High Speed Characterization Report

High Speed Characterization Report
GFZ-XX-03-G-10-AD
Description:
Ultra Low Profile One Piece Array,
.050” (1.27mm) Pitch, 3 mm Stack Height
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Table of Contents
Connector Overview ........................................................................................................ 1 Connector System Speed Rating .................................................................................... 1 Frequency Domain Data Summary ................................................................................. 2 Table 1 - Single-Ended 1:1 S/G Pattern Performance ................................................. 2 Table 2 - Single-Ended 2:1 S/G Pattern Performance ................................................. 3 Table 3 - Differential Optimal Horizontal Performance ................................................. 4 Table 4 - Differential Optimal Vertical Performance ..................................................... 5 Table 5 - Differential High Density Vertical Performance ............................................. 6 Bandwidth Charts – Single-Ended & Differential Insertion Loss .................................. 7 Time Domain Data Summary .......................................................................................... 8 Table 6 – Single-End Impedance () – 1:1 S/G Pattern .............................................. 8 Table 7 – Single-End Impedance () – 2:1 S/G Pattern .............................................. 8 Table 8 – Differential Impedance () – Optimal Horizontal .......................................... 9 Table 9 – Differential Impedance () – Optimal Vertical .............................................. 9 Table 10 – Differential Impedance () – High Density Vertical .................................. 10 Table 16 - Propagation Delay (Mated Connector) ...................................................... 16 Characterization Details ................................................................................................ 17 Differential and Single-Ended Data............................................................................ 17 Connector Signal to Ground Ratio ............................................................................. 17 Frequency Domain Data ............................................................................................ 20 Time Domain Data ..................................................................................................... 21 Appendix A – Frequency Domain Response Graphs .................................................... 22 Single-Ended Application – Insertion Loss ................................................................ 22 Single-Ended Application – Return Loss ................................................................... 22 Single-Ended 1:1 S/G Pattern Application – NEXT.................................................... 23 Single-Ended 1:1 S/G Pattern Application – FEXT .................................................... 23 Single-Ended 2:1 S/G Pattern Application – NEXT.................................................... 24 Single-Ended 2:1 S/G Pattern Application – FEXT .................................................... 24 Differential Application – Insertion Loss ..................................................................... 25 Differential Application – Return Loss ........................................................................ 25 Differential Optimal Horizontal Application – NEXT ................................................... 26 Differential Optimal Horizontal Application – FEXT.................................................... 26 Differential Optimal Vertical Application – NEXT ....................................................... 27 Differential Optimal Vertical Application – FEXT ........................................................ 27 Differential High Density Vertical Application – NEXT ............................................... 28 Differential High Density Vertical Application – FEXT ................................................ 28 Appendix B – Time Domain Response Graphs ............................................................. 29 Single-Ended Application – Input Pulse ..................................................................... 29 Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:ii
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Single-Ended 1:1 S/G Pattern Application – Impedance ........................................... 29 Single-Ended 1:1 S/G Pattern Application – Propagation Delay ................................ 30 Single-Ended 2:1 S/G Pattern Application – Impedance ........................................... 30 Single-Ended 2:1 S/G Pattern Application – Propagation Delay ................................ 31 Single-Ended 1:1 S/G Pattern Application – NEXT, AG19_AG21 ............................. 31 Single-Ended 1:1 S/G Pattern Application – FEXT, AG19_BG21 .............................. 32 Single-Ended 1:1 S/G Pattern Application – NEXT, AG19_AE19 .............................. 32 Single-Ended 1:1 S/G Pattern Application – FEXT, AG19_BE19 .............................. 33 Single-Ended 1:1 S/G Pattern Application – NEXT, AG19_AF18 .............................. 33 Single-Ended 1:1 S/G Pattern Application – FEXT, AG19_BF18 .............................. 34 Single-Ended 2:1 S/G Pattern Application – NEXT, AE19_AE18 .............................. 34 Single-Ended 2:1 S/G Pattern Application – FEXT, AE19_BE18 .............................. 35 Single-Ended 2:1 S/G Pattern Application – NEXT, AE19_AF19 .............................. 35 Single-Ended 2:1 S/G Pattern Application – FEXT, AE19_BF19 ............................... 36 Single-Ended 2:1 S/G Pattern Application – NEXT, AE19_AF20 .............................. 36 Single-Ended 2:1 S/G Pattern Application – FEXT, AE19_BF20 ............................... 37 Differential Application – Input Pulse ......................................................................... 37 Differential Optimal Horizontal Application – Impedance ........................................... 38 Differential Optimal Horizontal Application – Propagation Delay ............................... 38 Differential Optimal Vertical Application – Impedance ............................................... 39 Differential Optimal Vertical Application – Propagation Delay ................................... 39 Differential High Density Vertical Application – Impedance ....................................... 40 Differential High Density Vertical Application – Propagation Delay............................ 40 Diff Optimal Horizontal Application – NEXT, AE17,AE18_AE21,AE22 ...................... 41 Diff Optimal Horizontal Application – FEXT, AE17,AE18_BE21,BE22 ...................... 41 Diff Optimal Horizontal Application – NEXT, AE17,AE18_AG17,AG18 ..................... 42 Diff Optimal Horizontal Application – FEXT, AE17,AE18_BG17,BG18...................... 42 Diff Optimal Horizontal Application – NEXT, AE17,AE18_AD15,AD16...................... 43 Diff Optimal Horizontal Application – FEXT, AE17,AE18_BD15,BD16 ...................... 43 Diff Optimal Vertical Application – NEXT, AC20,AD20_AC18,AD18 ......................... 44 Diff Optimal Vertical Application – FEXT, AC20,AD20_BC18,BD18 .......................... 44 Diff Optimal Vertical Application – NEXT, AC20,AD20_AG20,AH20 ......................... 45 Diff Optimal Vertical Application – FEXT, AC20,AD20_BG20,BH20 ......................... 45 Diff Optimal Vertical Application – NEXT, AC20,AD20_AE21,AF21 .......................... 46 Diff Optimal Vertical Application – FEXT, AC20,AD20_BE21,BF21 .......................... 46 Diff High Density Vertical Application – NEXT, AG20,AH20_AG22,AH22 ................. 47 Diff High Density Vertical Application – FEXT, AG20,AH20_BG22,BH22 ................. 47 Diff High Density Vertical Application – NEXT, AG20,AH20_AD20,AE20 ................. 48 Diff High Density Vertical Application – FEXT, AG20,AH20_BD20,BE20 .................. 48 Diff High Density Vertical Application – NEXT, AD20,AE20_AE19,AF19 .................. 49 Diff High Density Vertical Application – FEXT, AD20,AE20_BE19,BF19................... 49 Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:iii
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Appendix C – Product and Test System Descriptions ................................................... 50 Product Description ................................................................................................... 50 Test System Description ............................................................................................ 50 PCB-106434-SIG-XX Test Fixtures ........................................................................... 50 PCB-106434-SIG-XX PCB Layout Panel................................................................... 51 PCB Fixtures ............................................................................................................. 51 Calibration Board ....................................................................................................... 54 Appendix D – Test and Measurement Setup................................................................. 56 N5230C Measurement Setup .................................................................................... 56 Test Instruments ........................................................................................................ 56 Test Cables & Adapters ............................................................................................. 56 DSA8200 Measurement Setup .................................................................................. 57 Test Instruments ........................................................................................................ 57 Test Cables & Adapters ............................................................................................. 57 Appendix E - Frequency and Time Domain Measurements .......................................... 58 Frequency (S-Parameter) Domain Procedures ......................................................... 58 Time Domain Procedures .......................................................................................... 58 Propagation Delay (TDT) ....................................................................................... 58 Near-End Crosstalk (TDT) & Far End Crosstalk (TDT) .......................................... 58 Impedance (TDR)................................................................................................... 59 Appendix F – Glossary of Terms ................................................................................... 60 Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:iv
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Connector Overview
GFZ is an ultra-low profile, 1.27 mm pitch interconnect system for elevated high-speed
board-to-board applications. The GFZ is ideal for board stacking, module-to-board and
LGA interfaces and up to 400 I/Os. This report reflects the hi-speed electrical characteristics specific to a mated 3 mm stack height GFZ test system.
Connector System Speed Rating
GFZ Series, 1.27 mm pitch, 3 mm Stack Height.
Signaling
Speed Rating
Single-Ended: 1:1 S/G
16 GHz/ 32 Gbps
Single-Ended: 2:1 S/G
13.5 GHz/ 27 Gbps
Differential: Optimal Horizontal
16.5 GHz/ 33 Gbps
Differential: Optimal Vertical
15.5 GHz/ 31 Gbps
Differential: High Density Vertical
16.5 GHz/ 33 Gbps
The Speed Rating is based on the -3 dB insertion loss point of the connector system.
The -3 dB point can be used to estimate usable system bandwidth in a typical, two-level
signaling environment.
To calculate the Speed Rating, the measured -3 dB point is rounded up to the nearest
half-GHz level. The up-rounding corrects for a portion of the test board’s trace loss,
since a short length of trace loss is included in the loss data in this report. The resulting
loss value is then doubled to determine the approximate maximum data rate in Gigabits
per second (Gbps).
For example, a connector with a -3 dB point of 7.8 GHz would have a Speed Rating of 8
GHz/ 16 Gbps. A connector with a -3 dB point of 7.2 GHz would have a Speed Rating
of 7.5 GHz/15 Gbps.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:1
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Frequency Domain Data Summary
Table 1 - Single-Ended 1:1 S/G Pattern Performance
Test Parameter
Driver
Receiver
Insertion Loss
AG19
BG19
<-3dB to 15.7 GHz
Return Loss
AG19
AG19
>10dB to 12.3 GHz
AG19
AG21
<-20dB to 20 GHz
AG19
AE19
<-20dB to 20 GHz
AG19
AF18
<-20dB to 15.2 GHz
AG19
BG21
<-20dB to 20 GHz
AG19
BE19
<-20dB to 16.4 GHz
AG19
BF18
<-20dB to 16.1 GHz
Near-End Crosstalk
Far-End Crosstalk
Single-Ended 1:1 S/G Pattern Pin Map
Insertion Loss & Return Loss
Crosstalk
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:2
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Table 2 - Single-Ended 2:1 S/G Pattern Performance
Test Parameter
Driver
Receiver
Insertion Loss
AE19
BE19
-3dB @ 13.3 GHz
Return Loss
AE19
AE19
>10dB to 12.8 GHz
AE19
AE18
<-20dB to 2.3 GHz
AE19
AF19
<-20dB to 2.0 GHz
AE19
AF20
<-20dB to 13.4 GHz
AE19
BE18
<-20dB to 4.9 GHz
AE19
BF19
<-20dB to 6.7 GHz
AE19
BF20
<-20dB to 10.6 GHz
Near-End Crosstalk
Far-End Crosstalk
Single-Ended 2:1 S/G Pattern Pin Map
Insertion Loss & Return Loss
Crosstalk
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:3
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Table 3 - Differential Optimal Horizontal Performance
Test Parameter
Driver
Receiver
Insertion Loss
AE17,AE18
BE17,BE18
-3dB @ 16.3 GHz
Return Loss
AE17,AE18
AE17,AE18
>10dB to 12.2 GHz
AE17,AE18
AE21,AE22
<-20dB to 20 GHz
AE17,AE18
AG17,AG18
<-20dB to 20 GHz
AE17,AE18
AD15,AD16
<-20dB to 20 GHz
AE17,AE18
BE21,BE22
<-20dB to 20 GHz
AE17,AE18
BG17,BG18
<-20dB to 17.1 GHz
AE17,AE18
BD15,BD16
<-20dB to 17.4 GHz
Near-End Crosstalk
Far-End Crosstalk
Differential Optimal Horizontal Pin Map
Insertion Loss & Return Loss Crosstalk
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:4
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Table 4 - Differential Optimal Vertical Performance
Test Parameter
Driver
Receiver
Insertion Loss
AC20,AD20
BC20,BD20
-3dB @ 15.5 GHz
Return Loss
AC20,AD20
AC20,AD20
>10dB to 11.0 GHz
AC20,AD20
AC18,AD18
<-20dB to 20 GHz
AC20,AD20
AG20,AH20
<-20dB to 20 GHz
AC20,AD20
AE21,AF21
<-20dB to 20 GHz
AC20,AD20
BC18,BD18
<-20dB to 20 GHz
AC20,AD20
BG20,BH20
<-20dB to 20 GHz
AC20,AD20
BE21,BF21
<-20dB to 15.7 GHz
Near-End Crosstalk
Far-End Crosstalk
Differential Optimal Vertical Pin Map
Insertion Loss & Return Loss Crosstalk
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:5
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Table 5 - Differential High Density Vertical Performance
Test Parameter
Driver
Receiver
Insertion Loss
AG20,AH20
BG20,BH20
-3dB @ 16.1 GHz
Return Loss
AG20,AH20
AG20,AH20
>10dB to 10.9 GHz
AG20,AH20
AG22,AH22
<-20dB to 20 GHz
AG20,AH20
AD20,AE20
<-20dB to 20 GHz
AD20,AE20
AE19,AF19
<-20dB to 20 GHz
AG20,AH20
BG22,BH22
<-20dB to 20 GHz
AG20,AH20
BD20,BE20
<-20dB to 20 GHz
AD20,AE20
BE19,BF19
<-20dB to 20 GHz
Near-End Crosstalk
Far-End Crosstalk
Differential High Density Vertical Pin Map
Insertion Loss & Return Loss Crosstalk
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:6
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Bandwidth Charts – Single-Ended & Differential Insertion Loss
GFZ Array Series
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:7
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Time Domain Data Summary
Table 6 – Single-End Impedance () – 1:1 S/G Pattern
Signal
Risetime
30 ps
50 ps
100 ps
250 ps
500 ps
Maximum
Impedance
55.17
54.14
53.05
52.80
52.42
Minimum
Impedance
50.92
51.03
51.06
51.17
51.66
Table 7 – Single-End Impedance () – 2:1 S/G Pattern
Signal
Risetime
30 ps
50 ps
100 ps
250 ps
500 ps
Maximum
Impedance
55.09
54.32
53.42
53.12
53.11
Minimum
Impedance
49.32
49.41
49.43
49.80
50.46
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:8
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Table 8 – Differential Impedance () – Optimal Horizontal
Signal
Risetime
30 ps
50 ps
100 ps
250 ps
500 ps
Maximum
Impedance
104.97
104.93
104.87
104.67
103.69
Minimum
Impedance
92.27
93.88
95.52
98.68
100.68
Table 9 – Differential Impedance () – Optimal Vertical
Signal
Risetime
30 ps
50 ps
100 ps
250 ps
500 ps
Maximum
Impedance
104.60
104.53
104.48
104.39
103.57
Minimum
Impedance
91.02
92.78
95.35
98.96
100.89
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:9
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Table 10 – Differential Impedance () – High Density Vertical
Signal
Risetime
30 ps
50 ps
100 ps
250 ps
500 ps
Maximum
Impedance
105.41
105.41
105.43
105.30
104.34
Minimum
Impedance
91.67
93.30
95.71
99.54
101.33
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:10
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Table 11 - Single-Ended Crosstalk (%) – 1:1 S/G Pattern
Input(tr)
NEXT
FEXT
Driver
Receiver
30 ps
50 ps
100 ps
AG19
AG21
0.67
0.46
0.35
AG19
AE19
0.97
0.66
0.47
AG19
AF18
2.92
2.15
1.50
AG19
BG21
1.17
0.76
0.42
AG19
BE19
1.53
0.94
0.48
AG19
BF18
3.17
1.95
1.02
Single-Ended 1:1 S/G Pattern Crosstalk Pin Map
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:11
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Table 12 - Single-Ended Crosstalk (%) – 2:1 S/G Pattern
Input(tr)
NEXT
FEXT
Driver
Receiver
30 ps
50 ps
100 ps
AE19
AE18
8.82
7.74
6.06
AE19
AF19
12.10
9.95
6.96
AE19
AF20
4.35
3.39
2.39
AE19
BE18
10.55
7.19
3.92
AE19
BF19
8.09
5.50
3.00
AE19
BF20
4.19
3.18
1.89
Single-Ended 2:1 S/G Pattern Crosstalk Pin Map
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:12
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Table 13 - Differential Crosstalk (%) – Optimal Horizontal
Input(tr)
NEXT
FEXT
Driver
Receiver
30 ps
50 ps
100 ps
AE17,AE18
AE21,AE22
0.16
<0.1
<0.1
AE17,AE18
AG17,AG18
0.43
0.27
0.17
AE17,AE18
AD15,AD16
1.12
0.85
0.58
AE17,AE18
BE21,BE22
0.42
0.29
0.16
AE17,AE18
BG17,BG18
0.81
0.43
0.21
AE17,AE18
BD15,BD16
0.46
0.25
<0.1
Differential Optimal Horizontal Crosstalk Pin Map
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:13
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Table 14 - Differential Crosstalk (%) – Optimal Vertical
Input(tr)
NEXT
FEXT
Driver
Receiver
30 ps
50 ps
100 ps
AC20,AD20
AC18,AD18
0.18
0.12
0.10
AC20,AD20
AG20,AH20
<0.1
<0.1
<0.1
AC20,AD20
AE21,AF21
0.84
0.63
0.42
AC20,AD20
BC18,BD18
0.45
0.28
0.15
AC20,AD20
BG20,BH20
<0.1
<0.1
<0.1
AC20,AD20
BE21,BF21
0.89
0.56
0.26
Differential Optimal Vertical Crosstalk Pin Map
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:14
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Table 15 - Differential Crosstalk (%) – High Density Vertical
Input(tr)
NEXT
FEXT
Driver
Receiver
30 ps
50 ps
100 ps
AG20,AH20
AG22,AH22
0.30
0.28
0.22
AG20,AH20
AD20,AE20
0.35
0.22
0.16
AD20,AE20
AE19,AF19
1.31
1.17
0.78
AG20,AH20
BG22,BH22
0.69
0.45
0.27
AG20,AH20
BD20,BE20
0.49
0.28
0.13
AD20,AE20
BE19,BF19
0.46
0.30
<0.1
Differential High Density Vertical Crosstalk Pin Map
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:15
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Table 16 - Propagation Delay (Mated Connector)
Single-Ended: 1:1 S/G
60 ps
Single-Ended: 2:1 S/G
64 ps
Differential: Optimal Horizontal
54 ps
Differential: Optimal Vertical
54 ps
Differential: High Density Vertical
55 ps
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:16
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Characterization Details
This report presents data that characterizes the signal integrity response of a connector
pair in a controlled printed circuit board (PCB) environment. All efforts are made to reveal typical best-case responses inherent to the system under test (SUT).
In this report, the SUT includes the connector pair and footprint effects on a typical multi-layer PCB. PCB effects (trace loss) are de-embedded from test data. Board related
effects, such as pad-to-ground capacitance, are included in the data presented in this
report.
Additionally, intermediate test signal connections can mask the connector’s true performance. Such connection effects are minimized by using high performance test cables
and adapters. Where appropriate, calibration and de-embedding routines are also used
to reduce residual effects.
Differential and Single-Ended Data
Most Samtec connectors can be used successfully in both differential and single-ended
applications. However, electrical performance will differ depending on the signal drive
type. In this report, data is presented for both differential and single-ended drive scenarios.
Connector Signal to Ground Ratio
Samtec connectors are most often designed for generic applications and can be implemented using various signal and ground pin assignments. In high speed systems, provisions must be made in the interconnect for signal return currents. Such paths are often
referred to as “ground”. In some connectors, a ground plane or blade, or an outer shield,
is used as the signal return, while in others, connector pins are used as signal returns.
Various combinations of signal pins, ground blades, and shields can also be utilized.
Electrical performance can vary significantly depending upon the number and location
of ground pins.
In general, the more pins dedicated to ground, the better electrical performance will be.
However dedicating pins to ground reduces signal density of a connector. Therefore,
care must be taken when choosing signal/ground ratios in cost or density-sensitive applications.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:17
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
For this connector, the following array configurations are evaluated:
Open pin field
Signal pin field
A 40
Grounded pin field
G
T
50 ohm termination field
A 23 A 22 A 21 A 20 A 19 A 18 A 17 A 16
A1
T
T
T
T
G E19 G
G
T
G
T
T
A 40
T
T
T
G F18 G
G G21 G G19 G
T
K40
G
G
T
T
T
T
K23 K22 K21 K20 K19 K18 K17 K16
A 22 A 21 A 20 A 19 A 18
k1
A1
T
T
T
T
G
T
G F20F19 G
T
T
G E19E18 G
T
G
T
T
T
T
K40
K22 K21 K20 K19 K18
k1
Single-Ended Impedance (denoted by green circles):
 1:1 S/G ratio
 2:1 S/G ratio
Single-Ended Crosstalk (denoted by red circles):
 1:1 S/G ratio
 2:1 S/G ratio
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:18
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
A 40
A 26 A 25 A 24 A 23 A 22 A 21 A 20 A 19 A 18 A 17 A 16 A 15 A 14 A 13 A 12 A 11
T
K40
A 40
T
T
T
G
G
T
T
T
G
G E22 E21 G
T
T
T
T
T
G
G
T
T
T
T
G
G D16 D15 G
G
G E18 E17 G
G
G
G
G
G
T
T
T
T
T
T
G
G G18 G17 G
G
T
T
T
G
G
T
T
T
T
T
T
T
T
T
K26 K25 K24 K23 K22 K21 K20 K19 K18 K17 K16 K15 K14 K13 K12 K11
A 24 A 23 A 22 A 21 A 20 A 19 A 18
T
T
G
T
G
T
T
G
T
G
T
T
G C20 G C18 G
T
T
G D20 G D18 G
T
T
G F21 G
T
T
G
T
T
T
G
G G20 G
T
G H20 G
T
T
G
T
T
G
T
k1
A1
T
G E21 G
A1
K40
K24 K23 K22 K21 K20 K19 K18
k1
A 40
A 24 A 23 A 22 A 21 A 20 A 19 A 18
A1
T
G
T
T
T
G
T
G
T
G
G
T
G D20 G
T
T
T
T E20 E19 T
T
G
T
G
T
T
T
G G22 G G20 G
T
T H22 T H20 T
T
T
K40
G
G F19 G
T
G
T
G
G
T
G
T
T
K24 K23 K22 K21 K20 K19 K18
k1
Differential Impedance (denoted by green circles):
 Optimal Horizontal
 Optimal Vertical
 High Density Vertical
Differential Crosstalk (denoted by red circles):
 Optimal Horizontal
 Optimal Vertical
 High Density Vertical
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:19
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Only one single-ended signal or differential pair was driven for crosstalk measurements.
Other configurations can be evaluated upon request. Please contact [email protected]
for more information.
In a real system environment, active signals might be located at the outer edges of the
signal contacts of concern, as opposed to the ground signals utilized in laboratory testing. For example, in a single-ended system, a pin-out of “SSSS”, or four adjacent single
ended signals might be encountered as opposed to the “GSG” and “GSSG” configurations tested in the laboratory. Electrical characteristics in such applications could vary
slightly from laboratory results. However, in most applications, performance can safely
be considered equivalent.
Signal Edge Speed (Rise Time):
In pulse signaling applications, the perceived performance of the interconnect can vary
significantly depending on the edge rate or rise time of the exciting signal. For this report, the fastest rise time used was 30 ps. Generally, this should demonstrate the worstcase performance.
In many systems, the signal edge rate will be significantly slower at the connector than
at the driver launch point. To estimate interconnect performance at other edge rates,
data is provided for several rise times between 30ps and 100ps for crosstalk measurements and between 30ps and 500ps for impedance measurements.
For this report, measured rise times were at 10%-90% signal levels.
Frequency Domain Data
Frequency Domain parameters are helpful in evaluating the connector system’s signal
loss and crosstalk characteristics across a range of sinusoidal frequencies. In this report, parameters presented in the Frequency Domain are Insertion Loss, Return Loss,
and Near-End and Far-End Crosstalk. Other parameters or formats, such as VSWR or
S-Parameters, may be available upon request. Please contact our Signal Integrity
Group at [email protected] for more information.
Frequency performance characteristics for the SUT are generated directly from network
analyzer measurements.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:20
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Time Domain Data
Time Domain parameters indicate impedance mismatch versus length, signal propagation time and crosstalk in a pulsed signal environment.
Impedance mismatch versus length is measured by DSA8200 Digital Serial Analyzer.
Board related effects, such as pad-to-ground capacitance and trace loss, are included in
the data presented in this report. The impedance data is provided in Appendix E of this
report.
The measured S-Parameters from the network analyzer are post-processed using Agilent Advanced Design System to obtain the time domain response for signal propagation time and crosstalk. The Time Domain procedure is provided in Appendix E of this
report. Parameters or formats not included in this report may be available upon request.
Please contact our Signal Integrity Group at [email protected] for more information.
In this report, propagation delay is defined as the signal propagation time through the
connector and connector footprint. It includes 8 mils PCB trace on each side of the test
board. Delay is measured at 100 picoseconds signal rise-time. Delay is calculated as
the difference in time measured between the 50% amplitude levels of the input and output pulses.
Crosstalk or coupled noise data is provided for various signal configurations. All measurements are single disturber. Crosstalk is calculated as a ratio of the input line voltage
to the coupled line voltage. The input line is sometimes described as the active or drive
line. The coupled line is sometimes described as the quiet or victim line. Crosstalk ratio
is tabulated in this report as a percentage. Measurements are made at both the nearend and far-end of the SUT.
Data for other configurations may be available. Please contact our Signal Integrity
Group at [email protected] for further information.
As a rule of thumb, 10% crosstalk levels are often used as a general first pass limit for
determining acceptable interconnect performance. However, modern system crosstalk
tolerance can vary greatly. For advice on connector suitability for specific applications,
please contact our Signal Integrity Group at [email protected].
Additional information concerning test conditions and procedures is located in the appendices of this report. Further information may be obtained by contacting our Signal
Integrity Group at [email protected].
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:21
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Appendix A – Frequency Domain Response Graphs
Single-Ended Application – Insertion Loss
Single-Ended Application – Return Loss
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:22
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Single-Ended 1:1 S/G Pattern Application – NEXT
Single-Ended 1:1 S/G Pattern Application – FEXT
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:23
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Single-Ended 2:1 S/G Pattern Application – NEXT
Single-Ended 2:1 S/G Pattern Application – FEXT
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:24
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Differential Application – Insertion Loss
Differential Application – Return Loss
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:25
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Differential Optimal Horizontal Application – NEXT
Differential Optimal Horizontal Application – FEXT
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:26
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Differential Optimal Vertical Application – NEXT
Differential Optimal Vertical Application – FEXT
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:27
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Differential High Density Vertical Application – NEXT
Differential High Density Vertical Application – FEXT
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:28
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Appendix B – Time Domain Response Graphs
Single-Ended Application – Input Pulse
Single-Ended 1:1 S/G Pattern Application – Impedance
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:29
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Single-Ended 1:1 S/G Pattern Application – Propagation Delay
Single-Ended 2:1 S/G Pattern Application – Impedance
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:30
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Single-Ended 2:1 S/G Pattern Application – Propagation Delay
Single-Ended 1:1 S/G Pattern Application – NEXT, AG19_AG21
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:31
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Single-Ended 1:1 S/G Pattern Application – FEXT, AG19_BG21
Single-Ended 1:1 S/G Pattern Application – NEXT, AG19_AE19
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:32
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Single-Ended 1:1 S/G Pattern Application – FEXT, AG19_BE19
Single-Ended 1:1 S/G Pattern Application – NEXT, AG19_AF18
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:33
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Single-Ended 1:1 S/G Pattern Application – FEXT, AG19_BF18
Single-Ended 2:1 S/G Pattern Application – NEXT, AE19_AE18
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:34
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Single-Ended 2:1 S/G Pattern Application – FEXT, AE19_BE18
Single-Ended 2:1 S/G Pattern Application – NEXT, AE19_AF19
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:35
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Single-Ended 2:1 S/G Pattern Application – FEXT, AE19_BF19
Single-Ended 2:1 S/G Pattern Application – NEXT, AE19_AF20
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:36
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Single-Ended 2:1 S/G Pattern Application – FEXT, AE19_BF20
Differential Application – Input Pulse
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:37
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Differential Optimal Horizontal Application – Impedance
Differential Optimal Horizontal Application – Propagation Delay
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:38
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Differential Optimal Vertical Application – Impedance
Differential Optimal Vertical Application – Propagation Delay
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:39
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Differential High Density Vertical Application – Impedance
Differential High Density Vertical Application – Propagation Delay
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:40
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Diff Optimal Horizontal Application – NEXT, AE17,AE18_AE21,AE22
Diff Optimal Horizontal Application – FEXT, AE17,AE18_BE21,BE22
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:41
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Diff Optimal Horizontal Application – NEXT, AE17,AE18_AG17,AG18
Diff Optimal Horizontal Application – FEXT, AE17,AE18_BG17,BG18
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:42
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Diff Optimal Horizontal Application – NEXT, AE17,AE18_AD15,AD16
Diff Optimal Horizontal Application – FEXT, AE17,AE18_BD15,BD16
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:43
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Diff Optimal Vertical Application – NEXT, AC20,AD20_AC18,AD18
Diff Optimal Vertical Application – FEXT, AC20,AD20_BC18,BD18
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:44
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Diff Optimal Vertical Application – NEXT, AC20,AD20_AG20,AH20
Diff Optimal Vertical Application – FEXT, AC20,AD20_BG20,BH20
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:45
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Diff Optimal Vertical Application – NEXT, AC20,AD20_AE21,AF21
Diff Optimal Vertical Application – FEXT, AC20,AD20_BE21,BF21
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:46
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Diff High Density Vertical Application – NEXT, AG20,AH20_AG22,AH22
Diff High Density Vertical Application – FEXT, AG20,AH20_BG22,BH22
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:47
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Diff High Density Vertical Application – NEXT, AG20,AH20_AD20,AE20
Diff High Density Vertical Application – FEXT, AG20,AH20_BD20,BE20
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:48
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Diff High Density Vertical Application – NEXT, AD20,AE20_AE19,AF19
Diff High Density Vertical Application – FEXT, AD20,AE20_BE19,BF19
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:49
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Appendix C – Product and Test System Descriptions
Product Description
Product test samples are 3 mm stack height GFZ Series connectors. The part number is
GFZ-40-03-G-10-AD. The GFZ Series is an ultra-low profile micro array connector designed for single-ended signals with various options for differential signaling configurations. The micro array is 10 row providing 40 signal pins per row. A photo of the test articles mounted to SI test boards is shown below.
Test System Description
The test fixtures are composed of four-layer FR-4 material with 50Ω signal trace and
pad configurations designed for the electrical characterization of Samtec high speed
connector products. A PCB mount SMA connector is used to interface the VNA test cables to the test fixtures. Optimization of the SMA launch was performed using full wave
simulation tools to minimize reflections. Ten test fixtures are specific to the GFZ Series
connector set and identified by part numbers PCB-106434-SIG-01A and B to PCB106434-SIG-05A and B. Calibration standards specific to the GFZ Series are located on
the calibration boards PCB-106434-SIG-06. To keep trace lengths short, five different
test board sets were required to access the necessary signal pins.
PCB-106434-SIG-XX Test Fixtures
Shown below is a photograph of one of the five test board sets together with the GFZ
connector.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:50
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
PCB-106434-SIG-XX PCB Layout Panel
Artwork of the PCB design is shown below.
PCB Fixtures
The test fixtures used are as follows:
PCB-106434-SIG-01A – GFZ Series Test Board for SE 1:1 S/G Pattern
PCB-106434-SIG-01B – GFZ Series Test Board for SE 1:1 S/G Pattern
PCB-106434-SIG-02A – GFZ Series Test Board for SE 2:1 S/G Pattern
PCB-106434-SIG-02B – GFZ Series Test Board for SE 2:1 S/G Pattern
PCB-106434-SIG-03A – GFZ Series Test Board for Differential Optimal Horizontal
PCB-106434-SIG-03B – GFZ Series Test Board for Differential Optimal Horizontal
PCB-106434-SIG-04A – GFZ Series Test Board for Differential Optimal Vertical
PCB-106434-SIG-04B – GFZ Series Test Board for Differential Optimal Vertical
PCB-106434-SIG-05A – GFZ Series Test Board for Differential High Density Vertical
PCB-106434-SIG-05B – GFZ Series Test Board for Differential High Density Vertical
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:51
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:52
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:53
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Calibration Board
Test fixture losses and test point reflections were removed from the data by use of Automatic Fixture Removal (AFR) application. The calibration board is shown below. The
measurements were performed under SOLT calibration and the test board effects were
included in the measurements. AFR application extracts fixture S-parameters from 2X
THRU measurement and performs de-embedding on the DUT+Fixture measurement to
characterize only the DUT.
Thru line – 2984 mils
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:54
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
All traces on the test boards are length matched to 1.5" measured from the edge of the
pad to the SMA. The AFR application effectively removes 1.492" of test board trace effects. This means that 8 mils of test board trace length effects are included in the measurement. The S-Parameter measurement includes:
A- The GFZ Series connector
B- Test board vias and pads (footprint effects)
C- 8 mils of 10.2 mil wide microstrip trace
The figure below shows the location of the measurement reference plane.
C
B
Measurement
reference plane
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:55
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Appendix D – Test and Measurement Setup
For frequency domain measurements, the test instrument is the Agilent N5230C PNA-L
network analyzer. Frequency domain data and graphs are extracted from the instrument
by AFR application. Post-processed time domain data and graphs are generated using
convolution algorithms within Agilent ADS. The network analyzer is configured as follows:
Start Frequency – 300 KHz
Stop Frequency – 20 GHz
Number of points -1601
IFBW – 1 KHz
With these settings, the measurement time is approximately 20 seconds.
N5230C Measurement Setup
Test Instruments
QTY Description
1
Agilent N5230C PNA-L Network Analyzer (300 KHz to 20 GHz)
1
Agilent N4433A ECAL Module (300 KHz to 20 GHz)
Test Cables & Adapters
QTY Description
4
Gore OWD01D02039-4 (DC-26.5 GHz)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:56
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
For impedance measurements, the test instrument is the Tektronix DSA8200 Digital Serial Analyzer mainframe and 80E04 sampling module. The impedance data and profiles
are obtained directly from the instrument. The Digital Analyzer is configured as follows:
Vertical Scale:
Offset:
Horizontal Scale:
Record Length:
Averages:
Single-Ended Signal
2 ohm / Div:
Default / Scroll
200ps/ Div
4000
≥ 16
Differential Signal
5 ohm / Div:
Default / Scroll
200ps/ Div
4000
≥ 16
DSA8200 Measurement Setup
Test Instruments
QTY Description
1
Tektronix DSA8200 Digital Serial Analyzer
2
Tektronix 80E04 Dual Channel 20 GHz TDR Sampling Module
Test Cables & Adapters
QTY Description
2
Samtec RF405-01SP1-01SP1-0305 (DC-20 GHz)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:57
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Appendix E - Frequency and Time Domain Measurements
Frequency (S-Parameter) Domain Procedures
The quality of any data taken with a network analyzer is directly related to the quality of
the calibration standards and the use of proper test procedures. For this reason, extreme care is taken in the design of the through calibration standards, the SI test
boards, and the selection of the PCB vendor.
A coaxial SOLT calibration is performed using a N4433A ECAL module. Then DUT
measurements are performed under SOLT calibration. The measurements include the
effect of test fixture. The measurements of the 2X THRU line standards are required in
order to remove the test fixture effect.
Time Domain Procedures
Mathematically, Frequency Domain data can be transformed to obtain a Time Domain
response. Perfect transformation requires Frequency Domain data from DC to infinity
Hz. Fortunately, a very accurate Time Domain response can be obtained with bandwidth-limited data, such as measured with modern network analyzer.
The Time Domain responses were generated using Agilent ADS 2009 update 1. This
tool has a transient convolution simulator, which can generate a Time Domain response
directly from the measured S-Parameters. An example of a similar methodology is provided in the Samtec Technical Note on domain transformation.
http://www.samtec.com/Technical_Library/reference/articles/pdfs/tech-note_usingPLTS-for-time-domain-data_web.pdf
Propagation Delay (TDT)
The Propagation Delay is a measure of the Time Domain delay through the connector
and footprint. A step pulse is applied to the touchstone model of the connector and the
transmitted voltage is monitored. The same pulse is also applied to a reference channel
with zero loss, and the Time Domain pulses are plotted on the same graph. The difference in time, measured at the 50% point of the step voltage is the propagation delay.
Near-End Crosstalk (TDT) & Far End Crosstalk (TDT)
A step pulse is applied to the touchstone model of the connector and the coupled voltage is monitored. The amplitude of the peak-coupled voltage is recorded and reported
as a percentage of the input pulse.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:58
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Impedance (TDR)
Measurements involving digital pulses are performed using either Time Domain Reflectometer (TDR) or Time Domain Transmission (TDT) methods. The TDR method is used
for the impedance measurements in this report.
The signal line(s) of the SUT’s is energized with a TDR pulse and the far-end of the energized signal line is terminated in the test systems characteristic impedance (e.g.; 50Ω
or 100Ω terminations). By terminating the adjacent signal lines in the test systems characteristic impedance, the effects on the resultant impedance shape of the waveform is
limited. The “best case” signal mapping was tested and is presented in this report.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:59
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved
High Speed Characterization Report
Series: GFZ One Piece Array Series
Description: 1.27 mm pitch Interconnect System, 3 mm Stack Height
Appendix F – Glossary of Terms
ADS – Advanced Design Systems
AFR – Automatic Fixture Removal
BC – Best Case crosstalk configuration
DUT – Device under test, term used for TDA IConnect & Propagation Delay waveforms
FD – Frequency domain
FEXT – Far-End Crosstalk
GSG – Ground–Signal-Ground; geometric configuration
GSSG - Ground–Signal-Signal-Ground; geometric configuration
HDV – High Density Vertical
NEXT – Near-End Crosstalk
OV – Optimal Vertical
OH – Optimal Horizontal
PCB – Printed Circuit Board
PPO – Pin Population Option
SE – Single-Ended
SI – Signal Integrity
SUT – System Under Test
S – Static (independent of PCB ground)
SOLT – acronym used to define Short, Open, Load & Thru Calibration Standards
TD – Time Domain
TDA – Time Domain Analysis
TDR – Time Domain Reflectometry
TDT – Time Domain Transmission
WC – Worst Case crosstalk configuration
Z – Impedance (expressed in ohms)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:60
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 1/9/2015
All Rights Reserved