High Speed Characterization Report HDAM-15-17.0-S-13-2 Mates with HDAF-15-18.0-S-13-2 Description: HDMezz Elevated Array, 1.2mm x 2mm Grid Interconnect 35mm Stack Height Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Table of Contents Connector Overview........................................................................................................ 1 Connector System Speed Rating .................................................................................... 1 Frequency Domain Data Summary ................................................................................. 2 Table 1 - Single-Ended Signaling System Performance .............................................. 2 Table 2 – Differential Pair Signaling System Performance .......................................... 3 Time Domain Data Summary .......................................................................................... 5 Table 3 - Single-Ended Impedance (Ω) – Line B14 (SE1) ........................................... 5 Table 4 - Differential Impedance (Ω) – Pair B14-C14 (DP1) ........................................ 5 Table 5 - Single-Ended Crosstalk (%).......................................................................... 5 Table 6 – Differential Crosstalk (%) ............................................................................. 5 Table 7 - Propagation Delay (Mated Connector) ......................................................... 5 Characterization Details .................................................................................................. 5 Differential and Single-Ended Data.............................................................................. 5 Connector Signal to Ground Ratio ............................................................................... 5 Frequency Domain Data.............................................................................................. 5 Time Domain Data....................................................................................................... 5 Appendix A – Frequency Domain Response Graphs ...................................................... 5 Single-Ended Application – Insertion Loss .................................................................. 5 Single-Ended Application – Return Loss ..................................................................... 5 Single-Ended Application – NEXT ............................................................................... 5 Single-Ended Application – FEXT................................................................................ 5 Differential Application – Insertion Loss....................................................................... 5 Differential Application – Return Loss.......................................................................... 5 Differential Application – NEXT ................................................................................... 5 Differential Application – FEXT .................................................................................... 5 Appendix B – Time Domain Response Graphs............................................................... 5 Single-Ended Application – Input Pulse....................................................................... 5 Single-Ended Application – Impedance ....................................................................... 5 Single-Ended Application – Propagation Delay ........................................................... 5 Single-Ended Application – NEXT, “Worst Case SE 2” Configuration ......................... 5 Single-Ended Application – FEXT, “Worst Case SE 2” Configuration.......................... 5 Single-Ended Application – NEXT, “Best Case SE 1” Configuration ........................... 5 Single-Ended Application – FEXT, “Best Case SE 1” Configuration............................ 5 Single-Ended Application – NEXT, “Worst Case SE 4” Configuration ......................... 5 Single-Ended Application – FEXT, “Worst Case SE 4” Configuration.......................... 5 Single-Ended Application – NEXT, “Best Case SE 3” Configuration ........................... 5 Single-Ended Application – FEXT, “Best Case SE 3” Configuration............................ 5 Differential Application – Input Pulse ........................................................................... 5 Differential Application – Impedance ........................................................................... 5 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:ii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Differential Application – Propagation Delay................................................................ 5 Differential Application – NEXT, “Worst Case DP 2” Configuration ............................. 5 Differential Application – FEXT, “Worst Case DP 2” Configuration.............................. 5 Differential Application – NEXT, “Best Case DP 1” Configuration................................ 5 Differential Application – FEXT, “Best Case DP 1” Configuration ................................ 5 Differential Application – NEXT, “Worst Case DP 3” Configuration ............................. 5 Differential Application – FEXT, “Worst Case DP 3” Configuration.............................. 5 Differential Application – NEXT, “Best Case DP 3” Configuration................................ 5 Differential Application – FEXT, “Best Case DP 3” Configuration ................................ 5 Appendix C – Product and Test System Descriptions ..................................................... 5 Product Description ..................................................................................................... 5 Test System Description.............................................................................................. 5 Single-Ended Characterization Conditions .................................................................. 5 DP 1 & DP 2 Characterization Conditions ................................................................... 5 DP 3 Characterization Conditions................................................................................ 5 HDAX Calibration Board Map ...................................................................................... 5 Appendix D – Test and Measurement Setup................................................................... 5 CSA8000/TDA IConnect Measurements Capability..................................................... 5 Four Position Dual 40 GHz Microprobe Setup............................................................. 5 Test Instruments .......................................................................................................... 5 Measurement Station Accessories .............................................................................. 5 Test Cables & Adapters............................................................................................... 5 Appendix E - Frequency and Time Domain Measurements ............................................ 5 Sample Preparation ..................................................................................................... 5 Frequency (S-Parameter) Domain Procedures ........................................................... 5 CSA8000 Setup ....................................................................................................... 5 Insertion Loss (TDA conversion) .............................................................................. 5 Return Loss (TDA conversion) ................................................................................. 5 Near-End Crosstalk (TDA conversion) ..................................................................... 5 Far-End Crosstalk (TDA conversion) ....................................................................... 5 Time Domain Procedures ............................................................................................ 5 Impedance(TD) ........................................................................................................ 5 Propagation Delay (TD) ........................................................................................... 5 Near-End Crosstalk (TD).......................................................................................... 5 Far-End Crosstalk (TD) ............................................................................................ 5 Appendix F – Glossary of Terms..................................................................................... 5 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:iii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Connector Overview HDAM/HDAF is a 1.2mm x 2mm grid interconnects system for elevated high-speed board-to-board applications. The high density array’s open pin field design allows both single-ended and differential pair routing. The HDAM/HDAF Series is developed with 143, 195, or 299 signal routing selections. The series is available in 20mm, 25mm 30mm, and 35 mm stack heights. This report depicts the hi-speed electrical characteristics specific to a mated 35mm stack height HDAM/HDAF board-to-board test system. Connector System Speed Rating HDAM/HDAF Series, 1.2mm x 2mm (.0472” x .0875”) grid interconnect, 35mm Stack Height Signaling Speed Rating Single-Ended: Differential: 9.0GHz / 18Gbps 9.0GHz / 18Gbps The Speed Rating is based on the -3 dB insertion loss point of the connector system. The -3 dB point can be used to estimate usable system bandwidth in a typical, two-level signaling environment. To calculate the Speed Rating, the measured -3 dB point is rounded up to the nearest half-GHz level. The up-rounding corrects for a portion of the test board’s trace loss, since trace losses are included in the loss data in this report. The resulting loss value is then doubled to determine the approximate maximum data rate in Gigabits per second (Gbps). For example, a connector with a -3 dB point of 7.8 GHz would have a Speed Rating of 8 GHz/ 16 Gbps. A connector with a -3 dB point of 7.2 GHz would have a Speed Rating of 7.5 GHz/15 Gbps. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:1 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Frequency Domain Data Summary Table 1 - Single-Ended Signaling System Performance Test Parameter Insertion Loss Return Loss Near-End Crosstalk Far-End Crosstalk Source port1=HDAM_B14; port2=HDAF_B14 port1=HDAM_B14; port2=HDAF_B14 HDAM_C3 Victim HDAM_D3 ≤ - 8dB to 8.78 GHz HDAM_B14 HDAM_D14 ≤ -20dB to 8.78 GHz HDAM_B14 HDAM_B13 ≤ -18dB to 8.78 GHz HDAM_C3 HDAM_B2 ≤ -18dB to 8.78 GHz -3dB @ 8.78 GHz ≤ -3dB to 8.78 GHz HDAM_C3 HDAF_D3 ≤ -8dB to 8.78 GHz HDAM_B14 HDAF_D14 ≤ -20dB to 8.78 GHz HDAM_B14 HDAF_B13 ≤ -18dB to 8.78 GHz HDAM_C3 HDAF_B2 ≤ -32dB to 8.78 GHz Pin Map (reference Appendix C for full description of test boards) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:2 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Table 2 – Differential Pair Signaling System Performance Test Parameter Insertion Loss Return Loss Near-End Crosstalk Far-End Crosstalk Source port1=HDAM_B14-C14; port2=HDAF_B14-C14 port1=HDAM_B14-C14; port2=HDAF_B14-C14 HDAM_B3-C3 Victim HDAM_D3-E3 ≤ -15dB to 8.86 GHz HDAM_B14-C14 HDAM_E14-F14 ≤ -38dB to 8.86 GHz HDAM_E8-F8 HDAM_E7-F7 ≤ -25dB to 8.86 GHz HDAM_E8-F8 HDAM_B7-C7 ≤ -35dB to 8.86GHz -3dB 8.86 GHz ≤ -5dB to 8.86 GHz HDAM_B3-C3 HDAF_D3-E3 ≤ -22dB to 8.86 GHz HDAM_B14-C14 HDAF_E14-F14 ≤ -38dB to 8.86 GHz HDAM_E8-F8 HDAM_E7-F7 ≤ -25dB to 8.86 GHz HDAM_E8-F8 HDAM_B7-C7 ≤ -30dB to 8.86 GHz Pin Map (reference Appendix C for full description of test boards) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:3 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Bandwidth Chart – Single-Ended & Differential Insertion Loss P C B / C o nnecto r T est System Single-Ended & D ifferential R espo nse 35mm Stack H D A M / H D A F Grid A rray Series 1 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 Single Ended Differential 0 1 2 3 4 5 6 7 8 9 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:4 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Time Domain Data Summary Table 3 - Single-Ended Impedance (Ω) – Line B14 (SE1) Signal Risetime Maximum Impedance Minimum Impedance 35±5ps 50 ps 100 ps 250 ps 500 ps 750 ps 1 ns 67.1 65.6 64.3 62.6 58.8 56.9 55.8 48.1 49.0 49.3 49.9 50.2 50.4 50.5 Single Ended Application Im pedance vs. Risetim e 80 70 maximum 60 minimum 50 40 30 20 35 50 100 250 500 Risetime (pSec) 750 1000 Table 4 - Differential Impedance (Ω) – Pair B14-C14 (DP1) Signal Risetime Maximum Impedance Minimum Impedance 35±5ps 50 ps 100 ps 250 ps 500 ps 750 ps 1 ns 105.5 104.5 104.1 103.2 102.7 102.3 101.9 83.4 90.9 95.0 96.9 97.1 97.2 97.2 Differential Application Im pedance vs. Risetim e 130 120 110 maximum 100 minimum 90 80 70 35 50 100 250 500 750 1000 Risetime (pSec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:5 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Table 5 - Single-Ended Crosstalk (%) Input (tr) NEXT FEXT Source Victim 30±5ps 50 ps 100 ps 250 ps 500 ps 750 ps 1 ns HDAM_C3 D3 16.0 15.4 15.2 14.0 9.8 7.3 5.8 HDAM_B14 D14 1.2 1.0 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% HDAM_B14 B13 4.1 3.6 2.9 2.8 2.0 1.5 1.2 HDAM_C3 B2 2.5 2.2 1.8 1.7 1.2 < 1.0% < 1.0% HDAM_C3 D3 7.5 5.1 4.3 3.8 2.8 2.1 1.7 HDAM_B14 D14 1.2 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% HDAM_B14 B13 4.4 2.9 1.8 1.0 < 1.0% < 1.0% < 1.0% HDAM_C3 B2 2.4 1.7 1.1 < 1.0% < 1.0% < 1.0% < 1.0% Pin Map (reference Appendix C for full description of test boards) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:6 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Table 6 – Differential Crosstalk (%) Input (tr) Source NEXT HDAM B3-C3 HDAM B14-C14 HDAM E8-F8 HDAM E8-F8 FEXT HDAM B3-C3 HDAM B14-C14 HDAM E8-F8 HDAM E8-F8 Victim 30±5ps 50 ps 100 ps 250 ps 500 ps 750 ps 1 ns D3-E3 5.4 5.3 5.2 4.8 3.2 2.4 1.9 E14F14 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% E7-F7 1.2 1.1 1.0 < 1.0% < 1.0% < 1.0% < 1.0% B7-C7 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% D3-E3 1.3 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% E14F14 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% E7-F7 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% B7-C7 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% Pin Map (reference Appendix C for full description of test boards) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:7 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Table 7 - Propagation Delay (Mated Connector) Single-Ended 196ps Differential 197ps Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:8 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Characterization Details This report presents data which characterizes the signal integrity response of a connector pair in a controlled printed circuit board (PCB) environment. All efforts are made to reveal typical best-case responses inherent to the system under test (SUT). In this report, the SUT includes the test PCB from drive side probe tips to receive side probe tips. PCB effects are not removed or de-embedded from test data. PCB designs with impedance mismatch, large losses, skew, cross talk, or similar impairments can have a significant impact on observed test data. Therefore, great design effort is put forth to limit these effects in the PCB utilized in these tests. Some board related effects, such as pad-to-ground capacitance and trace loss, are included in the data presented in this report. But other effects, such as via coupling or stub resonance, are not evaluated here. Such effects are addressed and characterized fully by the Samtec Final Inch® products. Additionally, intermediate test signal connections can mask the connectors’ true performance. Such connection effects are minimized by using high performance test cables, adapters, and microwave probes. Where appropriate, calibration and deembedding routines are also used to reduce residual effects. Differential and Single-Ended Data Most Samtec connectors can be used successfully in both differential and single-ended applications. However, electrical performance will differ depending on the signal drive type. In this report, data is presented for both differential and single-ended drive scenarios. Connector Signal to Ground Ratio Samtec connectors are most often designed for generic applications, and can be implemented using various signal and ground pin assignments. In high speed systems, provisions must be made in the interconnect for signal return currents. Such paths are often referred to as “ground”. In some connectors, a ground plane or blade, or an outer shield is used as the signal return, while in others; connector pins are used as signal returns. Various combinations of signal pins, ground blades, and shields can also be utilized. Electrical performance can vary significantly depending upon the number and location of ground pins. In general, the more pins dedicated to ground, the better electrical performance will be. But dedicating pins to ground reduces signal density of a connector. So care must be taken when choosing signal/ground ratios in cost- or density-sensitive applications. For this connector, the following array configurations are evaluated: Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:9 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height open pin field P# grounded pin field signal aggressor or signal victim pins 1 M L K J I H G F E D C B A X X X X X X 1 2 3 X X X B2 X 2 X D3 C3 X X 3 SE4 SE2 4 X X X X X 4 5 5 6 6 7 7 8 8 9 9 10 10 11 11 12 X X X X X 12 13 14 X X X D14 X X B13 B14 X X 13 14 SE3 15 X X X X X 15 M L K J I H G F E D C B A SE 1 Single-Ended Impedance: • Well-referenced line (reference SE1:1) Single-Ended Crosstalk: • Well-referenced line; mimics 1:1 S:G ratio (reference SE1:1) • 2:1 S:G ratio (reference SE2:1) Only one single-ended signal was driven for crosstalk measurements. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:10 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height 1 M L K J I H G F E D C B A 2 3 4 5 6 7 8 9 10 11 12 X X X X X X 1 X X X E3 X D3 X C3 X B3 X X 2 3 DP 2 X X X X X X 4 5 6 7 8 9 10 11 12 1 2 4 5 6 7 8 9 10 11 12 3 M L K J I H G F E D C B A 1 2 3 4 5 X X X X X X X 6 X X F7 F8 E7 E8 X X C7 C8 B7 B8 X X 7 8 DP3 X X X X X X X 9 13 14 X X X F14 X E14 X X X C14 X B14 X X 13 14 DP 1 13 14 15 X X X X X X X 15 M L K J I H G F E D C B A 15 M L K J I H G F E D C B A 10 11 12 13 14 15 Differential Impedance: • Well-referenced line (reference DP1) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:11 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Differential Crosstalk: • Well-referenced line; mimics 1:1 S:G ratio (reference DP1) • Higher Signal Density (reference DP3) • Full-Column Differential (reference DP2) Only one differential pair was driven for crosstalk measurements. In all cases where a center ground blade is present in the connector it is always grounded to the PCB. Only one single-ended signal or differential pair was driven for crosstalk measurements. Other configurations can be evaluated upon request. Please contact [email protected] for more information. In a real system environment, active signals might be located at the outer edges of the signal contacts of concern, as opposed to the ground signals utilized in laboratory testing. For example, in a single-ended system, a pin-out of “SSSS”, or four adjacent single ended signals, might be encountered, as opposed to the “GSG” and “GSSG” configurations tested in the laboratory. Electrical characteristics in such applications could vary slightly from laboratory results. But in most applications, performance can safely be considered equivalent. Signal Edge Speed (Rise Time): In pulse signaling applications, the perceived performance of the interconnect, can vary significantly depending on the edge rate or rise time of the exciting signal. For this report, the fastest rise time used was 35 +/-5 ps. Generally, this should demonstrate worst case performance. In many systems, the signal edge rate will be significantly slower at the connector than at the driver launch point. To estimate interconnect performance at other edge rates, data is provided for several rise times between 30 ps and 1.0 ns. For this report, measured rise times were at 10%-90% signal levels. Frequency Domain Data Frequency domain parameters are helpful in evaluating the connector system’s signal loss and crosstalk characteristics across a range of sinusoidal frequencies. In this report, parameters presented in the frequency domain are insertion loss, return loss, and near-end and far-end crosstalk. Other parameters or formats, such as VSWR or Sparameters, may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:12 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Frequency performance characteristics for the SUT are generated from time domain measurements using Fourier Transform calculations. Procedures and methods used in generating the SUT’s frequency domain data are provided in the frequency domain test procedures in Appendix E of this report. Time Domain Data Time Domain parameters indicate impedance mismatch versus length, signal propagation time, and crosstalk in a pulsed signal environment. Time Domain data is provided in Appendix E of this report. Parameters or formats not included in this report may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. Reference plane impedance is 50 ohms for single-ended measurements and 100 ohms for differential measurements. The fastest risetime signal exciting the SUT is 35 ± 5 picoseconds. In this report, propagation delay is defined as the signal propagation time through the PCB connector pads and connector pair. It does not include PCB traces. Delay is measured at 35 ± 5 picoseconds signal risetime. Delay is calculated as the difference in time measured between the 50% amplitude levels of the input and output pulses. Crosstalk or coupled noise data is provided for various signal configurations. All measurements are single disturber. Crosstalk is calculated as a ratio of the input line voltage to the coupled line voltage. The input line is sometimes described as the active or drive line. The coupled line is sometimes described as the quiet or victim line. Crosstalk ratio is tabulated in this report as a percentage. Measurements are made at both the nearend and far-end of the SUT. Data for other configurations may be available. Please contact our Signal Integrity Group at [email protected] for further information. As a rule of thumb, 10% crosstalk levels are often used as a general first pass limit for determining acceptable interconnect performance. But modern system crosstalk tolerance can vary greatly. For advice on connector suitability for specific applications, please contact our Signal Integrity Group at [email protected]. Additional information concerning test conditions and procedures is located in the appendices of this report. Further information may be obtained by contacting our Signal Integrity Group at [email protected]. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:13 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Appendix A – Frequency Domain Response Graphs Single-Ended Application – Insertion Loss Configuration: (Port1 = HDAM_B14; Port2 = HDAF_B14) Insertion Loss (dB) PCB/Connector Test System Single Ended Application 35mm Stack HDAM/HDAF Grid Array Series 1 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 Single Ended 0 1 2 3 4 5 6 7 8 9 Frequency (GHz) Single-Ended Application – Return Loss Configuration: (Port1 = HDAM_B14) PCB/Connector Test System Single Ended Application 35mm Stack HDAM/HDAF Grid Array Series Return Loss (dB) 0 -10 -20 -30 Single Ended -40 -50 -60 -70 -80 -90 0 1 2 3 4 5 6 7 8 9 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:14 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Single-Ended Application – NEXT PCB/Connector Test System Single Ended Application 35mm Stack HDAM/HDAF Grid Array Series Near-End Crosstalk (dB) 0 -10 -20 Worst Case SE2 -30 -40 -50 Best Case SE1 -60 Worst Case SE4 -70 -80 Best Case SE3 -90 0 1 2 3 4 5 6 7 8 9 Frequency (GHz) Single-Ended Application – FEXT Far-End Crosstalk (dB) PCB/Connector Test System Single Ended Application 35mm Stack HDAM/HDAF Grid Array Series 0 -10 -20 -30 Worst Case SE2 -40 -50 Best Case SE1 -60 -70 Worst Case SE4 -80 -90 Best Case SE3 0 1 2 3 4 5 6 7 8 9 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:15 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Differential Application – Insertion Loss Configuration: (Port1 = HDAM_B14-C14; Port2 = HDAF_B14-C14) Insertion Loss (dB) PCB/Connector Test System Differential Application 35mm Stack HDAM/HDAF Grid Array Series 1 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 Differential 0 1 2 3 4 5 6 7 8 9 Frequency (GHz) Differential Application – Return Loss Configuration: (Port1 = HDAM_B14-C14) PCB/Connector Test System Differential Application 35mm Stack HDAM/HDAF Grid Array Series 0 Return Loss (dB) -10 -20 -30 -40 -50 Differential -60 -70 -80 -90 0 1 2 3 4 5 6 7 8 9 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:16 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Differential Application – NEXT PCB/Connector Test System Differential Application 35mm Stack HDAM/HDAF Grid Array Series Near-End Crosstalk (dB) 0 -10 Worst Case DP2 -20 -30 Best Case DP1 -40 -50 Worst Case DP3 -60 -70 Best Case DP3 -80 -90 0 1 2 3 4 5 6 7 8 9 Frequency (GHz) Differential Application – FEXT PCB/Connector Test System Differential Application 35mm Stack HDAM/HDAF Grid Array Series Far-End Crosstalk (dB) 0 -10 Worst Case DP2 -20 -30 Best Case DP1 -40 -50 Worst Case DP3 -60 -70 Best Case DP3 -80 -90 0 1 2 3 4 5 6 7 8 9 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:17 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Appendix B – Time Domain Response Graphs Single-Ended Application – Input Pulse Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:18 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Single-Ended Application – Impedance Configuration: (Port1 = HDAM_B14) Single-Ended Application – Propagation Delay Configuration: (Port1 = HDAM_B14; Port2 = HDAF_B14) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:19 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Single-Ended Application – NEXT, “Worst Case SE 2” Configuration Configuration: (Port1 = HDAM_C3; Port3 = HDAM_D3) Single-Ended Application – FEXT, “Worst Case SE 2” Configuration Configuration: (Port1 = HDAM_C3; Port4 = HDAF_D3) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:20 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Single-Ended Application – NEXT, “Best Case SE 1” Configuration Configuration: (Port1 = HDAM_C3; Port3 = HDAM_D14) Single-Ended Application – FEXT, “Best Case SE 1” Configuration Configuration: (Port1 = HDAM_C3; Port4 = HDAF_D14) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:21 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Single-Ended Application – NEXT, “Worst Case SE 4” Configuration Configuration: (Port1 = HDAM_B14; Port3 = HDAM_B13) Single-Ended Application – FEXT, “Worst Case SE 4” Configuration Configuration: (Port1 = HDAM_B14; Port4 = HDAF_B13) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:22 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Single-Ended Application – NEXT, “Best Case SE 3” Configuration Configuration: (Port1 = HDAM_C3; Port3 = HDAM_B2) Single-Ended Application – FEXT, “Best Case SE 3” Configuration Configuration: (Port1 = HDAM_C3; Port4 = HDAF_B2) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:23 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Differential Application – Input Pulse Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:24 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Differential Application – Impedance Configuration: (Port1 = HDAM_B14-C14) Differential Application – Propagation Delay Configuration: (Port1 = HDAM_B14-C14; Port2 = HDAF_B14-C14) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:25 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Differential Application – NEXT, “Worst Case DP 2” Configuration Configuration: (Port1 = HDAM_B3-C3; Port3 = HDAM_D3-E3) Differential Application – FEXT, “Worst Case DP 2” Configuration Configuration: (Port1 = HDAM_B3-C3; Port4 = HDAF_D3-E3) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:26 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Differential Application – NEXT, “Best Case DP 1” Configuration Configuration: (Port1 = HDAM_B14-C14; Port3 = HDAM_E14-F14) Differential Application – FEXT, “Best Case DP 1” Configuration Configuration: (Port1 = HDAM_B14-C14; Port4 = HDAF_E14-F14) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:27 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Differential Application – NEXT, “Worst Case DP 3” Configuration Configuration: (Port1 = HDAM_E8-F8; Port3 = HDAM_E7-F7) Differential Application – FEXT, “Worst Case DP 3” Configuration Configuration: (Port1 = HDAM_E8-F8; Port4 = HDAF_E7-F7) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:28 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Differential Application – NEXT, “Best Case DP 3” Configuration Configuration: (Port1 = HDAM_E8-F8; Port3 = HDAM_B7-C7) Differential Application – FEXT, “Best Case DP 3” Configuration Configuration: (Port1 = HDAM_E8-F8; Port4 = HDAF_B7-C7) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:29 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Appendix C – Product and Test System Descriptions Product Description HDMezz is a high-density array connector designed with open pin fields for differential or single-ended signaling options. The HDAM-15-17.0-S-13-12 /HDAF-15-18.0-S-13-2 mating array design includes 13 signal rows providing 15 signal pins per row. Board-toBoard mating provides a 35mm elevation. Test System Description The test fixtures are composed of a 4-layer FR-4 material with 50Ω and100Ω signal trace and pad configurations designed for the electrical characterization of Samtec hispeed connector products. The fixture pictured is 1 of 3 signaling card conventions required for a full SI characterization. Configuration conventions and the application details are on the following pages. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:30 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Single-Ended Characterization Conditions Fixture Identity PCB-100669-TST-11 REV – HDAM SE TEST BOARD PCB-100669-TST-01 REV – HDAF SE TEST BOARD SE THRU Parameters - Insertion Loss, Return Loss, Propagation Delay, Impedance Configuration: GSG SE 1 HDAM_B14, HDAF_B14 Crosstalk Parameters – TD NEXT, TD NEXT, FD FEXT, Configuration: GAVG, 2:1 SE 2 Near-End HDAM_C3, HDAM_D3 Far-End HDAM_C3, HDAF_D3 Configuration: GAGVG, 1:1 SE 1 Near-End HDAM_B14, HDAM_D14 Far-End HDAM_B14, HDAF_D14 Configuration: GAVG/GAVG, 1:1 SE 4 Near-End HDAM_B14, HDAM_B13 Far-End HDAM_B14, HDAF_B13 Configuration: GAGVG/GAGVG, 2:1 SE 3 Near-End HDAM_C3, HDAM_B2 Far-End HDAM_C3, HDAF_B2 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:31 TD FEXT Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height DP 1 & DP 2 Characterization Conditions Fixture Identity PCB-100669-TST-12 REV – HDAM DIFF TEST BOARD 1 PCB-100669-TST-02 REV – HDAF DIFF TEST BOARD 1 Thru Parameters - Insertion Loss, Return Loss, Propagation Delay, Impedance Configuration: GSSG DP 1 HDAM_B14-C14, HDAF_B14-C14 Crosstalk Parameters – TD NEXT, TD NEXT, Configuration: GAAVVG: DP 2 Near-End HDAM_B3-C3, Far-End HDAM_B3-C3, Configuration: GAAGVVG DP 1 Near-End HDAM_B14-C14, Far-End HDAM_B14-C14, Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:32 FD FEXT, TD FEXT HDAM_D3-E3 HDAF_D3-E3 HDAM_E14-F14 HDAF_E14-F14 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height DP 3 Characterization Conditions Fixture Identity PCB-100669-TST-13 REV – HDAM DIFF TEST BOARD 2 PCB-100669-TST-03 REV – HDAF DIFF TEST BOARD 2 Crosstalk Parameters – TD NEXT, TD NEXT, Configuration: GAAVVG/GAAVVG DP 3 Near-End HDAM_E8-F8, Far-End HDAM_E8-F8, Configuration: GAAGVVG/GAAGVVG DP 3 Near-End HDAM_E8-F8, Far-End HDAM_E8-F8, Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:33 FD FEXT, TD FEXT HDAM_E7-F7 HDAF_E7-F7 HDAM_B7-C7 HDAF_B7-C7 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height HDAX Calibration Board Map Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:34 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Appendix D – Test and Measurement Setup The test instrument is the Tektronix CSA8000 Communication Signal Analyzer Mainframe. Four bays of the CSA8000 are occupied with three Tektronix 80E04 TDR/Sampling Heads and one Tektronix 80E03 Sampling Head. Time domain results are generated using the TDR/Sampling Head capability. S-parameter data is generated from a TDR based software tool called I-Connect Probing is accomplished using a video microscopy system, microprobe positioners, and 40GHz capable probes. The 450 micron pitch probes are located to PCB launch points with 25X to 175X magnification and XYZ fine positioning adjustments available from both the probe table and micro-probe positioners. Electrically the microwave probes rate a < 1.0 dB insertion loss, a ≥18 dB return loss, and an isolation of 38 dB providing high-bandwidth and low parasitic measurement results. Combined, the above technology provides a stable measurement environment along with the electrical accuracies for obtaining precise calibrations and signal launch capabilities CSA8000/TDA IConnect Measurements Capability Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:35 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Four Position Dual 40 GHz Microprobe Setup Test Instruments QTY Description 1 Tektronix CSA8000 Communication Signal Analyzer 3 Tektronix 80E04 Dual Channel 20 GHz TDR Sampling Module 1 Tektronix 80E03 Dual Channel 20 GHz Sampling Module Measurement Station Accessories QTY Description 1 GigaTest Labs Model (GTL3030) Probe Station 4 GTL Micro-Probe Positioners 4 Picoprobe by GGB Ind. Dual Model 40A GSG-GSG (differential applications) 1 Keyence VH-5910 High Resolution Video Microscope 1 Keyence VH-W100 Fixed Magnification Lens 100 X 1 Keyence VH-Z25 Standard Zoom Lens 25X-175X Test Cables & Adapters QTY Description 4 Pasternack Enterprises 2.9mm Semi-Rigid (.086) 9” Cable Assemblies 2 Tektronix 1 Meter Module Extenders Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:36 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Appendix E - Frequency and Time Domain Measurements It is important to note before gathering measurement data that TDA Systems IConnect measurements and CSA8000 measurements are virtually the same measurements with diverse formats. This means that the operator, being extremely aware, can obtain SI time and frequency characteristics in an almost simultaneous fashion. Since IConnect setup procedures are specific to the frequency information sought, it is mandatory that the sample preparation and CSA8000 functional setups be consistent throughout the waveform gathering process. If the operators test equipment permits recall sequencing between the various test parameter setups, it insures IConnect functional setups remain consistent with the TDR/TDT waveforms previously recorded. Related time and frequency test parameter data recorded for this report were gathered simultaneously. Sample Preparation Determine signal launch and monitoring test points by referencing the pin-out maps of interest Single-ended pinout: se Differential parameters: dp in row dp across row Calibration board pcb-100669-tst-20 It is a good practice to terminate all non-active signal lines immediately adjacent to the designated active or quiet signal lines under test. Frequency (S-Parameter) Domain Procedures Frequency data extraction involves a two step process. The first step determines two SUT time domain waveform relationships utilizing a Tektronix CSA8000 time based instrument. The second step involves the conversion of the time based waveforms into frequency domain response format using the TDA Systems IConnect software tool. TDA Systems labels time related conversion waveforms as the Step and DUT waveform references. This section establishes the setup procedures for defining the Step and DUT reference for conversion to frequency s-parameters presented in this report. CSA8000 Setup Listed below is the CSA 8000 functional menu setups used for single-ended and differential frequency response extractions. Both signal types utilize I-Connect software tools to generate S-parameter upper and lower frequency boundaries along with the step frequency. These frequency boundaries are determined by the time domain instruments functional settings such as window length, number of points and averaging capability. Once window length, number of points and averaging functions are set, maintain the Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:37 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height same instrument settings throughout the extraction process. The single channel pulsed source processes s-parameters in single-ended format. A dual channel differential pulsed source processes s-parameters in differential format. Vertical Scale: Offset: Horizontal Scale: Max. Record Length: Averages: Single-Ended Signal 100 mV/ Div: Default / Scroll 1nSec/ Div = 20 MHz step frequency 4000 = Min. Resolution ≥ 128 Differential Signal 100 mV/ Div: Default / Scroll 1nSec/ Div = 20 MHz step frequency 4000 = Min. Resolution ≥ 128 Insertion Loss (TDA conversion) Step Waveform - determine TD waveform by making a TDT transmission measurement that includes all cables, adapters, and probes connected in the test systems transmission path. The transmission path is completed by inserting a negligible length of transmission standard between the system test probes. Calibration or waveform referencing utilizes 3 pads for each probe touchdown (ie; se thru = 6 pads or diff thru = 12 pads). Reference cal board, use standard labeled thru_cal. DUT Waveform - determine waveform by making an active TDT transmission measurement that includes all cables, adapters, and probes connected in the test systems transmission path. Insert the SUT between the probes in place of the transmission THRU_CAL standard and record the measurement. Return Loss (TDA conversion) Step Waveform – determine TD waveform by making an active TDR reflection measurement that includes all cables, adapters, and probes connected in the test systems electrical path up to and including an open standard. Calibration or waveform referencing utilizes 3 pads for each probe touchdown (ie; se reflect = 3 pads or diff reflect = 6 pads). Reference cal board, use standard labeled thru_cal. DUT Waveform – determine waveform by making an active TDR reflection measurement that includes all cables, adapters, and probes connected in the test systems transmission path. Insert the SUT between the probes in place of the THRU_CAL reflection standard and record the measurement. In this condition cables and adapters located at the far-end of the inserted SUT function as the systems 50Ω single-ended and/or 100Ω differential matching impedance. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:38 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Reference se thru, for specified single-ended signal path Reference diff thru, for specified differential signal path Near-End Crosstalk (TDA conversion) Step Waveform – Use Return Loss step waveform. DUT Waveform - determine waveforms by driving specified signal type and monitoring coupled energy levels at the configurations adjacent near-end signal line(s). Far-End Crosstalk (TDA conversion) Step Waveform - Use Insertion Loss step waveform. DUT Waveform - determine waveform by driving specified signal type and monitoring coupled energy levels at the configurations adjacent far-end signal line(s). Reference se 1 thru 4 for all single-ended near-end and far-end crosstalk worst or best case configurations. Reference dp 1 & dp 2 for differential in row near-end and far-end crosstalk worst and best case configurations. Reference dp 3 for differential across row near-end and far-end crosstalk worst and best case configurations. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:39 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Time Domain Procedures Measurements involving digital type pulses are performed utilizing the Time Domain Reflectometer (TDR) or Time Domain Transmission (TDT) methods. For this series of tests, TDR methods are employed for the impedance and propagation delay measurements. Crosstalk measurements utilize TDT methods. The Tektronix 80E04 TDR/ Sampling Head provide both the signaling type and sampling capability necessary to accurately and fully characterize the SUT. Impedance(TD) The signal line(s) of the SUT’s signal configuration are energized with a TDR pulse. The far-end of the energized signal lines are terminated in the test systems characteristic impedance (e.g.; 50Ω or 100Ω termination). Use specified se thru path for SE impedance profile. Use specified differential thru path for DIFF impedance profile. Propagation Delay (TD) This test reports differential or single ended signal delay as the measured difference of propagation between a combined electrical length of the input/output signal pads and traces (35 ± 5 ps edge rate) and the device under test (DUT) plus a referenced electrical length of the signal pads and signal traces (PDpads/traces- PDDUT + PDpads/traces). PDpads/traces is the nomenclature representing the electrical length of PCB signal pads & traces equal to physical lengths of PCB pads & traces entering and leaving the device under test (DUT). The PDDUT + PDpads/traces variable is the mated DUT fixture. Both PDpads/traces & PDDUT + PDpads/traces waveform edgerates are measured and recorded at 50 % amplitude of each recorded rising edge. The distance in time between the rising edges is the propagation delay of the device under test (DUT). Use 1473 mil trace and se thru for single-ended PD measurements. Use 1712 mil trace and differential thru for differential PD measurements. Near-End Crosstalk (TD) Energize the pre-determined signal line(s) with the appropriate signal type. Monitor the configurations adjacent quiet signal line at the near-end for magnitudes of coupled energy. Adjacent signal lines not undergoing testing are terminated in the test systems characteristic impedance. Far-End Crosstalk (TD) Energize the pre-determined signal line(s) with the appropriate signal type. Monitor the configurations adjacent quiet signal line at the far-end for magnitudes of coupled energy. Adjacent signal lines not undergoing testing are terminated in the test systems characteristic impedance. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:40 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Use specified SE 1 & SE 2 configurations for single-ended Worse Case, Best Case, Parallel Across Row and Staggered Across Row near-end and far-end crosstalk measurements. Use specified DP 1 & DP 2 configurations for differential Worse Case, Best Case, nearend and far-end crosstalk measurements. Use specified DP 3 crosstalk configurations for differential parallel across row and staggered across row near-end and far-end crosstalk measurements. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:41 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved High Speed Characterization Report Series: HDAM/HDAF Series (HDMezz) Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height Appendix F – Glossary of Terms TD – Time Domain FD – Frequency domain DUT – Device under test, term used for TDA IConnect & Propagation Delay waveforms EC6 – Edge Card with a .635mm signal pad pitch FEXT – Far-End Crosstalk GSG – Ground–Signal-Ground; geometric configuration GSSG - Ground–Signal-Signal-Ground; geometric configuration LEC6 – Signal Launch Edge Card with a .635 mm signal pad pitch NEXT – Near-End Crosstalk PCB – Printed Circuit Board SE – Single-Ended SI – Signal Integrity SUT – System Under Test TDR – Time Domain Reflectometry TDT – Time Domain Transmission WC – Worst Case crosstalk configuration BC – Best Case crosstalk configuration Z – Impedance (expressed in ohms) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:42 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 6/4/2007 All Rights Reserved