RENESAS RMLV0414EGSB-5S2

Preliminary
RMLV0408E Series
4Mb Advanced LPSRAM (512k word × 8bit)
R10DS0217EJ0001
Rev.0.01
2013.09.10
Description
The RMLV0408E Series is a family of 4-Mbit static RAMs organized 524,288-word × 8-bit, fabricated by Renesas’s
high-performance Advanced LPSRAM technologies. The RMLV0408E Series has realized higher density, higher
performance and low power consumption. The RMLV0408E Series offers low power standby power dissipation;
therefore, it is suitable for battery backup systems. It is offered in 32-pin SOP, 32-pin TSOP II or 32-pin STSOP.
Features
 Single 3V supply: 2.7V to 3.6V
 Access time: 45/55ns (max.)
 Current consumption:
── Standby: 0.4µA (typ.)
 Equal access and cycle times
 Common data input and output
── Three state output
 Directly TTL compatible
── All inputs and outputs
 Battery backup operation
Part Name Information
Part Name
Access
time
RMLV0408EGSP-4S2
45 ns
RMLV0408EGSP-5S2
55 ns
RMLV0408EGSB-4S2
45 ns
RMLV0408EGSB-5S2
55 ns
RMLV0408EGSA-4S2
45 ns
RMLV0408EGSA-5S2
55 ns
R10DS0217EJ0001 Rev.0.01
2013.09.10
Temperature
Range
Package
525-mil 32-pin plastic SOP
-40 ~ +85°C
400-mil 32-pin plastic TSOP II
8mm x 13.4mm STSOP
Page 1 of 10
RMLV0408E Series
Preliminary
Pin Arrangement
32-pin SOP
32-pin TSOP II
32-pin STSOP
A18
1
32
Vcc
A11
1
32
OE#
A16
2
31
A15
A9
2
31
A10
A14
3
30
A17
A8
3
30
CS#
A12
4
29
WE#
A13
4
29
I/O7
A7
5
28
A13
WE#
5
28
I/O6
A6
6
27
A8
A18
6
27
I/O5
A5
7
26
A9
A15
7
26
I/O4
A4
8
25
A11
Vcc
8
25
I/O3
A3
9
24
OE#
A17
9
24
Vss
A2
10
23
A10
A16
10
23
I/O2
A1
11
22
CS#
A14
11
22
I/O1
A0
12
21
I/O7
A12
12
21
I/O0
I/O0
13
20
I/O6
A7
13
20
A0
I/O1
14
19
I/O5
A6
14
19
A1
I/O2
15
18
I/O4
A5
15
18
A2
Vss
16
17
I/O3
A4
16
17
A3
(Top view)
(Top view)
Pin Description
Pin name
VCC
VSS
A0 to A18
I/O0 to I/O7
CS#
WE#
OE#
Function
Power supply
Ground
Address input
Data input/output
Chip select
Write enable
Output enable
R10DS0217EJ0001 Rev.0.01
2013.09.10
Page 2 of 10
RMLV0408E Series
Preliminary
Block Diagram
VCC
A0
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
VSS
・
・
・
・
・
Row
Decoder
I/O0
Memory Matrix
2,048 x 2,048
・
・
Column I/O
・
・
Column Decoder
Input
Data
Control
I/O7
A1 A2 A3 A14 A15 A16 A17 A18
・
・
CS#
Timing Pulse Generator
WE#
Read/Write Control
OE#
Operation Table
CS#
WE#
OE#
I/O0 to I/O7
Operation
H
X
X
High-Z
Standby
L
H
L
Dout
Read
L
L
X
Din
Write
L
H
H
High-Z
Output disable
Note 1.
H: VIH L:VIL
X: VIH or VIL
R10DS0217EJ0001 Rev.0.01
2013.09.10
Page 3 of 10
RMLV0408E Series
Preliminary
Absolute Maximum Ratings
Parameter
Power supply voltage relative to VSS
Symbol
VCC
Terminal voltage on any pin relative to VSS
VT
Power dissipation
PT
Operation temperature
Topr
Storage temperature range
Tstg
Storage temperature range under bias
Tbias
Note 2. -3.0V for pulse ≤ 30ns (full width at half maximum)
3. Maximum voltage is +4.6V.
Value
-0.5 to +4.6
unit
V
-0.5*2 to VCC+0.3*3
0.7
-40 to +85
-65 to +150
-40 to +85
V
W
°C
°C
°C
DC Operating Conditions
Parameter
Symbol
VCC
VSS
Input high voltage
VIH
Input low voltage
VIL
Ambient temperature range
Ta
Note 4. -3.0V for pulse ≤ 30ns (full width at half maximum)
Supply voltage
Min.
2.7
0
2.2
-0.3
-40
Typ.
3.0
0
─
─
─
Max.
3.6
0
VCC+0.3
0.6
+85
Unit
V
V
V
V
°C
Note
4
DC Characteristics
Parameter
Input leakage current
Symbol
Min.
Typ.
Max.
Unit
| ILI |
─
─
1
A
| ILO |
─
─
1
A
ICC
─
─
10
mA
ICC1
─
─
20
mA
ICC2
─
─
2.5
mA
ISB
─
0.1*5
0.3
mA
─
0.4*5
2
A
~+25°C
─
─
3
A
~+40°C
─
─
5
A
~+70°C
─
─
7
A
~+85°C
VOH
2.4
─
─
V
IOH = -1mA
VOH2
VCC-0.2
─
─
V
IOH = -0.1mA
VOL
─
─
0.4
V
IOL = 2.1mA
VOL2
─
─
0.2
V
IOL = 0.1mA
Output leakage current
Operating current
Average operating current
Standby current
Standby current
ISB1
Output high voltage
Output low voltage
Note
Test conditions
Vin = VSS to VCC
CS# =VIH or OE# =VIH or WE#= VIL,
VI/O = VSS to VCC
CS# =VIL,
Others = VIH/VIL, II/O = 0mA
Min. cycle, duty =100%, II/O = 0mA
CS# =VIL, Others = VIH/VIL
Cycle =1s, duty =100%, II/O = 0mA
CS# ≤ 0.2V,
VIH ≥ Vcc-0.2V, VIL ≤ 0.2V
CS# =VIH,
Others = VSS to VCC
Vin = VSS to VCC,
CS# ≥ VCC-0.2V
5. Typical parameter indicates the value for the center of distribution at 3.0V (Ta=25ºC), and not 100% tested.
Capacitance
(Vcc = 2.7V ~ 3.6V, f = 1MHz, Ta = -40 ~ +85°C*2)
Parameter
Symbol
Min.
Input capacitance
C in
─
Input / output capacitance
C I/O
─
Note 6. This parameter is sampled and not 100% tested.
R10DS0217EJ0001 Rev.0.01
2013.09.10
Typ.
─
─
Max.
8
10
Unit
pF
pF
Test conditions
Vin =0V
VI/O =0V
Note
6
6
Page 4 of 10
RMLV0408E Series
Preliminary
AC Characteristics
Test Conditions (Vcc = 2.7V ~ 3.6V, Ta = -40 ~ +85°C)




1.4V
Input pulse levels: VIL = 0.4V, VIH = 2.4V
Input rise and fall time: 5ns
Input and output timing reference level: 1.4V
Output load: See figures (Including scope and jig)
RL = 500 ohm
I/O
CL = 30 pF (-4S2)
CL = 50 pF (-5S2)
Read Cycle
Parameter
Read cycle time
Address access time
Chip select access time
Output enable to output valid
Output hold from address change
Chip select to output in low-Z
Output enable to output in low-Z
Chip deselect to output in high-Z
Output disable to output in high-Z
Symbol
tRC
tAA
tACS
tOE
tOH
tCLZ
tOLZ
tCHZ
tOHZ
RMLV0408EG**-4S2
Min.
45
─
─
─
10
10
5
0
0
Max.
─
45
45
22
─
─
─
18
18
RMLV0408EG**-5S2
Min.
55
─
─
─
10
10
5
0
0
Max.
─
55
55
30
─
─
─
20
20
Unit
Note
ns
ns
ns
ns
ns
ns
ns
ns
ns
7,8
7,8
7,8,9
7,8,9
Write Cycle
Parameter
Symbol
RMLV0408EG**-4S2
RMLV0408EG**-5S2
Unit
Note
Min.
Max.
Min.
Max.
Write cycle time
tWC
45
─
55
─
ns
Address valid to write end
tAW
35
─
50
─
ns
Chip select to write end
tCW
35
─
50
─
ns
Write pulse width
tWP
35
─
40
─
ns
10
Address setup time to write start
tAS
0
─
0
─
ns
Write recovery time from write end
tWR
0
─
0
─
ns
Data to write time overlap
tDW
25
─
25
─
ns
Data hold from write end
tDH
0
─
0
─
ns
Output enable from write end
tOW
5
─
5
─
ns
7
Output disable to output in high-Z
tOHZ
0
18
0
20
ns
7,9
Write to output in high-Z
tWHZ
0
18
0
20
ns
7,9
Note 7. This parameter is sampled and not 100% tested.
8. At any given temperature and voltage condition, tCHZ max is less than tCLZ min, and tOHZ max is less than tOLZ
min, for any device.
9. tCHZ, tOHZ and tWHZ are defined as the time when the I/O pins enter a high-impedance state and are not
referred to the I/O levels.
10. tWP is the interval between write start and write end.
A write starts when both of CS# and WE# become active
A write is performed during the overlap of a low CS#, a low WE#
A write ends when any of CS#, WE# becomes inactive.
R10DS0217EJ0001 Rev.0.01
2013.09.10
Page 5 of 10
RMLV0408E Series
Preliminary
Timing Waveforms
Read Cycle
tRC
Valid address
A0~18
tAA
tACS
CS#
tCHZ *11,12,13
tCLZ *12,13
WE#
VIH
WE# = “H” level
tOHZ *11,12,13
tOE
OE#
tOLZ
I/O0~7
High impedance
tOH
*12,13
Valid Data
Note 11. tCHZ and tOHZ are defined as the time when the I/O pins enter a high-impedance state and are not referred to
the I/O levels.
12. This parameter is sampled and not 100% tested.
13. At any given temperature and voltage condition, tCHZ max is less than tCLZ min, and tOHZ max is less than tOLZ
min, for any device.
R10DS0217EJ0001 Rev.0.01
2013.09.10
Page 6 of 10
RMLV0408E Series
Preliminary
Write Cycle (1) (WE# CLOCK, OE#=”H” while writing)
tWC
Valid address
A0~18
tCW
CS#
tAW
tWR
tWP *14
WE#
tAS
OE#
tWHZ *15,16
tOHZ *15,16
I/O0~7
*17
tDW
tDH
Valid Data
Note 14. tWP is the interval between write start and write end.
A write starts when both of CS# and WE# become active.
A write is performed during the overlap of a low CS# and a low WE#.
A write ends when any of CS# or WE# becomes inactive.
15. tOHZ and tWHZ are defined as the time when the I/O pins enter a high-impedance state and are not referred to
the I/O levels.
16. This parameter is sampled and not 100% tested.
17. During this period, I/O pins are in the output state so input signals must not be applied to the I/O pins.
R10DS0217EJ0001 Rev.0.01
2013.09.10
Page 7 of 10
RMLV0408E Series
Preliminary
Write Cycle (2) (WE# CLOCK, OE# Low Fixed)
tWC
Valid address
A0~18
tCW
CS#
tAW
tWP
WE#
OE#
OE# = “L” level
tWR
*18,
tAS
VIL
tWHZ
I/O0~7
*21
*19,20
tOW
Valid Data
tDW
*21
tDH
Note 18. tWP is the interval between write start and write end.
A write starts when both of CS# and WE# become active.
A write is performed during the overlap of a low CS# and a low WE#.
A write ends when any of CS# or WE# becomes inactive.
19. tWHZ is defined as the time when the I/O pins enter a high-impedance state and are not referred to the I/O
levels.
20. This parameter is sampled and not 100% tested.
21. During this period, I/O pins are in the output state so input signals must not be applied to the I/O pins.
R10DS0217EJ0001 Rev.0.01
2013.09.10
Page 8 of 10
RMLV0408E Series
Preliminary
Write Cycle (3) (CS# CLOCK)
tWC
Valid address
A0~18
tAW
tAS
tWR
tCW
CS#
tWP *22
WE#
OE#
VIH
OE# = “H” level
tDW
I/O0~7
tDH
Valid Data
Note 22. tWP is the interval between write start and write end.
A write starts when both of CS# and WE# become active.
A write is performed during the overlap of a low CS# and a low WE#.
A write ends when any of CS# or WE# becomes inactive.
R10DS0217EJ0001 Rev.0.01
2013.09.10
Page 9 of 10
RMLV0408E Series
Preliminary
Low VCC Data Retention Characteristics
Test conditions*24
Parameter
Symbol
Min.
Typ.
Max.
Unit
VCC for data retention
VDR
1.5
─
─
V
Vin ≥ 0V,
CS# ≥ VCC-0.2V
─
0.4*23
2
A
~+25°C
─
─
3
A
~+40°C
─
─
5
A
~+70°C
─
─
7
A
~+85°C
Data retention current
ICCDR
VCC=3.0V, Vin ≥ 0V,
CS# ≥ Vcc-0.2V
Chip deselect time to data retention
tCDR
0
─
─
ns
See retention waveform.
Operation recovery time
tR
5
─
─
ms
Note 23. Typical parameter indicates the value for the center of distribution at 3.0V (Ta=25ºC), and not 100% tested.
24. CS# controls address buffer, WE# buffer, OE# buffer, and I/O buffer. If CS# controls data retention mode, Vin
levels (address, WE#, OE#, I/O) can be in the high-impedance state.
Low Vcc Data Retention Timing Waveforms (CS# controlled)
CS# Controlled
VCC
tCDR
2.2V
2.7V
2.7V
VDR
tR
2.2V
CS# ≥ VCC - 0.2V
CS#
R10DS0217EJ0001 Rev.0.01
2013.09.10
Page 10 of 10
Revision History
RMLV0408E Series Data Sheet
Description
Rev.
Date
0.01
2013.09.10
Page
─
Summary
Preliminary First Edition issued
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Colophon 2.2