10.16 (0.400) TYP. 1.55 (0.061) MAX. 7° TYP. + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) 5.10 MAX. (0.201) 3.10 (0.122) 3.90 (0.154) 0.51 (0.021) MIN. 2.54 (0.100) TYP. 1.78 ± 0.15 (0.070 ± 0.006) 0.40 (0.016) 0.56 (0.022) ACNW3190 Gull Wing Surface Mount Option 300 Outline Drawing 11.15 ± 0.15 (0.442 ± 0.006) 8 7 6 LAND PATTERN RECOMMENDATION 5 9.00 ± 0.15 (0.354 ± 0.006) 1 2 3 13.56 (0.534) 4 1.3 (0.051) 2.29 (0.09) 12.30 ± 0.30 (0.484 ± 0.012) 1.55 (0.061) MAX. 11.00 MAX. (0.433) 4.00 MAX. (0.158) 1.78 ± 0.15 (0.070 ± 0.006) 2.54 (0.100) BSC 0.75 ± 0.25 (0.030 ± 0.010) 1.00 ± 0.15 (0.039 ± 0.006) + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) 7° NOM. Dimensions in inches (millimeters) Note: Floating Lead Protrusion is 0.25 mm (10 mils) max. Solder Reflow Temperature Profile 300 PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC. REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC. 200 PEAK TEMP. 245 °C PEAK TEMP. 240 °C TEMPERATURE (°C) 2.5 C ± 0.5 °C/SEC. 30 SEC. 160 °C 150 °C 140 °C PEAK TEMP. 230 °C SOLDERING TIME 200 °C 30 SEC. 3 °C + 1 °C/–0.5 °C 100 PREHEATING TIME 150 °C, 90 + 30 SEC. 50 SEC. TIGHT TYPICAL LOOSE ROOM TEMPERATURE 0 0 50 100 150 TIME (SECONDS) NOTE: NON-HALIDE FLUX SHOULD BE USED. Recommended Pb-Free IR Profile tp Tp TEMPERATURE TL Tsmax * 260 +0/-5 °C TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE 15 SEC. 217 °C 150 - 200 °C RAMP-UP 3 °C/SEC. MAX. RAMP-DOWN 6 °C/SEC. MAX. Tsmin ts PREHEAT 60 to 180 SEC. 25 tL 60 to 150 SEC. t 25 °C to PEAK TIME NOTES: THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 °C, Tsmin = 150 °C NOTE: NON-HALIDE FLUX SHOULD BE USED. * RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245 °C 200 250 P S – POWER – mW, IS – INPUT CURRENT – mA Dependence of Safety Limiting Values on Temperature 1000 900 800 Regulatory Information PS,S,OUTPUT OUTPUT The ACNW3190 is approved by the following organizations: I S, INPUT IEC/EN/DIN EN 60747-5-2 Approval under: 700 IEC 60747-5-2 :1997 + A1:2002 EN 60747-5-2:2001 + A1:2002 DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01 600 500 400 UL 300 Approval under UL 1577, component recognition program up to VISO = 5000 VRMS expected prior to product release. File E55361. 200 100 CSA 0 0 25 50 75 100 125 150 175 Approval under CSA Component Acceptance Notice #5, File CA 88324 expected prior to product release. T S – CASE TEMPERATURE – °C Note: The Thermal Derating Graph above is in relation to Figure 30 and Figure 31 and S = 2cm. Table 1. IEC/EN/DIN EN 60747-5-2 Insulation Characteristics* Description Symbol Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤ 150 Vrms for rated mains voltage ≤ 300 Vrms for rated mains voltage ≤ 450 Vrms for rated mains voltage ≤ 600 Vrms for rated mains voltage ≤ 1000 Vrms 55/100/21 Pollution Degree (DIN VDE 0110/1.89) Input to Output Test Voltage, Method b** VIORM x 1.875=VPR, 100% Production Test with tm=1 sec, Partial discharge < 5 pC Input to Output Test Voltage, Method a** VIORM x 1.5=VPR, Type and Sample Test, tm=60 sec, Partial discharge < 5 pC Unit I – IV I – IV I – IV I – IV I – III Climatic Classification Maximum Working Insulation Voltage Characteristic 2 VIORM 1414 Vpeak VPR 2652 Vpeak VPR 2121 Vpeak Highest Allowable Overvoltage (Transient Overvoltage tini = 10 sec) VIOTM 8000 Vpeak Safety-limiting values – maximum values allowed in the event of a failure, also see Figure 2. Case Temperature Input Current Output Power TS IS, INPUT PS, OUTPUT 150 400 800 °C mA mW RS ≥109 Ω Insulation Resistance at TS, VIO = 500 V * Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application. Surface mount classification is class A in accordance with CECCOO802. ** Refer to the optocoupler section of the Isolation and Control Components Designer’s Catalog, under Product Safety Regulations section IEC/EN/ DIN EN 60747-5-2, for a detailed description of Method a and Method b partial discharge test profiles. Table 2. Insulation and Safety Related Specifications Parameter Symbol ACNW3190 Units Conditions Minimum External Air Gap (Clearance) L(101) 9.6 mm Measured from input terminals to output terminals, shortest distance through air. Minimum External Tracking (Creepage) L(102) 10.0 mm Measured from input terminals to output terminals, shortest distance path along body. 1.0 mm Through insulation distance conductor to conductor, usually the straight line distance thickness between the emitter and detector. >200 V DIN IEC 112/VDE 0303 Part 1 Minimum Internal Plastic Gap (Internal Clearance) Tracking Resistance (Comparative Tracking Index) CTI Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Table 3. Absolute Maximum Ratings Parameter Symbol Min. Max. Units Storage Temperature TS -55 125 °C Operating Temperature TA -40 100 °C Output IC Junction Temperature TJ 150 °C Average Input Current IF(AVG) 25 mA Peak Transient Input Current (<1 µs pulse width, 300pps) IF(TRAN) 1.0 A Reverse Input Voltage VR 5 V “High” Peak Output Current IOH(PEAK) 5.0 A 2 “Low” Peak Output Current IOL(PEAK) 5.0 A 2 Total Output Supply Voltage (VCC - VEE) 35 V Input Current (Rise/Fall Time) tr(IN) / tf(IN) 500 ns Output Voltage VO(PEAK) VCC V Output IC Power Dissipation PO 800 mW 3 Total Power Dissipation PT 850 mW 4 Lead Solder Temperature 260°C for 10 sec., 1.6 mm below seating plane Solder Reflow Temperature Profile See Package Outline Drawings section Note -0.5 -0.5 Note 1 Table 4. Recommended Operating Conditions Parameter Symbol Min. Max. Units Operating Temperature TA - 40 100 °C Output Supply Voltage (VCC - VEE) 15 30 V Input Current (ON) IF(ON) 10 16 mA Input Voltage (OFF) VF(OFF) - 3.6 0.8 V Table 5. Electrical Specifications (DC) Unless otherwise noted, all typical values are at TA = 25°C, VCC - VEE = 30 V, VEE = Ground; all Minimum/Maximum specifications are at Recommended Operating Conditions (TA = -40 to 100°C, IF(ON) = 10 to 16 mA, VF(OFF) = -3.6 to 0.8 V, VCC = 15 to 30 V, VEE = Ground) Parameter Symbol Min. Typ. High Level Output Current IOH 2.75 1.0 Max. 4.0 Low Level Output Current IOL 1.0 3.5 4.0 VCC-3 Test Conditions Fig. Note A VO = VCC - 4 2, 3, 17 5 A VO = VCC – 15 A VO = VEE + 2.5 A VO = VEE + 15 V IO = -100 mA 1, 3, 19 2 5, 6, 18 VOH Low Level Output Voltage VOL 0.1 0.5 V IO = 100 mA 4, 6, 20 High Level Supply Current ICCH 3.0 5.0 mA Output open, IF = 7 to 16 mA 7, 8 Low Level Supply Current ICCL 3.0 5.0 mA Output open, VF = -3.0 to +0.8 V Threshold Input Current Low to High IFLH 3.5 8.0 mA IO = 0 mA, VO > 5 V 9, 15, 21 Threshold Input Voltage High to Low VFHL 0.8 Input Forward Voltage VF 1.2 IF = 10 mA 16 Temperature Coefficient of Input Forward Voltage ΔVF/ΔTA Input Reverse Breakdown Voltage BVR Input Capacitance CIN UVLO Threshold VUVLO+ 11.0 12.3 13.5 VUVLO- 9.5 10.7 12.0 6, 7 V 1.6 1.95 -1.3 V mV/°C 5 75 UVLOHYS 5 2 High Level Output Voltage UVLO Hysteresis VCC-4 Units V IR = 100 µA pF f = 1 MHz, VF = 0 V V VO > 5 V, IF = 10 mA 22, 28 1.6 Table 6. Switching Specifications (AC) Unless otherwise noted, all typical values are at TA = 25°C, VCC - VEE = 30 V, VEE = Ground; all Minimum/Maximum specifications are at Recommended Operating Conditions (TA = -40 to 100°C, IF(ON) = 10 to 16 mA, VF(OFF) = -3.6 to 0.8 V, VCC = 15 to 30 V, VEE = Ground). Parameter Symbol Min. Typ. Max. Units Test Conditions Fig. Propagation Delay Time to High Output Level tPLH 0.10 0.30 0.50 µs 10, 11, 12, 14 13, 14, 23 Propagation Delay Time to Low Output Level tPHL 0.10 0.30 0.50 µs Pulse Width Distortion PWD 0.30 µs Rg = 10 Ω, Cg = 10 nF, f = 10 kHz , Duty Cycle = 50%, IF = 10 mA, VCC = 30 V Propagation Delay Difference Between Any Two Parts PDD (tPHL - tPLH) 0.35 µs 35, 36 Rise Time tr 0.1 µs 23 Fall Time tf 0.1 µs UVLO to Turn On Delay tUVLO,ON 0.8 µs VO > 5 V, IF = 10 mA UVLO to Turn Off Delay tUVLO,OFF 0.6 µs VO < 5 V, IF = 10 mA Output High Level Common Mode Transient Immunity |CMH| 15 30 kV/µs TA = 25°C, IF = 10 to 16 mA, VCM = 1500 V, VCC = 30 V Output Low Level Common Mode Transient Immunity |CML| 15 30 kV/µs TA = 25°C, VF = 0 V, VCM = 1500 V, VCC = 30 V Note 15 10 22 24 11, 12 11, 13 Table 7. Package Characteristics Unless otherwise noted, all typical values are at TA = 25°C; all Minimum/Maximum specifications are at Recommended Operating Conditions. Parameter Symbol Min. Input-Output Momentary Withstand Voltage* VISO 5000 Input-Output Resistance RI-O 1012 Typ. Max. 1013 Units Test Conditions VRMS RH < 50%, t = 1 min., TA = 25°C 8, 9 Ω VI-O = 500 VDC, TA = 25°C 9 1011 Input-Output Capacitance CI-O LED-to-Ambient Thermal Resistance θLA LED-to-Detector Thermal Resistance θLD Detector-to-Ambient Thermal Resistance θDA Fig. Note VI-O = 500 VDC, TA = 100°C 0.5 0.6 pF f =1 MHz °C/W See Thermal Model Section 29, 30, 31 See Thermal Model in Application Notes Section * The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating, refer to your equipment level safety specification or Avago Technologies Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.” Notes: 1. Derate linearly above 70°C free-air temperature at a rate of 0.3 mA/ °C. 2. Maximum pulse width = 10 µs. This value is intended to allow for component tolerances for designs with IO peak minimum = 4.0 A. See Applications section for additional details on limiting IOH peak. 3. Derate linearly above 70°C free-air temperature at a rate of 4.8 mA/ °C. 4. Derate linearly above 70°C free-air temperature at a rate of 5.4 mA/ °C. 5. Maximum pulse width = 50 µs. 6. In this test VOH is measured with a dc load current. When driving capacitive loads VOH will approach VCC as IOH approaches zero amps. 7. Maximum pulse width = 1 ms. 8. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage ≥6000 Vrms for 1 second (leakage detection current limit, II-O ≤ 5 µA). 9. Device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together and pins 5, 6, 7, and 8 shorted together. 10. The difference between tPHL and tPLH between any two ACNW3190 parts under the same test condition. 11. Pins 1 and 4 need to be connected to LED common. 12.Common mode transient immunity in the high state is the maximum tolerable dVCM/dt of the common mode pulse, VCM, to assure that the output will remain in the high state (i.e., VO > 15.0 V). 13.Common mode transient immunity in a low state is the maximum tolerable dVCM/dt of the common mode pulse, VCM, to assure that the output will remain in a low state (i.e., VO < 1.0 V). 14. This load condition approximates the gate load of a 1200 V/100A IGBT. 15. Pulse Width Distortion (PWD) is defined as |tPHL-tPLH| for any given device. 2.9 IOH - OUTPUT HIGH CURRENT - A (VOH –VCC ) – HIGH OUTPUTVOLTAGE DROP - V 0 -1 -2 -3 -4 -40 -20 0 20 40 60 TA - TEMPERATURE - °C 80 2.6 2.5 2.4 20 40 60 80 100 80 100 0.25 -1 -40°C 25°C 100°C -2 -3 -4 -5 0.0 1.0 2.0 3.0 I OH – OUTPUT HIGH CURRENT – A 4.0 5.0 0.20 0.15 0.10 0.05 0.00 -20 0 20 40 60 TA - TEMPERATURE - °C 7 VOL – OUTPUT LOW VOLTAGE – V 5 4 3 2 -40 -40 Figure 4. VOL vs. Temperature 6 IOL – OUTPUT LOW CURRENT - A 0 Figure 2. IOH vs. Temperature Figure 3. VOH vs. IOH -20 0 20 40 60 TA - TEMPERATURE - °C Figure 5. IOL vs. Temperature -20 TA - TEMPERATURE - °C VOL – OUTPUT LOW VOLTAGE – V (VOH –VCC ) – HIGH OUTPUTVOLTAGE DROP - V 2.7 2.3 -40 100 Figure 1. VOH vs. Temperature -6 2.8 80 100 6 5 4 3 2 -40°C 25°C 100°C 1 0 0.0 Figure 6. VOL vs. IOL. 1.0 2.0 3.0 4.0 I OL – OUTPUT LOW CURRENT - A 5.0 4.5 ICCH ICCL 4.0 ICC – SUPPLY CURRENT - mA ICC – SUPPLY CURRENT - mA 4.5 3.5 3.0 2.5 -40 -20 0 20 40 60 TA–TEMPERATURE – °C 80 5 3 2 1 -20 0 20 40 60 TA – TEMPERATURE - °C 80 100 15 20 25 VCC – SUPPLY VOLTAGE - V T PHL T PLH 300 200 15 20 25 VCC – SUPPLY VOLTAGE - V 500 Tp – PROPAGATION DELAY - ns T PHL T PLH 400 300 200 100 6 8 10 12 14 I F – FORWARD LED CURRENT - mA Figure 11. Propagation delay vs. IF 30 30 Figure 10. Propagation delay vs. VCC 500 Tp – PROPAGATION DELAY - ns 10 400 100 -40 Figure 9. IFLH vs. Temperature 10 3.0 500 4 0 3.5 Figure 8. ICC vs. VCC Tp – PROPAGATION DELAY - ns I FLH – LOW TO HIGH CURRENT THRESHOLD – mA Figure 7. ICC vs. Temperature 4.0 2.5 100 ICCH ICCL 16 T PHL T PLH 400 300 200 100 -40 -20 0 20 40 60 T A – TEMPERATURE - °C Figure 12. Propagation delay vs. Temperature 80 100 350 300 300 Tp – PROPAGATION DELAY – ns Tp – PROPAGATION DELAY – ns 350 250 200 150 100 TPHL TPLH 50 0 0 10 20 30 40 Rg – SERIES LOAD RESISTANCE – Ω 100 1000 25 100 20 15 10 5 0 1 2 3 4 IF – FOWARD LED CURRENT - mA Figure 15. Transfer Characteristics TPHL TPLH 50 0 20 40 60 80 Cg – LOAD CAPACITANCE - nF 100 Figure 14. Propagation Delay vs. Cg IF – FORWARD CURRENT – mA VOL – OUTPUT LOW VOLTAGE – V 150 30 0 11 200 0 50 Figure 13. Propagation Delay vs. Rg 250 5 10 1.0 T A = 25°C IF + VF – 0.1 0.01 0.001 1.2 1.3 1.4 1.5 1.6 VF – FORWARD VOLTAGE – VOLTS Figure 16. Input Current vs. Forward Voltage 1.7 1 IF = 7 to 16 mA 8 + – 2 7 � 0.1 µF 3 6 4 5 IOH 16 mA 8 2 7 VOH IOL + – 6 4 5 V CC = 15 to 30 V 2.5 V + – 1 8 2 7 V CC = 15 to 30 V 6 100 mA � VOL 0.1 µF 5 Figure 19. VOH Test Circuit 3 6 4 5 + – VCC = 15 � to 30 V Figure 20. VOL Test Circuit 1 8 2 7 IF 0.1 µF 12 3 + – 100 mA 3 6 4 5 Figure 21. IFLH Test Circuit 7 0.1 µF V CC = 15 to 30 V 0.1 µF 4 2 Figure 18. IOL Test Circuit 1 3 8 + – Figure 17. IOH Test Circuit I F = 7 to 1 4V VO > 5 V I F = 10 mA 1 8 2 7 + – 0.1 µF VCC = 15 to 30 V 3 6 4 5 Figure 22. UVLO Test Circuit VO > 5 V + – V CC 1 8 IF = 7 to 16 mA + 10 KHz � – 500Ω 50% DUTY� CYCLE 2 VO 7 + – IF VCC = 15� to 30 V tr tf 0.1 µF 3 6 90% 10 Ω 50% 10 nF 4 V OUT 10% 5 t PLH t PHL Figure 23. tPLH, tPHL, tr, and tf Test Circuit and Waveforms VCM IF 5V 1 δV δt A 2 B + – 8 7 0.1 µF 3 6 4 5 VO + – = VCM Δt 0V Δt V CC = 30 V VOH VO SWITCH AT A: IF = 10 mA VO VOL SWITCH AT B: IF = 0 mA – + V CM = 1500 V Figure 24. CMR Test Circuit and Waveforms Application Notes Figure 25 and 26 show two recommended application circuits. Figure 25 show a single power supply gate driver using the driver’s maximum VOL value of 0.5V. Figure 26 show a dual power supply gate driver circuit which is applicable for higher power IGBT driving due to the existence of higher miller capacitance in these IGBTs. 1 8 2 7 +_ 270Ω 5V +_ 3 4 0.1µF + HVDC Rg 6 5 VCC = 15V Q1 + VCE - RPULL-DOWN Q2 3-PHASE AC + VCE - Figure 25. Recommended LED drive and application circuit For high side bootstrap driving, note that the bypass capacitor of 0.1µF in parallel with 10µF or above to be connected across VCC and VEE is important to deliver high peak output current. 13 -HVDC 1 8 _+ 270Ω 5V 2 +_ 3 7 0.1µF + HVDC Rg Q1 6 RPULL-DOWN 4 VCC = 15V 5 +_ VEE = -5V Q2 + VCE - + VCE - Figure 26. ACNW3190typical application circuit with negative IGBT gate drive Selecting the Gate Resistor (Rg) to minimize IGBT Switching Losses. For the circuit in Figure 26 with IF (worst case) = 16 mA, Rg = 4.3Ω, Max Duty Cycle = 80%, Qg = 1000 nC, f = 15 kHz and TA max = 85°C: Step 1: Calculate Rg Minimum from the IOL Peak Specification PE = 16 mA * 1.95V * 0.8 = 25 mW The IGBT and Rg in Figure 26 can be analyzed as a simple RC circuit with a voltage supplied by the ACNW3190. The operating temperature is 100°C. PO = 3.25 mA * 20 V + 13μJ * 15 kHz = 65 mW + 195 mW = 260 mW (V CC − V EE − VOL ) I OLPEAK (15V + 5V − 3. 5V ) = 4A Rg ≥ ≈ 4. 3Ω The VOL value of 3.5V in the previous equation is a conservative value of VOL at the peak current of 4.0A (see Figure 6). At lower Rg values the voltage supplied by the ACNW3190 is not an ideal voltage step. This results in lower peak currents (more margin) than predicted by this analysis. When negative gate drive is not used, VEE in the previous equation is equal to zero volts. < 728 mW (PO(MAX) @ 85°C = 800 mW-15C*4.8 mW/C) The value of 3.25 mA for ICC in the previous equation was obtained by derating the ICC max of 5 mA to ICC max at 100C (see Figure 7). The above computation shows that the power dissipation is within the specified limits. However, designers should verify that the thermal limits have not been violated by using the thermal model provided in this datasheet. This thermal model obtained based on JEDEC specification. PE Parameter Description IF LED Current VF LED On Voltage Duty Cycle Maximum LED Duty Cycle PO Parameter Description ICC Supply Current VCC Positive Supply Voltage PT = PE + PO VEE Negative Supply Voltage PE = IF * VF * Duty Cycle ESW(Rg,Qg) Energy Dissipated in the HCPL-3120 for each IGBT Switching Cycle (See Figure 27) Step 2: Check the ACNW3190 Power Dissipation and Increase Rg if Necessary. The ACNW3190 total power dissipation (PT) is equal to the sum of the emitter power (PE) and the output power (PO): PO = PO(BIAS) + PO (SWITCHING) = ICC * (VCC - VEE) + ESW(RG, QG) * f 14 3-PHASE AC -HVDC 16.0 14.0 Energy per cycle [ µJ ] Thermal Model 100 nC 500 nC 1000 nC 12.0 Introduction For application which requires an output gate current more than 2A, adequate PCB pad heat-sink must be provided to dissipate the power loss in the package. Failure to provide proper heat dissipation will potentially damage the gate drive after pro-long usage. This thermal model allows designer to compute the temperature of the LED and detector. 10.0 8.0 6.0 4.0 Definitions 2.0 0.0 θ1:Thermal impedance from LED junction to ambient 0 10 20 30 40 50 Rg [Ω] θ2:Thermal impedance from LED to detector (output IC) Figure 27. Energy dissipated in the ACWN3190 for each IGBT switching cycle θ3:Thermal impedance from detector (output IC) junction to ambient Under Voltage Lockout Feature Ambient Temperature: Measured approximately 1.25 cm above the optocoupler, with no forced air. The ACNW3190 contains an under voltage lockout (UVLO) feature that is designed to protect the IGBT under fault conditions which cause the ACNW3190 supply voltage (equivalent to the fully-charged IGBT gate voltage) to drop below a level necessary to keep the IGBT in a low resistance state. When the ACNW3190 output is in the high state and the supply voltage drops below the ACNW3190 VUVLO– threshold (9.5 < VUVLO– < 12.0) the optocoupler output will go into the low state with a typical delay, UVLO Turn Off Delay, of 0.6 μs. When the ACNW3190 output is in the low state and the supply voltage rises above the ACNW3190 VUVLO+ threshold (11.0 < VUVLO+ < 13.5) the optocoupler output will go into the high state (assumes LED is “ON”) with a typical delay, UVLO Turn On Delay of 0.8 μs. V O – OUTPUT VOLTAGE – V ∆TEA = A11*PE + A12*PD ∆TDA = A21*PE + A22*PD where, ∆TEA = Temperature difference between ambient and LED ∆TDA = Temperature difference between ambient and detector PD = Power dissipation from detector A11, A12, A21, A22 thermal coefficients (units in °C/W) are functions of the thermal impedances θ1, θ2, θ3 (See Note 2). 12 (12.3, 10.8) 10 (10.7, 9.2) 8 Table 1. Thermal Model-B Coefficient Data (units in °C/W) 6 4 2 (10.7, 0.1) 0 5 Figure 28. Under Voltage Lock Out S (cm) A11 A12, A21 A22 1 218.9 39.31 55.3 2 200.6 29.8 45 4 198 23.59 41.7 Jedec Specifications A11 A12, A21 A22 low K board 254 50.3 66.8 High K board 151.2 16.72 39.06 (12.3, 0.1) 10 15 (V CC - V EE ) – SUPPLY VOLTAGE – V 15 This thermal model assumes that an 8-pin single-channel plastic package optocoupler is soldered into a 7.62 cm x 7.62 cm printed circuit board (PCB). The temperature at the LED and Detector junctions of the optocoupler can be calculated using the equations below. PE = Power dissipation from LED 14 0 Description 20 Figure 29. Thermal Model-B Diagram 300 A11 A12/A21 A22 Thermal Coefficient 250 200 150 100 Figure 30. Evaluation thermal board design 50 0 0 2 4 6 S (cm) Figure 31. Thermal Coefficient Plot against S Notes: 1. Maximum junction temperature for above parts: 150 °C. 2. A11 = θ1 || (θ2+ θ3); A12 = A21 = (θ1 θ2) / (θ1+ θ2 + θ3); A22 = θ3|| (θ2 + θ3). For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. AV02-0598EN - June 18, 2008