RENESAS R1RW0416DGE-0PI

Datasheet
R1RW0416DI Series
Wide Temperature Range Version
4M High Speed SRAM (256-kword × 16-bit)
REJ03C0109-0201
Rev.2.01
Jun 16, 2010
Description
The R1RW0416DI is a 4-Mbit high speed static RAM organized 256-kword × 16-bit. It has realized high speed access
time by employing CMOS process (6-transistor memory cell) and high speed circuit designing technology. It is most
appropriate for the application which requires high speed, high density memory and wide bit width configuration, such
as cache and buffer memory in system. The R1RW0416DI is packaged in 400-mil 44-pin SOJ and 400-mil 44-pin
plastic TSOPII for high density surface mounting.
Features
• Single 3.3 V supply: 3.3 V ± 0.3 V
• Access time: 10ns/12 ns (max)
• Completely static memory
 No clock or timing strobe required
• Equal access and cycle times
• Directly TTL compatible
 All inputs and outputs
• Operating current: 145/130 mA (max)
• TTL standby current: 40 mA (max)
• CMOS standby current: 5 mA (max)
• Center VCC and VSS type pin out
• Temperature range: −40 to +85°C
Ordering Information
Type No.
Access time
R1RW0416DGE-0PI
10ns
R1RW0416DGE-2PI
12 ns
R1RW0416DSB-0PI
10 ns
R1RW0416DSB-2PI
12 ns
REJ03C0109-0201 Rev.2.01
Jun 16, 2010
Package
400-mil 44-pin plastic SOJ (44P0K)
400-mil 44-pin plastic TSOPII (44P3W-H)
Page 1 of 11
R1RW0416DI Series
Pin Arrangement
Pin Description
Pin name
Function
A0 to A17
Address input
I/O1 to I/O16
Data input/output
CS#
OE#
Chip select
Output enable
WE#
UB#
Write enable
Upper byte select
LB#
VCC
Lower byte select
Power supply
VSS
NC
Ground
No connection
REJ03C0109-0201 Rev.2.01
Jun 16, 2010
Page 2 of 11
R1RW0416DI Series
Block Diagram
REJ03C0109-0201 Rev.2.01
Jun 16, 2010
Page 3 of 11
R1RW0416DI Series
Operation Table
CS# OE# WE# LB# UB#
H
×
L
H
L
L
L
L
L
L
L
L
L
L
L
L
Note:
Mode
VCC current
I/O1−
−I/O8
I/O9−
−I/O16
High-Z
Ref. Cycle
×
×
Standby
ISB, ISB1
High-Z
H
×
×
Output disable
ICC
High-Z
High-Z

H
H
L
L
L
H
Read
ICC
Lower byte read ICC
Output
Output
Output
High-Z
Read cycle
Read cycle
H
H
H
H
L
H
Upper byte read ICC

ICC
High-Z
High-Z
Output
High-Z
Read cycle

×
×
L
L
L
L
L
H
Write
ICC
Lower byte write ICC
Input
Input
Input
High-Z
Write cycle
Write cycle
×
×
L
L
H
H
L
H
Upper byte write ICC

ICC
High-Z
High-Z
Input
High-Z
Write cycle

×

H: VIH, L: VIL, ×: VIH or VIL
Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Supply voltage relative to VSS
VCC
−0.5 to +4.6
Voltage on any pin relative to VSS
Power dissipation
VT
PT
−0.5* to VCC + 0.5*
1.0
V
W
Operating temperature
Storage temperature
Topr
Tstg
−40 to +85
−55 to +125
°C
°C
Storage temperature under bias
Tbias
−40 to +85
°C
1
V
2
Notes: 1. VT (min) = −2.0 V for pulse width (under shoot) ≤ 6 ns
2. VT (max) = VCC + 2.0 V for pulse width (over shoot) ≤ 6 ns
REJ03C0109-0201 Rev.2.01
Jun 16, 2010
Page 4 of 11
R1RW0416DI Series
Recommended DC Operating Conditions
(Ta = −40 to +85°C)
Parameter
Symbol
Supply voltage
Typ
Max
Unit
3
3.0
3.3
3.6
VSS*
4
0
0
0
VIH
VIL
2.0
1
−0.5*


VCC + 0.5*
0.8
VCC*
Input voltage
Notes: 1.
2.
3.
4.
Min
V
V
2
V
V
VIL (min) = −2.0 V for pulse width (under shoot) ≤ 6 ns
VIH (max) = VCC + 2.0 V for pulse width (over shoot) ≤ 6 ns
The supply voltage with all VCC pins must be on the same level.
The supply voltage with all VSS pins must be on the same level.
DC Characteristics
(Ta = −40 to +85°C, VCC = 3.3 V ± 0.3 V, VSS = 0 V)
Parameter
Symbol
Min
Max
Unit
Test conditions
Input leakage current
Output leakage current
|ILI|
|ILO|


2
2
µA
µA
VIN = VSS to VCC
VIN = VSS to VCC
Operating power supply current
ICC

130
mA
Standby power supply current
ISB

40
mA
Min cycle
CS# = VIL, IOUT = 0 mA
Other inputs = VIH/VIL
Min cycle, CS# = VIH,
Other inputs = VIH/VIL
ISB1

5
mA
VOL

0.4
V
f = 0 MHz
VCC ≥ CS# ≥ VCC − 0.2 V,
(1) 0 V ≤ VIN ≤ 0.2 V or
(2) VCC ≥ VIN ≥ VCC − 0.2 V
IOL = 8 mA
VOH
2.4

V
IOH = −4 mA
Output voltage
Capacitance
(Ta = +25°C, f = 1.0 MHz)
Parameter
Symbol
1
Input capacitance*
1
Input/output capacitance*
Note:
Min
Max
Unit
Test conditions
CIN

6
pF
VIN = 0 V
CI/O

8
pF
VI/O = 0 V
1. This parameter is sampled and not 100% tested.
REJ03C0109-0201 Rev.2.01
Jun 16, 2010
Page 5 of 11
R1RW0416DI Series
AC Characteristics
(Ta = −40 to +85°C, VCC = 3.3 V ± 0.3 V, unless otherwise noted.)
Test Conditions
• Input pulse levels: 3.0 V/0.0 V
• Input rise and fall time: 3 ns
• Input and output timing reference levels: 1.5 V
• Output load: See figures (Including scope and jig)
Read Cycle
R1RW0416DI
Parameter
Symbol
10ns Version
12ns Version
Min
Min
Max
Max
Unit
Notes
Read cycle time
Address access time
tRC
tAA
10


10
12


12
ns
ns
Chip select access time
Output enable to output valid
tACS
tOE


10
5


12
6
ns
ns
Byte select to output valid
Output hold from address change
tBA
tOH

3
5


3
6

ns
ns
Chip select to output in low-Z
Output enable to output in low-Z
tCLZ
tOLZ
3
0


3
0


ns
ns
1
1
Byte select to output in low-Z
Chip deselect to output in high-Z
tBLZ
tCHZ
0


5
0


6
ns
ns
1
1
Output disable to output in high-Z
Byte deselect to output in high-Z
tOHZ
tBHZ


5
5


6
6
ns
ns
1
1
REJ03C0109-0201 Rev.2.01
Jun 16, 2010
Page 6 of 11
R1RW0416DI Series
Write Cycle
R1RW0416DI
Parameter
Symbol
10ns Version
12ns Version
Min
Min
Max
Max
Unit
Notes
Write cycle time
Address valid to end of write
tWC
tAW
10
7


12
8


ns
ns
Chip select to end of write
Write pulse width
tCW
tWP
7
7


8
8


ns
ns
8
7
Byte select to end of write
Address setup time
tBW
tAS
7
0


8
0


ns
ns
5
Write recovery time
Data to write time overlap
tWR
tDW
0
5


0
6


ns
ns
Data hold from write time
Write disable to output in low-Z
tDH
tOW
0
3


0
3


ns
ns
1
Output disable to output in high-Z
Write enable to output in high-Z
tOHZ
tWHZ


5
5


6
6
ns
ns
1
1
6
Notes: 1. Transition is measured ±200 mV from steady voltage with output load (B). This parameter is sampled and
not 100% tested.
2. If the CS# or LB# or UB# low transition occurs simultaneously with the WE# low transition or after the WE#
transition, output remains a high impedance state.
3. WE# and/or CS# must be high during address transition time.
4. If CS#, OE#, LB# and UB# are low during this period, I/O pins are in the output state. Then the data input
signals of opposite phase to the outputs must not be applied to them.
5. tAS is measured from the latest address transition to the latest of CS#, WE#, LB# or UB# going low.
6. tWR is measured from the earliest of CS#, WE#, LB# or UB# going high to the first address transition.
7. A write occurs during the overlap of a low CS#, a low WE# and a low LB# or a low UB# (tWP). A write begins
at the latest transition among CS# going low, WE# going low and LB# going low or UB# going low. A write
ends at the earliest transition among CS# going high, WE# going high and LB# going high or UB# going high.
8. tCW is measured from the later of CS# going low to the end of write.
REJ03C0109-0201 Rev.2.01
Jun 16, 2010
Page 7 of 11
R1RW0416DI Series
Timing Waveforms
Read Timing Waveform (1) (WE# = VIH)
Read Timing Waveform (2) (WE# = VIH, LB# = VIL, UB# = VIL)
REJ03C0109-0201 Rev.2.01
Jun 16, 2010
Page 8 of 11
R1RW0416DI Series
Write Timing Waveform (1) (WE# Controlled)
REJ03C0109-0201 Rev.2.01
Jun 16, 2010
Page 9 of 11
R1RW0416DI Series
Write Timing Waveform (2) (CS# Controlled)
REJ03C0109-0201 Rev.2.01
Jun 16, 2010
Page 10 of 11
R1RW0416DI Series
Write Timing Waveform (3) (LB#, UB# Controlled, OE# = VIH)
REJ03C0109-0201 Rev.2.01
Jun 16, 2010
Page 11 of 11
Revision History
R1RW0416DI Series data sheet
Rev.
Date
Page
0.01
1.00
Sep. 30, 2003
Mar. 12, 2004
−
−-
2.00
May. 01, 2009
−
P1
P5
P6/P7
Description
Summary
Initial issue
Deletion of Preliminary
Addition of access grade 10ns version.
The product lineup :R1RW0416DSB-0PI/DGE-0PI is added.
Operating power supply current of 10ns cycle version is described to the
DC characteristic.
The timing standard of 10ns version is described at the read cycle
The timing standard of 10ns version is described at the write cycle
2.01
Jun. 16, 2010
−
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