High Speed Characterization Report MEC1-150-02-L-D-A Mated With EC1 Microprobe Signal Launch Edge Card Description: Mini Edge-Card Socket Vertical Surface Mount, 1.0 (.03937”) Pitch Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Table of Contents Connector Overview........................................................................................................ 1 Connector System Speed Rating .................................................................................... 1 Frequency Domain Data Summary ................................................................................. 2 Table 1 - Single-Ended Connector System Performance ............................................ 2 Table 2 - Differential Connector System Bandwidth .................................................... 2 Time Domain Data Summary .......................................................................................... 3 Table 3 - Single-Ended Impedance (Ω) ....................................................................... 3 Table 4 - Differential Impedance (Ω)............................................................................ 3 Table 5 - Single-Ended Crosstalk (%).......................................................................... 4 Table 6 - Differential Crosstalk (%) .............................................................................. 4 Table 7 - Propagation Delay (Mated Connector) ......................................................... 4 Characterization Details .................................................................................................. 5 Differential and Single-Ended Data.............................................................................. 5 Connector Signal to Ground Ratio ............................................................................... 5 Frequency Domain Data.............................................................................................. 7 Time Domain Data....................................................................................................... 7 Appendix A – Frequency Domain Response Graphs ...................................................... 9 Single-Ended Application – Insertion Loss .................................................................. 9 Single-Ended Application – Return Loss ..................................................................... 9 Single-Ended Application – NEXT ............................................................................. 10 Single-Ended Application – FEXT.............................................................................. 10 Differential Application – Insertion Loss..................................................................... 11 Differential Application – Return Loss........................................................................ 11 Differential Application – NEXT ................................................................................. 12 Differential Application – FEXT .................................................................................. 12 Appendix B – Time Domain Response Graphs............................................................. 13 Single-Ended Application – Input Pulse..................................................................... 13 Single-Ended Application – Impedance ..................................................................... 14 Single-Ended Application – Propagation Delay ......................................................... 14 Single-Ended Application – NEXT, “Worst Case in Row” Configuration .................... 15 Single-Ended Application – FEXT, “Worst Case in Row” Configuration .................... 15 Single-Ended Application – NEXT, “Best Case in Row” Configuration ...................... 16 Single-Ended Application – FEXT, “Best Case in Row” Configuration....................... 16 Single-Ended Application – NEXT, “Across Row” Configuration ............................... 17 Single-Ended Application – FEXT, “Across Row” Configuration................................ 17 Differential Application – Input Pulse ......................................................................... 18 Differential Application – Impedance ......................................................................... 19 Differential Application – Propagation Delay.............................................................. 19 Differential Application – NEXT, “Worst Case in Row ” Configuration ....................... 20 Differential Application – FEXT, “Worst Case in Row” Configuration......................... 20 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:ii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Differential Application – NEXT, “Best Case in Row” Configuration........................... 21 Differential Application – FEXT, “Best Case in Row” Configuration ........................... 21 Differential Application – NEXT, “Across Row” Configuration.................................... 22 Differential Application – FEXT, “Across Row” Configuration .................................... 22 Appendix C – Product and Test System Descriptions ................................................... 23 Product Description ................................................................................................... 23 Test System Description............................................................................................ 23 Table 8 – PCB Fixture Characterization & Termination Matrix .................................. 24 Signal Conditioning, Calibration Standards and Signal Launch/Monitoring ............... 25 Appendix D – Test and Measurement Setup................................................................. 28 Test Instruments ........................................................................................................ 29 Measurement Station Accessories ............................................................................ 29 Test Cables & Adapters............................................................................................. 29 Appendix E - Frequency and Time Domain Measurements .......................................... 30 Frequency (S-Parameter) Domain Procedures ......................................................... 30 CSA8000 Setup ..................................................................................................... 30 Insertion Loss......................................................................................................... 31 Return Loss............................................................................................................ 31 Near-End Crosstalk (NEXT) ................................................................................... 32 Far-End Crosstalk (FEXT)...................................................................................... 32 Time Domain Procedures .......................................................................................... 33 Impedance ............................................................................................................. 33 Propagation Delay.................................................................................................. 33 Crosstalk ................................................................................................................ 33 Appendix F – Glossary of Terms................................................................................... 34 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:iii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Connector Overview Mini Edge –Card 1.0mm (.03937”) pitch socket connectors (MEC1 Series) are double row structures with up to 70 contacts per row. The MEC1 connector is available in a vertical, right angle or edge body mount style designed for use with 1.60mm edge-card thicknesses. Applications can include board-to-board or cable-to-board. The electrical characteristics reported are specific to a MEC1 vertical surface mount socket connector mated with to a 1.0mm pitch, 1.60mm (.062”) thickness edge-card. Connector System Speed Rating MEC1 Series, 1.0mm (.03937”) Pitch Socket, Vertical Surface Mount Signaling Speed Rating Single-Ended: Differential: 5.5 GHz / 11 Gbps 6.5 GHz / 13 Gbps The Speed Rating is based on the -3 dB insertion loss point of the connector system. The -3 dB point can be used to estimate usable system bandwidth in a typical, two-level signaling environment. To calculate the Speed Rating, the measured -3 dB point is rounded up to the nearest half-GHz level. The up-rounding corrects for a portion of the test board’s trace loss, since trace losses are included in the loss data in this report. The resulting loss value is then doubled to determine the approximate maximum data rate in Gigabits per second (Gbps). For example, a connector with a -3 dB point of 7.8 GHz would have a Speed Rating of 8 GHz/ 16 Gbps. A connector with a -3 dB point of 7.2 GHz would have a Speed Rating of 7.5 GHz/ 15 Gbps. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:1 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Frequency Domain Data Summary Table 1 - Single-Ended Connector System Performance Test Parameter Configuration Insertion Loss GSG -3dB @ 5.52 GHz Return Loss GSG ≤ -5dB to 5.52 GHz GAQG ≤ -8dB to 5.52 GHz GAGQG ≤ -18dB to 5.52 GHz Xrow, GAG to GQG ≤ -25dB to 5.52 GHz GAQG ≤ -10dB to 5.52 GHz GAGQG ≤ -22dB to 5.52 GHz Xrow, GAG to GQG ≤ -25dB to 5.52 GHz Near-End Crosstalk Far-End Crosstalk Table 2 - Differential Connector System Bandwidth Test Parameter Configuration Insertion Loss GSSG -3dB @ 6.34 GHz Return Loss GSSG ≤ -5dB to 6.34 GHz GAAQQG ≤ -20dB to 6.34 GHz GAAGQQG ≤ -35dB to 6.34 GHz Xrow, GAASSG to GQQG ≤ -32dB to 6.34 GHz GAAQQG ≤ -18dB to 6.34 GHz GAAGQQG ≤ -33dB to 6.34GHz Xrow, GAASS to GQQG ≤ -30dB to 6.34 GHz Near-End Crosstalk Far-End Crosstalk PCB/Connector Test System Single Ended & Differential Signal Response Edgecard PCB-100486-03/MEC1-150-02-L-D-A 1 0 -1 Insertion Loss (dB) -2 -3 -4 Differential -5 Single Ended -6 -7 -8 -9 0 1 2 3 4 5 6 7 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:2 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Time Domain Data Summary Table 3 - Single-Ended Impedance (Ω) Signal Risetime Maximum Impedance Minimum Impedance 30±5ps 50 ps 100 ps 250 ps 500 ps 750 ps 1 ns 56.6 54.3 54.1 52.0 51.9 51.4 51.4 33.2 38.6 44.6 48.9 50.2 50.5 50.7 S ingle E nde d A pplic a t io n Im pe da nc e v s . R is e t im e 70 65 60 maximum 55 minimum 50 45 40 35 30 35 50 100 250 500 Risetime (pSec) 750 1000 Table 4 - Differential Impedance (Ω) Signal Risetime Maximum Impedance Minimum Impedance 30±5ps 50 ps 100 ps 250 ps 500 ps 750 ps 1 ns 108.1 105.8 104.8 104.3 103.9 103.6 103.4 56.9 66.0 76.6 88.4 94.9 97.1 98.3 D if f e re nt ia l A pplic a t io n Im pe da nc e v s . R is e t im e 140 130 120 110 maximum minimum 100 90 80 70 60 50 35 50 100 250 500 750 1000 Risetime (pSec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:3 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Table 5 - Single-Ended Crosstalk (%) Input (tr) GAQG NEXT FEXT 30±5ps 50 ps 100 ps 250 ps 500 ps 750 ps 1 ns 13.9 13.1 11.3 6.4 3.7 2.6 2.0 GAGQG 3.6 2.7 2.3 1.3 < 1.0% < 1.0% < 1.0% Xrowse 1.5 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% GAQG GAGQG Xrowse 7.3 4.0 < 1.0% 5.6 2.9 < 1.0% 3.7 1.8 < 1.0% 1.4 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% Table 6 - Differential Crosstalk (%) Input 30±5ps 50 ps 100 ps 250 ps 500 ps 750 ps 1 ns GAAQQSS 3.9 3.8 2.8 1.7 < 1.0% < 1.0% < 1.0% GAAGQQG < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% 3.2 < 1.0% < 1.0% 3.0 < 1.0% < 1.0% 2.5 < 1.0% < 1.0% 1.6 < 1.0% < 1.0% 1.0 < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% < 1.0% (tr) NEXT Xrow FEXT diff GAAQQSS GAAGQQG Xrowdiff Table 7 - Propagation Delay (Mated Connector) Single-Ended 73ps Differential 73ps Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:4 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Characterization Details This report presents data which characterizes the signal integrity response of a connector pair in a controlled printed circuit board (PCB) environment. All efforts are made to reveal typical best-case responses inherent to the system under test (SUT). In this report, the SUT includes the test PCB from drive side probe tips to receive side probe tips. PCB effects are not removed or de-embedded from the test data. PCB designs with impedance mismatch, large losses, skew, cross talk, or similar impairments can have a significant impact on observed test data. Therefore, great design effort is put forth to limit these effects in the PCB utilized in these tests. Some board related effects, such as pad-to-ground capacitance and trace loss, are included in the data presented in this report. But other effects, such as via coupling or stub resonance, are not evaluated here. Such effects are addressed and characterized fully by the Samtec Final Inch® products. Additionally, intermediate test signal connections can mask the connectors’ true performance. Such connection effects are minimized by using high performance test cables, adapters, and microwave probes. Where appropriate, calibration and deembedding routines are also used to reduce residual effects. Differential and Single-Ended Data Most Samtec connectors can be used successfully in both differential and single-ended applications. However, electrical performance will differ depending on the signal drive type. In this report, data is presented for both differential and single-ended drive scenarios. Connector Signal to Ground Ratio Samtec connectors are most often designed for generic applications, and can be implemented using various signal and ground pin assignments. In high speed systems, provisions must be made in the interconnect for signal return currents. Such paths are often referred to as “ground”. In some connectors, a ground plane or blade, or an outer shield is used as the signal return, while in others; connector pins are used as signal returns. Various combinations of signal pins, ground blades, and shields can also be utilized. Electrical performance can vary significantly depending upon the number and location of ground pins. In general, the more pins dedicated to ground, the better electrical performance will be. But dedicating pins to ground reduces signal density of a connector. So care must be taken when choosing signal/ground ratios in cost- or density-sensitive applications. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:5 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards For this connector, the following configurations were evaluated: Single-Ended Impedance: • GSG (ground-signal-ground) Single-Ended Crosstalk: • Electrical “worst case”: GAQG (ground-active-quiet-ground) • Electrical “best case”: GAGQG (ground-active-ground-quiet-ground) • Across row: Xrowse (from one row of terminals to the other row or across the ground blade when applicable) Differential Impedance: • GSSG (Ground-positive signal-negative signal-ground) Differential Crosstalk: • Electrical “worst case”: GAAQQG (ground-active-active-quiet-quiet-ground) • Electrical “best case”: GAAGQQG (ground-active-active-ground-quiet-quietground) • Across row: Xrowdiff (from one row of terminals to the other row or across the ground blade when applicable) (ground-active-active-static-static-ground) across the row of terminals to (ground-quiet-quiet-ground) In all cases where a center ground blade is present in the connector it is always grounded to the PCB. Only one single-ended signal or differential pair was driven for crosstalk measurements. Other configurations can be evaluated upon request. Please contact [email protected] for more information. In a real system environment, active signals might be located at the outer edges of the signal contacts of concern, as opposed to the ground signals utilized in laboratory testing. For example, in a single-ended system, a pin-out of “SSSS”, or four adjacent single ended signals, might be encountered, as opposed to the “GSG” and “GSSG” configurations tested in the laboratory. Electrical characteristics in such applications could vary slightly from laboratory results. But in most applications, performance can safely be considered equivalent. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:6 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Signal Edge Speed (Rise Time): In pulse signaling applications, the perceived performance of an interconnect can vary significantly depending on the edge rate or rise time of the exciting signal. For this report, the fastest rise time used was 30 +/-5 ps. Generally, this should demonstrate worst case performance. In many systems, the signal edge rate will be significantly slower at the connector than at the driver launch point. To estimate interconnect performance at other edge rates, data is provided for several rise times between 30 ps and 1.0 ns. For this report, rise times were measured at 10%-90% signal levels. Frequency Domain Data Frequency domain parameters are helpful in evaluating the connector system’s signal loss and crosstalk characteristics across a range of sinusoidal frequencies. In this report, parameters presented in the frequency domain are insertion loss, return loss, and near-end and far-end crosstalk. Other parameters or formats, such as VSWR or Sparameters, may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. Frequency performance characteristics for the SUT are generated from time domain measurements using Fourier Transform calculations. Procedures and methods used in generating the SUT’s frequency domain data are provided in the frequency domain test procedures in Appendix E of this report. Time Domain Data Time Domain parameters indicate impedance mismatch versus length, signal propagation time, and crosstalk in a pulsed signal environment. Time Domain data is provided in Appendix E of this report. Parameters or formats not included in this report may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. Reference plane impedance is 50 ohms for single-ended measurements and 100 ohms for differential measurements. The fastest risetime signal exciting the SUT is 30 ± 5 picoseconds. In this report, propagation delay is defined as the signal propagation time through the PCB connector pads and connector pair. It does not include PCB traces. Delay is measured at 30 ± 5 picoseconds signal risetime. Delay is calculated as the difference in time measured between the 50% amplitude levels of the input and output pulses. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:7 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Crosstalk or coupled noise data is provided for various signal configurations. All measurements are single disturber. Crosstalk is calculated as a ratio of the input line voltage to the coupled line voltage. The input line is sometimes described as the active or drive line. The coupled line is sometimes described as the quiet or victim line. Crosstalk ratio is tabulated in this report as a percentage. Measurements are made at both the nearend and far-end of the SUT. Data for other configurations may be available. Please contact our Signal Integrity Group at [email protected] for further information. As a rule of thumb, 10% crosstalk levels are often used as a general first pass limit for determining acceptable interconnect performance. But modern system crosstalk tolerance can vary greatly. For advice on connector suitability for specific applications, please contact our Signal Integrity Group at [email protected]. Additional information concerning test conditions and procedures is located in the appendices of this report. Further information may be obtained by contacting our Signal Integrity Group at [email protected]. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:8 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Appendix A – Frequency Domain Response Graphs Single-Ended Application – Insertion Loss PCB/Connector Test System Single Ended Application Edgecard PCB-100486-03/MEC1-150-02-L-D-A 1 0 -1 Insertion Loss (dB) -2 -3 -4 Single Ended -5 -6 -7 -8 -9 0 1 2 3 4 5 6 7 Frequency (GHz) Single-Ended Application – Return Loss PCB/Connector Test System Single Ended Application Edgecard PCB-100486-03/MEC1-150-02-L-D-A 0 -10 -20 Return Loss (dB) -30 -40 -50 Single Ended -60 -70 -80 -90 0 1 2 3 4 5 6 7 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:9 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Single-Ended Application – NEXT PCB/Connector Test System Single Ended Application Edgecard PCB-100486-03/MEC1-150-02-L-D-A 0 -10 Near-End Crosstalk (dB) -20 -30 -40 Best Case Worst Case -50 ACROSS ROW -60 -70 -80 -90 0 1 2 3 4 5 6 7 Frequency (GHz) Single-Ended Application – FEXT PCB/Connector Test System Single Ended Application Edgecard PCB-100486-03/MEC1-150-02-L-D-A 0 -10 Far-End Crosstalk (dB) -20 -30 -40 Best Case Worst Case -50 ACROSS ROW -60 -70 -80 -90 0 1 2 3 4 5 6 7 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:10 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Differential Application – Insertion Loss PCB/Connector Test System Differential Application Edgecard PCB-100486-03/MEC1-150-02-L-D-A 1 0 -1 Insertion Loss (dB) -2 -3 -4 Differential -5 -6 -7 -8 -9 0 1 2 3 4 5 6 7 Frequency (GHz) Differential Application – Return Loss PCB/Connector Test System Differential Application Edgecard PCB-100486-03/MEC1-150-02-L-D-A 0 -10 -20 Return Loss (dB) -30 -40 -50 Differential -60 -70 -80 -90 0 1 2 3 4 5 6 7 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:11 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Differential Application – NEXT PCB/Connector Test System Differential Application Edgecard PCB-100486-03/MEC1-150-02-L-D-A 0 -10 Near-End Crosstalk (dB) -20 -30 -40 Best Case Worst Case -50 ACROSS ROW -60 -70 -80 -90 0 1 2 3 4 5 6 7 Frequency (GHz) Differential Application – FEXT PCB/Connector Test System Differential Application Edgecard PCB-100486-03/MEC1-150-02-L-D-A 0 -10 Far-End Crosstalk (dB) -20 -30 -40 Best Case Worst Case -50 ACROSS ROW -60 -70 -80 -90 0 1 2 3 4 5 6 7 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:12 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Appendix B – Time Domain Response Graphs Single-Ended Application – Input Pulse Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:13 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Single-Ended Application – Impedance Single-Ended Application – Propagation Delay Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:14 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Single-Ended Application – NEXT, “Worst Case in Row” Configuration Single-Ended Application – FEXT, “Worst Case in Row” Configuration Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:15 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Single-Ended Application – NEXT, “Best Case in Row” Configuration Single-Ended Application – FEXT, “Best Case in Row” Configuration Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:16 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Single-Ended Application – NEXT, “Across Row” Configuration Single-Ended Application – FEXT, “Across Row” Configuration Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:17 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Differential Application – Input Pulse Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:18 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Differential Application – Impedance Differential Application – Propagation Delay Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:19 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Differential Application – NEXT, “Worst Case in Row” Configuration Differential Application – FEXT, “Worst Case in Row” Configuration Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:20 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Differential Application – NEXT, “Best Case in Row” Configuration Differential Application – FEXT, “Best Case in Row” Configuration Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:21 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Differential Application – NEXT, “Across Row” Configuration Differential Application – FEXT, “Across Row” Configuration Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:22 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Appendix C – Product and Test System Descriptions Product Description Product samples are the vertical surface mount MEC1-150-02-L-D-A. The connector structure consists of two banks of double rows, housing 29 pins per row in one bank and 20 pins per row in the second bank. The mating edge card is a dedicated dual signal configuration microprobe launch and is referred to as an 1mm pitch edge card (EC1). Test System Description The test fixtures are composed of a 4-layer FR-4 material with 50Ω and100Ω signal trace and pad configurations designed for the electrical characterization of Samtec hispeed connector products. The pictured fixtures are specific to the MEC1-DV surface mount series connector and EC1 dual configuration signal launch test card fixture. Fixture connector cards are identified by Samtec P/N PCB-100486-TST-01 and P/N PCB100486-TST-02 (Figure 1). The EC8 dual configuration signal card is identified by P/N PCB-100486-TST-03 Figure 1 Connector Card Fixtures PCB-100486-TST-01 (Lt.), PCB-100486-TST-02 (Rt.) + EC8 Dual Configuration Signal Launch Card PCB-100486-TST-03 PCB-100486-TST-02 and PCB-100486-TST-03 (Figure1, Rt.) combination characterizes impedance, propagation delay, best case crosstalk and across row crosstalk for single ended and differential signal types. The PCB-100486-TST-01 and PCB-100486TST-03 (Figure 1 Lt.) combination characterizes worse case crosstalk for single ended Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:23 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards and differential signal types only. Signal paths are identified by a “J” number identifier which represents terminal positions within the connector. Signals are launched from the edge card (EC1) side of the mated fixture. Data and waveforms presented in this report are results from the edge card signal launch. Table 8 below identifies the launch, monitoring and adjacent line termination points used in generating characterization data for this report. Table 8 – PCB Fixture Characterization & Termination Matrix Single Ended Launch USE PCB IL, RL Z, PD TST-03 Monitor TST-02 Differential 50Ω to Gnd. Termination TST-02 TST-03 Launch Monitor TST-03 TST-02 100Ω across Sig. Pair Termination TST-02 TST-03 J_66 J_70 J_65 J65 J70 J12-10 J10-12 J11_09 J16_18 J11-09 J18-16 TST-03 TST-01 TST-03 TST-03 TST-01 TST-03 TST-03 J-78 J-80 J__78 J__80 J_14-12 J-18-16 J12-14 J_16-18 TST-03 TST-03 TST-02 TST-03 TST-03 TST-02 TST-02 TST-03 NEXT(best) J66 J_70 J_65 J_66 J_70 J65 J12-10 J18_16 J10-12 J16_18 J11-09 J11-09 NEXT(xrow) J66 J65 J_65 J_66 J_70 J70 J12-10 J11-09 J10-12 J16_18 J11-09 J18-16 TST-03 TST-01 TST-01 TST-03 TST-03 TST-01 TST-01 TST-03 J-78 J__80 J__78 J-80 J_14-12 J_16-18 J12-14 J_16-18 J-16-18 TST-03 TST-02 TST-02 TST-03 TST-03 TST-02 TST-02 TST-03 FEXT(best) J66 J_70 J_66 J_65 J65 J70 J12-10 J16_18 J11-09 J10-12 J11-09 J18-16 FEXT(xrow) J66 J_65 J_66 J_70 J65 J70 J12-10 J11_09 J10-12 J16_18 J11-09 J18-16 USE PCB NEXT(worst) USE PCB USE PCB FEXT(worst) USE PCB J66 TST-03 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:24 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Signal Conditioning, Calibration Standards and Signal Launch/Monitoring Figure 2, represents the layout of the dual configuration edge card. Figures 3 & 4 are the mating connector card layouts for the dual edge card configuration. In general GSG and GSSG conditions are spelled out in the characterization details section of this report. Graphics depict actual test layout conditions, calibration standards, and reference traces utilized in characterizing the electrical performance of MEC8 connector/edge card application. Figure 2 EC1 Dual Configuration Signal Launch Card PCB-100486-TST-03 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:25 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Figure 3 Connector Card PCB-100486-TST-01 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:26 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Figure 4 Connector Card PCB-100486-TST-02 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:27 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Appendix D – Test and Measurement Setup The test instrument is the Tektronix CSA8000 Communication Signal Analyzer Mainframe. Four bays of the CSA8000 are occupied with three Tektronix 80E04 TDR/Sampling Heads and one Tektronix 80E03 Sampling Head. Time domain results are generated using the TDR/Sampling Head capability. S-parameter data is generated from a TDR based software tool called I-Connect Probing is accomplished using a video microscopy system, microprobe positioners, and 40GHz capable probes (Figure 5). The 450 micron pitch probes are located to PCB launch points with 25X to 175X magnification and XYZ fine positioning adjustments available from both the probe table and micro-probe positioners. Electrically the microwave probes rate a < 1.0 dB insertion loss, a ≥18 dB return loss, and an isolation of 38 dB providing high-bandwidth and low parasitic measurement results. Combined, the above technology provides a stable measurement environment along with the electrical accuracies for obtaining precise calibrations and signal launch capabilities (Figure 6). Figure 5 Measurement Station Micro-Probing Capability Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:28 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Figure 6 Dual 40 GHz Microprobes – Right Angle Orientation Test Instruments QTY Description 1 Tektronix CSA8000 Communication Signal Analyzer 3 Tektronix 80E04 Dual Channel 20 GHz TDR Sampling Module 1 Tektronix 80E03 Dual Channel 20 GHz Sampling Module Measurement Station Accessories QTY Description 1 GigaTest Labs Model (GTL3030) Probe Station 4 GTL Micro-Probe Positioners 2 Picoprobe by GGB Ind. Model 40A GSG (single ended applications) 2 Picoprobe by GGB Ind. Dual Model 40A GSG-GSG (differential applications) 1 Keyence VH-5910 High Resolution Video Microscope 1 Keyence VH-W100 Fixed Magnification Lens 100 X 1 Keyence VH-Z25 Standard Zoom Lens 25X-175X Test Cables & Adapters QTY Description 4 Pasternack Enterprises 2.9mm Semi-Rigid (.086) 6” Cable Assemblies 2 Tektronix 1 Meter Module Extenders Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:29 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Appendix E - Frequency and Time Domain Measurements It is important to note before gathering measurement data that TDA Systems IConnect measurements and CSA8000 measurements are virtually the same measurements with diverse formats. This means that the operator, being extremely aware, can obtain SI time and frequency characteristics in an almost simultaneous fashion. Since IConnect setup procedures are specific to the frequency information sought, it is mandatory that the sample preparation and CSA8000 functional setups be consistent throughout the waveform gathering process. If the operators test equipment permits recall sequencing between the various test parameter setups, it insures IConnect functional setups remain consistent with the TDR/TDT waveforms previously recorded. Related time and frequency test parameter data recorded for this report were gathered simultaneously. Frequency (S-Parameter) Domain Procedures Frequency data extraction involves two steps that first measure the frequency related time domain waveform followed by post-processing of the time domain waveforms into loss and crosstalk response parameters versus frequency. The first step utilizes the Tektronix CSA8000 time based instrument to capture frequency related single-ended or differential signal types propagating through an appropriately prepared SUT. The second step involves a correlation of the time based waveforms using the TDA Systems IConnect software tool to post-process these waveforms into frequency response parameters. TDA Systems labels these frequency related waveform relationships as the Step and DUT reference. This report establishes the setup procedures for defining the Step and DUT reference for frequency parameters of interest. Once established, the Step and DUT references are post-processed in IConnect’s S-parameter computations window. CSA8000 Setup Listed below are the CSA 8000 functional menu setups used for single-ended and differential frequency response extractions. Both signal types utilize I-Connect software tools to generate S-parameter upper and lower frequency boundaries along with the step frequency. These frequency boundaries are determined by a time domain instruments functional settings such as window length, number of points and averaging capability. Once window length, number of points and averaging functions are set, maintain the same instrument settings throughout the extraction process. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:30 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Vertical Scale: Offset: Horizontal Scale: Max. Record Length: Averages: Single-Ended Signal 100 mV/ Div: Default / Scroll 1nSec/ Div = 20 MHz step frequency 4000 = Min. Resolution ≥ 128 Differential Signal 100 mV/ Div: Default / Scroll 1nSec/ Div = 20 MHz step frequency 4000 = Min. Resolution ≥ 128 Insertion Loss SUT Preparation - For signal launch and monitoring path guidelines reference table 8. Terminate all the suggested active or adjacent signal lines at the impedance values recommended in the table. Signal trace locations and configurations can be verified using figures 2 & 3. Step Reference - Establish waveform by making a TDT transmission measurement that includes all cables, adapters, and probes connected in the test systems transmission path. The transmission path is completed by inserting a negligible length of transmission standard between the microwave probes. (Note: To characterize transmission or reflection references employ the FOR DIFF CALIBRATION standard pictured in Figure 3). DUT Reference - Establish waveforms by making an active TDT transmission measurement that includes all cables, adapters, and probes connected in the test systems transmission path. Insert the SUT between the probes in place of the transmission standard and record the measurement. Return Loss SUT Preparation – For signal launch and monitoring path guidelines reference table 8. Terminate all the suggested active or adjacent signal lines at the impedance values recommended in the table. Signal trace locations and configurations can be verified using figures 2 & 3 Step Reference – Establish waveform by making an active TDR reflection measurement that includes all cables, adapters, and probes connected in the test systems electrical path up to and including an open standard. (Note: To characterize transmission or reflection references employ the FOR DIFF CALIBRATION standard pictured in Figure 3). DUT Reference – Retain same signal paths and test setup used in obtaining insertion loss waveforms. Establish these waveforms by making a TDT (matched) reflection measurement that includes all cables, adapters, and probes connected in the test systems transmission path. For this condition the quality cables and adapters located on Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:31 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards the far-end of the inserted SUT serves as the resistive load impedance closely matching the test system input impedance of 50Ω single-ended and/or 100Ω differential. Near-End Crosstalk (NEXT) SUT Preparation – For signal launch and monitoring path guidelines reference table 8. Terminate all the suggested active or adjacent signal lines at the impedance values recommended in the table. Worse case crosstalk signal trace location and configuration can be verified using figures 2 & 3. Use figures 2 & 4 to identify best case and across row crosstalk signal traces. Step Reference - Establish waveforms by making an active measurement that includes all cables, adapters, and probes connected in the test systems electrical path up to and including an open standard (Note: To characterize transmission or reflection references employ the FOR DIFF CALIBRATION standard pictured in Figure 3). DUT Reference - Establish waveforms by driving the suggested signal line and monitoring the TDR coupled energy at the adjacent near-end signal line. Establish {6} measurement waveforms of worst case, best case and across row (xrow) coupling conditions for both signal types. Far-End Crosstalk (FEXT) SUT Preparation - For signal launch and monitoring path guidelines reference table 8. Terminate all the suggested active or adjacent signal lines at the impedance values recommended in the table. Worse case crosstalk signal trace location and configuration can be verified using figures 2 & 3. Use figures 2 & 4 to identify best case and across row crosstalk signal traces. Step Reference - Establish waveforms by making a TDT transmission measurement that includes all cables, adapters, and probes connected in the test systems transmission path. The transmission path is completed by inserting a negligible length of transmission standard (Note: To characterize transmission or reflection references employ the FOR DIFF CALIBRATION standard pictured in Figure 3). DUT Reference - Establish waveforms by driving the suggested signal line and monitoring the TDR coupled energy at the adjacent near-end signal line. Establish {6} measurement waveforms of worst case, best case and across row (xrow) coupling conditions for both signal types. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:32 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Time Domain Procedures Measurements involving digital type pulses are performed utilizing either Time Domain Reflectometer (TDR) or Time Domain Transmission (TDT) methods. For this series of tests, TDR methods are employed for the impedance and propagation delay measurements. Crosstalk measurements utilize TDT methods. The Tektronix 80E04 TDR/ Sampling Head provide both the signaling type and sampling capability necessary to accurately and fully characterize the SUT. Impedance The signal line(s) of the SUT’s signal configuration is energized with a TDR pulse. The far-end of the energized signal line is terminated in the test systems characteristic impedance (e.g.; 50Ω or 100Ω terminations). By terminating the adjacent signal lines in the test systems characteristic impedance, the effects on the resultant impedance shape of the waveform is limited. For signal launch and monitoring path guidelines reference table 8. Propagation Delay This test reports differential or single ended signal delay as the measured difference of propagation between a referenced length of the signal pads and signal traces (30 ± 5 ps edge rate) and the device under test (DUT) plus the electrical length of the signal pads and signal traces (PDpads/traces- PDDUT + PDpads/traces). PDpads/traces is the referenced physical length of PCB signal pads & traces equaling the PCB pads & traces entering and leaving the device under test (DUT). These measurable reference lengths (i.e.; SE_THRU1 to SE THRU2 & DIFF_THRU1 to DIFF_THRU2) are featured on PCB100486-TST-01 in Figure 3. The PDDUT + PDpads/traces variable is the mated MEC8 vertical surface mount connector card with pads & traces plus the edge card with pads & signal traces. Both PDpads/traces & PDDUT + PDpads/traces waveform edgerates are measured and recorded at 50 % amplitude of each recorded rising edge. The distance in time between the rising edges is the propagation delay of the device under test. In this case the propagation delay is that of the MEC1connector (PDDUT). For signal launch and monitoring path guidelines reference table 8. Crosstalk An active pulsed waveform is transmitted through a selected SUT signal line. The adjacent quiet signal lines are monitored for the coupled energy at the near-end and far-end. Active and quiet lines not being monitored are terminated in the test systems characteristic impedance. Signal lines adjacent to the quiet lines remain terminated on both ends throughout the test sequence. Failing to terminate the active near or far end, quiet lines, or in some cases, signal lines adjacent to the quiet line may have an effect on amplitude and shape of the coupled energy. Measure the worse and best case in row coupling scenarios. Also measure the direct coupling effects that occur across a row of terminals. For signal launch and monitoring path guidelines reference table 8. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:33 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved High Speed Characterization Report Series: MEC1 Series Description: Vertical Surface Mount, 1.0mm (.03937”) Pitch, Mates w/ 1.60mm (.062”) cards Appendix F – Glossary of Terms BC – Best Case crosstalk configuration DP – Differential Pair signal configuration DUT – Device under test, term used for TDA IConnect & Propagation Delay waveforms EC1 – Edge Card with a 1.0mm pitch between signal terminal pads FEXT – Far-End Crosstalk GSG – Ground–Signal-Ground; geometric configuration LEC8 – Signal Launch Edge Card with a .8mm signal pad pitch NEXT – Near-End Crosstalk PCB – Printed Circuit Board SE – Single-Ended SI – Signal Integrity SUT – System under test TDR – Time Domain Reflectometry TDT – Time Domain Transmission WC – Worst Case crosstalk configuration Xrowse – Cross ground/ power bar crosstalk, single-ended signal Xrowdiff – Cross ground/ power bar crosstalk, differential signal Z – Impedance (expressed in ohms) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:34 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 8/28/2006 All Rights Reserved